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AMD XC3S1200E-4FTG256C
- Part No.:
- XC3S1200E-4FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S1200E-4FTG256C.pdf
- Description:
- IC FPGA 190 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,860
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Product details
Overview
XC3S1200E-4FTG256C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,191,488 system gates, 1200 logic cells, and 221 I/O pins in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package. It operates at -4 speed grade (4.4 ns CLB delay), supports 3.3V/2.5V/1.2V dual-supply operation, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S1200E-4FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade timing closure, dual-voltage bank support, configuration mode compatibility (Master Serial, Slave SelectMAP), and JTAG boundary-scan capability.
Technical Context
The XC3S1200E-4FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (288 Kbits), and dedicated multipliers (12 × 18-bit). It uses SRAM-based configuration with external SPI PROM or parallel slave mode loading.
It supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards across 12 I/O banks, each independently configurable for voltage (1.2V–3.3V) and termination. Configuration occurs via JTAG, Master Serial, or Slave SelectMAP modes with CRC error checking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,200 - Base unit for implementing combinational and sequential logic functions |
| System Gates | 1,191,488 - Approximate ASIC gate-equivalent capacity for logic density estimation |
| I/O Pins | 221 - User-accessible bidirectional signal terminals with per-bank voltage assignment |
| Block RAM | 288 Kbits - Dedicated memory blocks for FIFOs, buffers, or lookup tables without consuming logic resources |
| Speed Grade | -4 - Specifies worst-case CLB propagation delay of 4.4 ns and maximum clock frequency of 325 MHz for internal routing |
| Configuration Mode | Master Serial / Slave SelectMAP / JTAG - Determines boot source and programming interface flexibility |
| Supply Voltages | VCCINT = 1.2V, VCCO = 1.2V–3.3V - Dual-supply architecture enabling mixed-voltage I/O interfacing |
Pinout & Package
XC3S1200E-4FTG256C is housed in a 256-pin Fine-Pitch Thin Ball Grid Array (FTBGA) package measuring 17 mm × 17 mm with 1.0 mm ball pitch. The package supports reflow soldering and provides thermal and electrical performance suitable for industrial temperature range operation (0°C to 85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2V core supply input for FPGA logic and interconnect |
| A1 | VCCO_0 | 1.2V–3.3V I/O supply for Bank 0 (pins A1–D12) |
| T1 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload |
| R2 | INIT_B | Open-drain status output indicating configuration completion or failure |
| P3 | CCLK | Configuration clock input during Master Serial mode; driven by FPGA during Slave modes |
| T3 | DIN | Serial data input for Master Serial configuration from external PROM |
| U1 | TCK | JTAG test clock input for IEEE 1149.1 boundary-scan and programming |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated 12×18 Multipliers | Four hardwired arithmetic units enabling efficient DSP filtering and math-intensive logic without LUT resource overhead |
| SelectIO Technology | Per-bank I/O voltage and standard configurability supporting interoperability with legacy and modern peripherals |
| MultiBoot Support | Up to four independent configuration bitstreams stored in external PROM for field-upgradable firmware and fail-safe recovery |
| DCI (Digitally Controlled Impedance) | On-die series termination calibration eliminating external resistors for improved signal integrity on high-speed traces |
| ISE Design Suite Compatibility | Full synthesis, place-and-route, and simulation support using Xilinx ISE 14.7 toolchain with verified device constraints |
Applications
| Industrial PLC I/O Expansion | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Adding isolated digital input/output channels to programmable logic controllers using modular backplane interfaces. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and glue logic between microcontroller bus and opto-isolated I/O drivers. Use Value: Enables flexible pin-mapping and real-time response (<1 µs latency) while reducing BOM count versus ASIC solutions. | Use Scenario: Implementing ISO 9141-2 and UDS-compatible diagnostic gateways in vehicle service tools. IC Role / Device Role / Timing Role: FPGA handles physical layer timing, protocol framing, and multiplexing between CAN and UART interfaces. Use Value: Supports concurrent multi-protocol decoding with deterministic timing margins verified per ISO 16845 test requirements. |
| Medical Imaging Data Bridge | Test Equipment Pattern Generator |
Use Scenario: Converting parallel CMOS image sensor outputs to serialized LVDS streams for high-speed camera modules. IC Role / Device Role / Timing Role: FPGA performs clock domain crossing, pixel packing, and serialization using built-in DDR I/O and PLLs. Use Value: Achieves 800 Mbps pixel throughput with sub-cycle jitter control, meeting MIPI CSI-2 timing budgets. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: FPGA serves as deterministic pattern engine with precise edge placement controlled by internal DCMs. Use Value: Delivers 100+ MHz vector rates with <150 ps channel-to-channel skew across 32 I/O pins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FTG256C | 1,000 logic cells, 232 Kbits block RAM, identical package and pinout | Slightly lower gate count limits complex state machines and larger FIFO depth | Preferred when design fits within reduced resource budget and cost sensitivity outweighs headroom needs |
| XC3S1600E-4FTG256C | 1,600 logic cells, 360 Kbits block RAM, same package footprint and voltage support | Higher density enables integration of additional peripherals or larger embedded processor subsystems | Chosen when future scalability, added IP cores, or expanded I/O buffering are required |
Compared with XC3S1200E-4FTG256C, the XC3S1000-4FTG256C offers tighter cost control at minor resource trade-offs, while the XC3S1600E-4FTG256C provides measurable headroom for feature expansion without PCB redesign-both share identical thermal, mechanical, and configuration interface behavior.
Availability
XC3S1200E-4FTG256C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, medical imaging, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC3S1200E-4FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-optimized, high-volume embedded applications.
The Spartan-3E family was designed specifically for high-gate-count, low-cost programmable logic in space-constrained industrial and communications systems where power efficiency and I/O flexibility are critical.
FAQ
What is the operating temperature range for XC3S1200E-4FTG256C?
The XC3S1200E-4FTG256C is rated for commercial and industrial temperature ranges. The 'C' suffix indicates an operating junction temperature range of 0°C to 85°C, validated under full I/O loading and worst-case voltage conditions per Xilinx DS312 specification.
Does XC3S1200E-4FTG256C support JTAG boundary-scan testing?
Yes, XC3S1200E-4FTG256C fully complies with IEEE 1149.1 (JTAG) standards. It includes dedicated TCK, TMS, TDI, TDO, and TRST pins, enabling in-circuit programming, configuration verification, and interconnect testing without requiring external test fixtures.
Can XC3S1200E-4FTG256C be configured using a serial PROM?
Yes, XC3S1200E-4FTG256C supports Master Serial configuration mode. When PROGRAM_B is asserted, the FPGA drives CCLK and reads configuration data from a standard x8/x16 SPI PROM connected to DIN, with automatic CRC checking and INIT_B assertion on error.
What I/O standards are supported by XC3S1200E-4FTG256C?
XC3S1200E-4FTG256C supports LVCMOS, LVTTL, PCI, HSTL Class I/II, and SSTL2 Class I/II across its 12 independently powered I/O banks. Each bank can be set to 1.2V, 1.5V, 1.8V, 2.5V, or 3.3V, enabling direct interfacing with diverse peripheral families.
Is XC3S1200E-4FTG256C compatible with Xilinx ISE 14.7?
Yes, XC3S1200E-4FTG256C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, MAP, PAR, bitstream generation, and timing analysis. Device-specific constraints files and simulation models are included in the ISE installation.
XC3S1200E-4FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 190
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S1200E-4FTG256C FAQ
1.How can I place an order for XC3S1200E-4FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-4FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-4FTG256C reliable?
The price and inventory of XC3S1200E-4FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-4FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S1200E-4FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-4FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1200E-4FTG256C?
XC3S1200E-4FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-4FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-4FTG256C?
For technical support, including XC3S1200E-4FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-4FTG256C requirements.
6.How does Aetrix verify that XC3S1200E-4FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-4FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-4FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S1200E-4FTG256C?
All XC3S1200E-4FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-4FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-4FTG256C part is unused and in its original packaging.
Return procedure for XC3S1200E-4FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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