AMD XC3S1200E-5FG400C
- Part No.:
- XC3S1200E-5FG400C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S1200E-5FG400C.pdf
- Description:
- IC FPGA 304 I/O 400FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC3S1200E-5FG400C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,191,488 system gates, 22,176 logic cells, and 500 Kbits of block RAM. It features 376 user I/Os, operates at -5 speed grade (equivalent to 525 MHz internal clock), and is packaged in a 400-pin Fine-Pitch Ball Grid Array (FBGA). It is used in industrial control logic and reconfigurable digital signal processing subsystems.
For engineers reviewing the XC3S1200E-5FG400C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count, block RAM depth, speed grade timing closure, and FBGA400 thermal-mechanical compatibility with existing PCB layouts.
Technical Context
The XC3S1200E-5FG400C implements a hierarchical CLB-based architecture with dedicated carry logic and distributed RAM. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable slew rate and drive strength per bank.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) for phase shifting, duty cycle correction, and frequency synthesis up to 320 MHz output.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 22,176 - determines maximum combinational/sequential logic capacity for RTL implementation |
| System Gates | 1,191,488 - industry-standard metric for relative logic density vs. ASIC equivalents |
| Block RAM | 500 Kbits - supports dual-port FIFOs, coefficient storage, or local data buffers without external memory |
| User I/O Pins | 376 - enables high-channel-count interface bridging (e.g., parallel ADC/DAC, video bus) |
| Speed Grade | -5 - guarantees timing closure up to 525 MHz internal clock frequency under worst-case conditions |
| DCM Outputs | 2 × DCM - provides jitter-tolerant clock synthesis and phase alignment for multi-clock domain designs |
Pinout & Package
XC3S1200E-5FG400C is housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) solder balls. Thermal pad on underside requires exposed copper thermal land for conduction cooling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master Serial mode; must be driven by external oscillator or microcontroller |
| DIN | Configuration Data Input | Serial data input for bitstream loading; synchronous to CCLK rising edge |
| PROG_B | Program Initiate | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration Status Output | Open-drain output indicating configuration status; low during initialization or CRC error |
| PROGRAM_B | Configuration Reset | Same function as PROG_B; pin name variant per Xilinx documentation revision |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | 4 × 18-bit × 18-bit signed multipliers enable real-time FIR filter or FFT engine implementation |
| SelectIO Technology | Per-bank voltage support (1.2V–3.3V) allows mixed-voltage interfacing without level shifters |
| Digital Clock Manager (DCM) | Two independent DCMs provide deterministic clock deskew and frequency multiplication/division |
| Embedded Block RAM | 20 × 18-Kbit blocks support true dual-port operation for simultaneous read/write access |
| JTAG Boundary Scan | IEEE 1149.1-compliant test access port enables in-system programming and board-level diagnostics |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo positioning with encoder feedback and PWM motor drive generation. IC Role / Device Role / Timing Role: FPGA fabric implements PID controller, quadrature decoder, and 16-channel PWM generator with sub-microsecond timing resolution. Use Value: 376 I/Os accommodate encoder inputs, analog sensor interfaces, and isolated gate drivers; DCMs synchronize motion profiles across axes. | Use Scenario: Converting parallel RGB/YUV video streams from image sensors to MIPI CSI-2 serial output for SoC ingestion. IC Role / Device Role / Timing Role: Reconfigurable video pipeline handles pixel clock domain crossing, color space conversion, and packetization logic. Use Value: 500 Kbits block RAM buffers full video lines; SelectIO supports both 3.3V sensor I/O and 1.2V MIPI-compatible signaling. |
| Medical Imaging Front-End | Test & Measurement Signal Generator |
Use Scenario: Digitizing and preprocessing ultrasound echo signals from 64-channel transducer arrays before DSP offload. IC Role / Device Role / Timing Role: Time-gated ADC sampling controller, digital beamformer, and channel gain calibration engine. Use Value: 22,176 logic cells implement parallel FIR filters per channel; DCMs align sampling clocks across channels with <100 ps skew. | Use Scenario: Generating arbitrary waveforms (sine, square, chirp) with precise amplitude, frequency, and phase control for calibration equipment. IC Role / Device Role / Timing Role: Direct Digital Synthesizer (DDS) core with phase accumulator, lookup table, and DAC interface logic. Use Value: Embedded multipliers accelerate phase-to-amplitude computation; block RAM stores waveform samples with 16-bit resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG456C | Lower logic density (17,280 LCs), same -4 speed grade, 456-pin FBGA | Fits smaller gate-count designs; lacks 18×18 multipliers | Choose when design fits within 17K LCs and requires lower cost, not higher performance |
| XC3S1600E-5FG484C | Higher density (25,344 LCs), 484-pin FBGA, +32% I/O count | Supports larger video pipelines or multi-protocol interface aggregation | Choose when XC3S1200E-5FG400C resource utilization exceeds 90% or additional I/Os are required |
Compared with XC3S1200E-5FG400C, XC3S1000-4FG456C trades logic capacity and multiplier capability for lower unit cost and smaller footprint, while XC3S1600E-5FG484C extends scalability for bandwidth-intensive applications requiring more I/Os and deeper memory buffers.
Availability
XC3S1200E-5FG400C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging front-ends, and test & measurement signal generation requiring stable component supply and long-term production continuity.
Supply support for XC3S1200E-5FG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-3E family was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with integrated memory and clock management-targeting industrial automation, video processing, and communications infrastructure.
FAQ
What is the maximum operating frequency supported by XC3S1200E-5FG400C?
The XC3S1200E-5FG400C has a -5 speed grade, guaranteeing timing closure for internal logic paths up to 525 MHz under worst-case commercial temperature and voltage conditions. This rating applies to dedicated carry chains and registered outputs-not all paths achieve this frequency; actual system clock rates depend on design topology and place-and-route results.
Does XC3S1200E-5FG400C support JTAG programming and debugging?
Yes, XC3S1200E-5FG400C includes IEEE 1149.1-compliant JTAG boundary scan circuitry. It supports in-system programming (ISP), configuration verification, and board-level interconnect testing. The TCK, TMS, TDI, and TDO pins are dedicated and electrically compatible with standard JTAG adapters such as Xilinx Platform Cable USB II.
How much block RAM is available in XC3S1200E-5FG400C and what is its access width?
XC3S1200E-5FG400C contains 500 Kbits of total block RAM, organized as twenty 18-Kbit blocks. Each block can be configured as single-port or true dual-port RAM with programmable widths from 1 to 36 bits per port, supporting synchronous read/write with independent clocks per port.
Can XC3S1200E-5FG400C interface directly with DDR SDRAM?
No, XC3S1200E-5FG400C does not include dedicated DDR or DDR2 memory controller hard IP. While it can implement soft DDR controllers using logic resources and I/O timing constraints, reliable operation requires careful PCB layout, termination, and calibration-especially at speeds above 133 MHz. External PHY or controller ICs are recommended for production DDR interfaces.
What configuration modes are supported by XC3S1200E-5FG400C?
XC3S1200E-5FG400C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial is most common, using an external PROM to load the bitstream automatically on power-up. JTAG is used for development, debugging, and field updates without requiring external memory devices.
XC3S1200E-5FG400C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 400-BGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 304
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S1200E-5FG400C FAQ
1.How can I place an order for XC3S1200E-5FG400C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-5FG400C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-5FG400C reliable?
The price and inventory of XC3S1200E-5FG400C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-5FG400C is usually 5 days.
3.What payment methods are accepted for XC3S1200E-5FG400C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-5FG400C transactions.
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XC3S1200E-5FG400C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-5FG400C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-5FG400C?
For technical support, including XC3S1200E-5FG400C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-5FG400C requirements.
6.How does Aetrix verify that XC3S1200E-5FG400C is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-5FG400C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-5FG400C meets industry standards.
7.What is the process for return or replacement of XC3S1200E-5FG400C?
All XC3S1200E-5FG400C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-5FG400C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-5FG400C part is unused and in its original packaging.
Return procedure for XC3S1200E-5FG400C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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