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AMD XC3S1400A-4FG484C

Part No.:
XC3S1400A-4FG484C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC3S1400A-4FG484C.pdf
Description:
IC FPGA 375 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,468

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Product details

Overview

XC3S1400A-4FG484C from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 1,400,000 system gates, 216 I/O pins, and a -4 speed grade in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It integrates 216 configurable logic blocks (CLBs), 12 embedded 18×18 multipliers, and supports 3.3V/2.5V/1.2V I/O standards for industrial control and communication interface applications.

For engineers reviewing the XC3S1400A-4FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic capacity, supported voltage standards, embedded multiplier count, and thermal performance in compact PCB layouts.

Technical Context

The XC3S1400A-4FG484C implements a synchronous, SRAM-based architecture with configuration via external PROM or processor-controlled JTAG. Its CLBs contain two 4-input LUTs and flip-flops per slice, enabling efficient implementation of state machines and datapaths. The device includes dedicated carry logic for high-speed arithmetic and supports distributed RAM and shift register functions within logic fabric.

It features 12 embedded 18×18 signed/unsigned multipliers operating up to 250 MHz, and supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards across 216 user-configurable pins. Configuration memory retention requires continuous power or external reconfiguration on power-up.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Capacity1,400,000 system gates - determines maximum combinational/sequential logic complexity realizable without external logic.
I/O Pins216 user-configurable I/Os - supports high-pin-count interfaces such as parallel buses, video data paths, or multi-channel ADC/DAC control.
Embedded Multipliers12 × 18×18-bit - enables fixed-point DSP functions like FIR filtering or motor control algorithms without external math ICs.
Speed Grade-4 - guarantees timing closure up to 250 MHz for critical paths under worst-case industrial temperature and voltage conditions.
Package484-pin FBGA (23×23 mm, 1.0 mm pitch) - provides high I/O density and thermal dissipation suitable for industrial PCBs with constrained area.
Voltage Support1.2 V core / 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V I/O - allows direct interfacing with mixed-voltage peripherals without level shifters.

Pinout & Package

XC3S1400A-4FG484C is housed in a 484-ball fine-pitch BGA (FPBGA) package with 216 user I/Os, 8 global clock inputs, 4 dedicated configuration pins (INIT_B, PROGRAM_B, DONE, CCLK), and power/ground balls distributed across the array for low-noise operation.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockDrives internal configuration shift registers during master serial or JTAG programming; must be stable before INIT_B deassertion.
DONEConfiguration Status OutputOpen-drain signal indicating successful configuration completion; pulled high externally to enable downstream logic enablement.
PROGRAM_BActive-Low Configuration InitiateResets configuration memory and initiates reconfiguration cycle when pulsed low; asynchronous reset to all internal logic.
INIT_BConfiguration Initialization StatusOpen-drain output signaling readiness to accept configuration data; asserted low during internal initialization or CRC error.
GCLK[0–7]Global Clock InputsDedicated low-skew routing to all CLBs and block RAM; supports single-ended (LVCMOS/LVTTL) or differential (LVDS) clock sources.

Key Features

FeatureDesign Value
Configurable Logic Blocks (CLBs)216 CLBs, each with dual 4-LUTs + flip-flops - delivers predictable timing for synchronous state machines and pipelined datapaths.
Block RAM576 Kbits distributed across 96 × 64-bit dual-port RAM blocks - supports FIFOs, lookup tables, and local data buffering without external memory.
DSP Slices12 embedded 18×18 multipliers - accelerates fixed-point arithmetic for servo control, digital power conversion, and sensor fusion.
I/O Standards SupportLVCMOS, LVTTL, PCI, HSTL Class I/II, SSTL2 Class I/II - eliminates need for external level translators in mixed-voltage systems.
Configuration SecurityBitstream encryption option via external PROM - prevents unauthorized cloning or reverse engineering of implemented logic design.

Applications

Industrial PLC I/O ExpansionVideo Frame Buffer Interface

Use Scenario: Modular PLC backplane requiring real-time digital I/O expansion with deterministic response.

IC Role / Device Role / Timing Role: FPGA acts as parallel I/O controller with programmable debounce, edge detection, and bus arbitration logic.

Use Value: 216 I/Os and -4 speed grade ensure sub-microsecond input sampling and output update latency across 32+ channels.

Use Scenario: Embedded vision system buffering uncompressed YUV422 video frames between image sensor and ARM processor.

IC Role / Device Role / Timing Role: FPGA implements dual-port block RAM buffer and pixel clock domain crossing logic.

Use Value: 576 Kbits of on-chip RAM eliminate external SRAM, reducing board area and power by 35% versus discrete memory solution.

Motor Control Encoder InterfaceLegacy Bus Protocol Bridge

Use Scenario: Servo drive monitoring quadrature encoder signals and generating PWM waveforms with precise dead-time insertion.

IC Role / Device Role / Timing Role: FPGA executes real-time position capture, velocity calculation, and complementary PWM generation with hardware-synchronized outputs.

Use Value: Dedicated carry logic and -4 timing guarantee 100 ns PWM edge resolution and 500 kHz encoder sampling rate.

Use Scenario: Industrial gateway translating Modbus RTU over RS-485 to SPI-connected microcontroller.

IC Role / Device Role / Timing Role: FPGA implements UART-to-SPI protocol converter with configurable baud rates and packet framing.

Use Value: LVCMOS/LVTTL I/O support enables direct connection to both RS-485 transceivers and MCU SPI pins without level-shifting components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S1000-4FG456C1,000,000 gates, 456-pin FBGA, 192 I/Os - lower logic density and I/O count; same -4 speed grade and architecture.Suitable for smaller I/O footprint designs where 216 pins exceed requirement; reduced thermal mass eases cooling in space-constrained enclosures.Select when gate count and I/O budget allow reduction without sacrificing timing margin or embedded multiplier count.
XC3S1600E-4FG484C1,600,000 gates, same 484-pin FBGA, 224 I/Os, enhanced 18×18 multipliers - higher logic density and I/O count; identical package footprint.Enables more complex control algorithms or additional peripheral interfaces while maintaining PCB layout compatibility.Choose for future-proofing or incremental feature upgrades without redesigning mechanical or thermal layout.

Compared with XC3S1000-4FG456C, the XC3S1400A-4FG484C offers 400K more gates and 24 extra I/Os in the same 484-ball footprint; versus XC3S1600E-4FG484C, it trades 200K gates and 8 I/Os for lower static power and mature production availability.

Availability

XC3S1400A-4FG484C is available at Aetrix Electronics and suitable for industrial automation, embedded vision, motor control, and legacy protocol bridging requiring stable component supply and long-term manufacturing continuity.

Supply support for XC3S1400A-4FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops and supports the Spartan FPGA family for cost-sensitive, high-volume embedded applications.

The Spartan-3A product line was designed specifically for industrial control, communications infrastructure, and video processing applications requiring predictable timing, low power, and proven reliability in extended temperature environments.

FAQ

What is the maximum operating frequency of the XC3S1400A-4FG484C?

The XC3S1400A-4FG484C has a -4 speed grade, meaning its internal logic paths are guaranteed to operate up to 250 MHz under worst-case industrial temperature (-40°C to +85°C) and voltage conditions. Actual achievable frequency depends on design placement, routing, and resource utilization - verified through static timing analysis in Xilinx ISE.

Does the XC3S1400A-4FG484C support JTAG configuration?

Yes, the XC3S1400A-4FG484C supports IEEE 1149.1 JTAG boundary-scan configuration and debugging. Pins TCK, TMS, TDI, and TDO are dedicated for this purpose and can be used for in-system programming, verification, and test without requiring external configuration PROM.

How much block RAM does the XC3S1400A-4FG484C provide?

The XC3S1400A-4FG484C contains 576 Kbits of total block RAM, organized as 96 independent 64-bit dual-port RAM blocks. Each block supports simultaneous read and write operations, enabling efficient FIFOs, frame buffers, and lookup tables without external memory.

Can the XC3S1400A-4FG484C interface directly with 3.3V peripherals?

Yes, the XC3S1400A-4FG484C supports LVCMOS33 and LVTTL I/O standards on designated banks, allowing direct connection to 3.3V peripherals. I/O voltage is set per bank using VCCO pins, and each bank must be powered at the selected standard's required voltage.

Is bitstream encryption available for the XC3S1400A-4FG484C?

Yes, the XC3S1400A-4FG484C supports optional AES-128 bitstream encryption when configured via external PROM. This feature prevents unauthorized readback or cloning of the programmed logic design, enhancing IP protection in deployed systems.

XC3S1400A-4FG484C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3A
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
2816
Number of Logic Elements/Cells:
25344
Total RAM Bits:
589824
Number of I/O:
375
Number of Gates:
1400000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC3S1400A-4FG484C FAQ

1.How can I place an order for XC3S1400A-4FG484C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S1400A-4FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S1400A-4FG484C reliable?

The price and inventory of XC3S1400A-4FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400A-4FG484C is usually 5 days.

3.What payment methods are accepted for XC3S1400A-4FG484C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400A-4FG484C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S1400A-4FG484C?

XC3S1400A-4FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S1400A-4FG484C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S1400A-4FG484C?

For technical support, including XC3S1400A-4FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400A-4FG484C requirements.

6.How does Aetrix verify that XC3S1400A-4FG484C is sourced from the original manufacturer or authorized distributors?

All XC3S1400A-4FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400A-4FG484C meets industry standards.

7.What is the process for return or replacement of XC3S1400A-4FG484C?

All XC3S1400A-4FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400A-4FG484C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S1400A-4FG484C part is unused and in its original packaging.

Return procedure for XC3S1400A-4FG484C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S1400A-4FG484C Tags

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