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AMD XC3S1200E-5FT256C
- Part No.:
- XC3S1200E-5FT256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S1200E-5FT256C.pdf
- Description:
- IC FPGA 190 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,468
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Product details
Overview
XC3S1200E-5FT256C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,147 logic cells, 228 I/O pins, and 500 kb of total block RAM. It features a 5 ns system clock speed, supports LVCMOS/LVTTL I/O standards, and is used in industrial control logic and embedded vision preprocessing.
For engineers reviewing the XC3S1200E-5FT256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, block RAM capacity, system clock timing, and FT256 package compatibility for PCB layout reuse.
Technical Context
The XC3S1200E-5FT256C implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry chains for arithmetic. It integrates twelve 18×18 multipliers and supports SelectIO™ technology for programmable I/O standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via master serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty-cycle correction - all operating at up to 240 MHz input frequency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,147 - provides gate-equivalent capacity for medium-complexity digital controllers and protocol bridges |
| I/O Pins | 228 - supports high-pin-count interfaces such as parallel camera sensors or multi-channel ADCs |
| Block RAM | 500 kb - enables local frame buffering or FIFO depth sufficient for real-time video line storage |
| System Clock Speed | 5 ns (200 MHz) - defines maximum synchronous logic operation frequency under worst-case conditions |
| DCM Outputs | 2 - each DCM delivers up to two independent clock outputs with jitter < ±100 ps |
| Multipliers | 12 × 18×18 - supports fixed-point filtering, motor control PWM generation, or basic DSP kernels |
Pinout & Package
The XC3S1200E-5FT256C is housed in a 256-pin Fine-Pitch Ball Grid Array (FTBGA) package with 1.0 mm pitch, 17×17 array, and thermal pad. Pin assignment follows Xilinx Spartan-3E family conventions with dedicated configuration, clock, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master serial programming |
| DIN | Configuration Data Input | Serial data stream input for bitstream loading from external PROM |
| PROG_B | Program Initiate | Active-low signal that clears configuration memory and initiates reconfiguration |
| INIT_B | Configuration Status Output | Open-drain output indicating completion of CRC check and readiness for startup |
| GCLK0–GCLK3 | Global Clock Inputs | Dedicated low-skew routing paths for synchronous domain clocking |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two integrated DCMs provide jitter-reduced clock synthesis and phase alignment without external PLL ICs |
| SelectIO™ Technology | Per-bank I/O voltage support (1.2 V to 3.3 V) enables direct interfacing with mixed-voltage peripherals |
| Embedded Multipliers | Twelve 18×18 signed multipliers allow hardware-accelerated arithmetic without consuming logic resources |
| Configurable Logic Blocks | Each CLB contains two 4-LUTs + flip-flops, enabling efficient implementation of state machines and combinatorial logic |
Applications
| Industrial Motion Control | Machine Vision Preprocessing |
|---|---|
Use Scenario: Real-time servo loop execution and encoder signal decoding in CNC systems. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic finite-state machines and time-critical interrupt handlers with sub-microsecond latency. Use Value: 228 I/O pins directly interface with quadrature encoders, PWM drivers, and safety I/O modules without glue logic. | Use Scenario: Pixel-level filtering and ROI extraction prior to host CPU processing in smart cameras. IC Role / Device Role / Timing Role: XC3S1200E-5FT256C acts as a parallel pipeline accelerator synchronized to sensor pixel clock. Use Value: 500 kb block RAM buffers full-line image data while 12 multipliers perform Sobel edge detection in real time. |
| Communications Protocol Bridge | Test Equipment Logic Analyzer Core |
Use Scenario: Translation between RS-485 fieldbus and USB/Ethernet host interface in programmable logic controllers. IC Role / Device Role / Timing Role: XC3S1200E-5FT256C implements dual-port FIFOs and UART/USB protocol state machines. Use Value: LVCMOS/LVTTL I/O flexibility allows direct connection to both legacy transceivers and modern PHYs. | Use Scenario: High-speed digital signal capture and trigger pattern matching in benchtop logic analyzers. IC Role / Device Role / Timing Role: XC3S1200E-5FT256C serves as acquisition engine with deterministic sampling clock distribution. Use Value: 5 ns system clock timing ensures reliable setup/hold margins for 200 MHz sampling rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FT256C | 1,000 logic cells, no embedded multipliers, same FT256 package | Limited to simpler control logic; lacks hardware acceleration for math-intensive tasks | Choose when design fits within 1K LC budget and requires no multiplier-based functions |
| XC3S1600E-5FT256C | 1,584 logic cells, 576 kb block RAM, identical DCM/multiplier architecture | Supports larger state machines and deeper buffering for higher-resolution imaging pipelines | Choose when additional logic density or RAM is required beyond XC3S1200E-5FT256C capacity |
Compared with XC3S1000-4FT256C, the XC3S1200E-5FT256C adds 147 logic cells and 12 multipliers for enhanced compute capability; compared with XC3S1600E-5FT256C, it offers lower cost and power while retaining full DCM and I/O functionality for mid-tier designs.
Availability
XC3S1200E-5FT256C is available at Aetrix Electronics and suitable for industrial motion control, machine vision preprocessing, and communications protocol bridge applications requiring stable component supply across extended production lifecycles.
Supply support for XC3S1200E-5FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-3E product line for legacy industrial and aerospace applications.
The Spartan-3E family was designed for cost-sensitive, high-volume embedded logic replacement - delivering predictable timing, robust configuration security, and long-term availability in industrial environments.
FAQ
What is the maximum operating frequency of the XC3S1200E-5FT256C?
The XC3S1200E-5FT256C has a system clock speed rating of 5 ns, corresponding to a maximum guaranteed operating frequency of 200 MHz under worst-case commercial temperature and voltage conditions. This value reflects synchronous logic performance after place-and-route timing closure, not theoretical LUT propagation delay.
Does the XC3S1200E-5FT256C support JTAG configuration?
Yes, the XC3S1200E-5FT256C supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. JTAG mode enables in-system configuration without external PROM and is commonly used during development and field updates.
What I/O standards are supported by the XC3S1200E-5FT256C?
The XC3S1200E-5FT256C supports LVCMOS, LVTTL, PCI, and SSTL I/O standards through its SelectIO™ technology. Each I/O bank operates independently at voltages from 1.2 V to 3.3 V, allowing mixed-voltage interface design without level shifters.
How much block RAM does the XC3S1200E-5FT256C contain?
The XC3S1200E-5FT256C contains 500 kb of total block RAM, distributed across 20 Block RAM primitives (each 18 kbits). This capacity supports dual-port FIFOs, coefficient tables, or line buffers in real-time signal processing applications.
Is the XC3S1200E-5FT256C pin-compatible with other Spartan-3E devices in FT256 packaging?
Yes, the XC3S1200E-5FT256C shares identical pinout and package dimensions with other Spartan-3E FPGAs offered in the FT256 package, including XC3S500E-5FT256C and XC3S1600E-5FT256C, enabling footprint reuse across density variants.
XC3S1200E-5FT256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 256-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2168
- Number of Logic Elements/Cells:
- 19512
- Total RAM Bits:
- 516096
- Number of I/O:
- 190
- Number of Gates:
- 1200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S1200E-5FT256C FAQ
1.How can I place an order for XC3S1200E-5FT256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1200E-5FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1200E-5FT256C reliable?
The price and inventory of XC3S1200E-5FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1200E-5FT256C is usually 5 days.
3.What payment methods are accepted for XC3S1200E-5FT256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1200E-5FT256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1200E-5FT256C?
XC3S1200E-5FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1200E-5FT256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1200E-5FT256C?
For technical support, including XC3S1200E-5FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1200E-5FT256C requirements.
6.How does Aetrix verify that XC3S1200E-5FT256C is sourced from the original manufacturer or authorized distributors?
All XC3S1200E-5FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1200E-5FT256C meets industry standards.
7.What is the process for return or replacement of XC3S1200E-5FT256C?
All XC3S1200E-5FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1200E-5FT256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1200E-5FT256C part is unused and in its original packaging.
Return procedure for XC3S1200E-5FT256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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