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AMD XC3S1200E-5FGG400C
- Part No.:
- XC3S1200E-5FGG400C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S1200E-5FGG400C.pdf
- Description:
- IC FPGA 304 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,644
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Product details
Overview
XC3S1200E-5FGG400C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,195,000 system gates, 128 I/O pins, and a -5 speed grade operating at 572 MHz internal clock frequency. It integrates 128 distributed RAM bits, 24 block RAMs (each 18 Kbits), and supports LVCMOS25/LVCMOS33 I/O standards. It is used in industrial motor control interface modules requiring deterministic logic timing and multi-channel digital I/O expansion.
For engineers reviewing the XC3S1200E-5FGG400C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM capacity, speed grade compatibility, and FG400 package thermal performance for convection-cooled embedded controllers.
Technical Context
The XC3S1200E-5FGG400C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It includes eight Digital Clock Managers (DCMs) supporting phase shifting, duty cycle correction, and frequency synthesis up to 320 MHz output.
Configuration is performed via Master Serial mode using external PROM or microcontroller-driven JTAG. The device supports IEEE 1149.1 boundary-scan testing and features SelectIO technology enabling mixed-voltage I/O operation across banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 19,200 - provides gate-equivalent capacity for medium-complexity control and protocol bridging logic |
| Block RAM | 432 Kbits (24 × 18 Kbit blocks) - enables dual-port FIFOs, coefficient storage, or local data buffering |
| I/O Pins | 128 user-configurable - supports parallel bus interfaces, GPIO expansion, or multi-signal sensor aggregation |
| Speed Grade | -5 - guarantees 572 MHz internal clock performance under worst-case commercial temperature conditions |
| Package | FGG400 - 400-pin Fine-Pitch Ball Grid Array, 23 mm × 23 mm, 0.8 mm pitch, JEDEC MO-230 compliant |
| DCM Count | 8 - allows independent clock domain management for video, comms, and control subsystems |
Pinout & Package
XC3S1200E-5FGG400C uses a 400-ball FCBGA (Fine-Pitch Ball Grid Array) package with 336 signal balls, 48 power/ground balls, and 16 reserved balls. Thermal pad is exposed on underside for PCB-level heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be locally decoupled with ≤10 nF ceramic capacitor |
| P2 | VCCAUX | 2.5 V auxiliary supply - powers configuration logic, DCMs, and SelectIO circuitry |
| T1 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration when pulsed low |
| R1 | INIT_B | Open-drain status output - indicates configuration memory readiness during startup |
| U1 | DONE | Open-drain completion indicator - goes high when configuration completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multiplier Blocks | 4 - each performs 18×18-bit signed multiplication for real-time filtering or PID computation |
| SelectIO Technology | Supports LVCMOS25/LVCMOS33/SSTL2/SSTL3 - enables direct interfacing with DDR SDRAM, microcontrollers, and industrial sensors |
| Digital Clock Manager (DCM) | 8 independent units - provide jitter-free clock synthesis and phase alignment without external PLL components |
| Embedded Block RAM | 24 × 18 Kbit blocks - allow true dual-port access for simultaneous read/write in control state machines |
Applications
| Industrial Motion Controller | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time interpolation of stepper/servo drive commands with synchronized PWM generation and encoder feedback capture. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop motion algorithms; DCMs lock PWM and encoder sampling clocks to common base reference. Use Value: Deterministic sub-microsecond timing ensures position accuracy within ±0.01° over 100 kHz update cycles. | Use Scenario: Parallel stimulus-response validation of mixed-signal ICs using programmable pattern generators and digitizers. IC Role / Device Role / Timing Role: Configurable I/O banks drive test vectors at 100+ MHz while capturing responses with timestamped edge detection. Use Value: 128 I/O pins enable full-pin-at-once testing of 64-bit ASICs with per-pin voltage/current control. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of raw pixel data from CMOS image sensors before transmission to host processor. IC Role / Device Role / Timing Role: Block RAM buffers frame data; LUT fabric applies real-time histogram equalization and noise reduction kernels. Use Value: On-chip 432 Kbits RAM eliminates external frame buffer, reducing BOM cost and EMI emissions. | Use Scenario: Consolidation of ARINC 429, discrete discretes, and analog sensor inputs into unified Ethernet/IP packets for flight control systems. IC Role / Device Role / Timing Role: Dedicated logic handles ARINC 429 framing and parity; DCMs generate precise 100 kHz sync pulses for sensor sampling. Use Value: Single-chip integration reduces SWaP-C versus discrete ASIC + microcontroller solutions by 42%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG400C | 1,000K gates, -4 speed grade (500 MHz max), same FG400 package | Lower logic density and clock frequency limit - suitable for less complex control tasks | Select when design fits within 16,000 logic cells and does not require >500 MHz internal timing |
| XC3S1600E-5FGG400C | 1,600K gates, same -5 speed grade, identical FG400 footprint | Higher gate count and 32 additional I/O pins - supports larger state machines and more peripheral interfaces | Choose for designs needing >19,200 logic cells or >128 I/Os while retaining board layout compatibility |
Compared with XC3S1200E-5FGG400C, the XC3S1000-4FGG400C trades gate count and speed for lower static power, while the XC3S1600E-5FGG400C extends scalability without changing PCB layout-enabling incremental feature upgrades in field-deployed hardware.
Availability
XC3S1200E-5FGG400C is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, and medical imaging interface designs requiring stable component supply and long-term production support.
Supply support for XC3S1200E-5FGG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-3E product line for legacy industrial and aerospace applications. The company specializes in adaptive computing platforms for embedded, data center, and edge systems.
The Spartan-3E family was designed for cost-sensitive, high-volume embedded control and interface applications where predictable timing, moderate logic density, and I/O flexibility are critical - not for AI acceleration or high-bandwidth networking.
FAQ
What is the maximum operating junction temperature for XC3S1200E-5FGG400C?
The XC3S1200E-5FGG400C has a maximum junction temperature of 85°C under commercial temperature grade (C) specification. This rating applies when using the FGG400 package with recommended PCB copper pour and thermal vias beneath the thermal pad. Exceeding this limit risks configuration loss and timing violation in the XC3S1200E-5FGG400C.
Does XC3S1200E-5FGG400C support JTAG boundary-scan testing?
Yes, XC3S1200E-5FGG400C fully complies with IEEE 1149.1 (JTAG) standard and supports boundary-scan testing of all I/O pins and internal logic. The TDI, TDO, TMS, TCK, and TCK pins are dedicated for this function, and the XC3S1200E-5FGG400C implements mandatory instruction register and bypass logic required for production test visibility.
Can XC3S1200E-5FGG400C be configured via SPI flash memory?
No, XC3S1200E-5FGG400C does not support native SPI flash configuration. It requires Master Serial mode using XCFxx Platform Flash PROMs or microcontroller-driven JTAG. The XC3S1200E-5FGG400C lacks internal SPI controller logic and its configuration interface is limited to serial bitstream loading through DIN or JTAG TDI.
What I/O standards are supported by XC3S1200E-5FGG400C banks?
XC3S1200E-5FGG400C supports LVCMOS25, LVCMOS33, SSTL2, SSTL3, HSTL-I, and PCI I/O standards across independently powered I/O banks. Each bank's VCCO voltage determines compatible standards, and the XC3S1200E-5FGG400C allows mixing standards within one package provided VCCO levels are properly segregated and decoupled.
Is XC3S1200E-5FGG400C pin-compatible with XC3S1200E-4FGG400C?
Yes, XC3S1200E-5FGG400C is pin-compatible with XC3S1200E-4FGG400C - both use identical FGG400 packaging, ball map, and I/O assignment. The only difference is speed grade (-5 vs. -4), meaning XC3S1200E-5FGG400C meets tighter timing requirements and operates reliably at higher frequencies than XC3S1200E-4FGG400C.
XC3S1200E-5FGG400C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 304
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S1200E-5FGG400C FAQ
1.How can I place an order for XC3S1200E-5FGG400C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-5FGG400C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-5FGG400C reliable?
The price and inventory of XC3S1200E-5FGG400C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-5FGG400C is usually 5 days.
3.What payment methods are accepted for XC3S1200E-5FGG400C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-5FGG400C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1200E-5FGG400C?
XC3S1200E-5FGG400C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-5FGG400C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-5FGG400C?
For technical support, including XC3S1200E-5FGG400C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-5FGG400C requirements.
6.How does Aetrix verify that XC3S1200E-5FGG400C is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-5FGG400C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-5FGG400C meets industry standards.
7.What is the process for return or replacement of XC3S1200E-5FGG400C?
All XC3S1200E-5FGG400C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-5FGG400C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-5FGG400C part is unused and in its original packaging.
Return procedure for XC3S1200E-5FGG400C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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