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AMD XC3S1400A-4FG484I
- Part No.:
- XC3S1400A-4FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S1400A-4FG484I.pdf
- Description:
- IC FPGA 375 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,506
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Product details
Overview
XC3S1400A-4FG484I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 1,400,000 system gates, 21,952 logic cells, and 512 kB of total block RAM. It features 376 user I/Os, operates at -4 speed grade (tPD = 4.5 ns), and is rated for industrial temperature range (-40°C to +100°C). It is used in industrial motor control interface modules requiring deterministic timing and reconfigurable logic.
For engineers reviewing the XC3S1400A-4FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, block RAM capacity, speed grade timing, and industrial-grade thermal performance.
Technical Context
The XC3S1400A-4FG484I implements a fully SRAM-based configurable logic architecture with dedicated carry chains, distributed RAM, and 18×18 multipliers. It supports SelectIO standards including LVCMOS, LVTTL, PCI, HSTL, and SSTL across its 376 user I/O pins.
Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. The device includes Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction for up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 21,952 - provides gate-equivalent logic density for medium-complexity control and datapath functions |
| Block RAM | 512 kB - enables on-chip buffering for video frame storage, FIFOs, or protocol stacks |
| User I/O Pins | 376 - supports high-pin-count peripheral interfacing without external glue logic |
| Speed Grade | -4 - guarantees maximum propagation delay of 4.5 ns for critical path timing closure |
| Operating Temperature | -40°C to +100°C - qualified for industrial environments with extended thermal cycling |
| Package | 484-pin Fine-Pitch BGA (FG484) - 23×23 mm body, 1.0 mm pitch, RoHS-compliant |
| DCM Units | 8 - allows independent clock domain management for mixed-signal or multi-interface systems |
Pinout & Package
The XC3S1400A-4FG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FG484) package with 23×23 array, 1.0 mm ball pitch, and standard power/ground ball allocation per Xilinx DS312 v2.5.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered locally with ≥10 µF ceramic capacitance |
| K1 | VCCAUX | 2.5 V auxiliary supply for configuration and I/O banks - shared across multiple banks |
| P2 | PROGRAM_B | Active-Low configuration initiator - drives internal reset and clears SRAM upon assertion |
| T14 | DONE | Open-drain status output - goes High-Z after successful configuration and release of INIT_B |
| W19 | TCK | JTAG test clock input - synchronous boundary-scan and debug interface timing reference |
Key Features
| Feature | Design Value |
|---|---|
| Multi-voltage I/O Banks | Four independent banks support simultaneous 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling - enables direct interfacing with mixed-voltage peripherals |
| Dedicated Digital Clock Managers (DCMs) | Eight DCMs provide jitter-reduced clock synthesis, 0–255° phase shift, and 50% duty cycle correction - eliminates need for external clock ICs in timing-critical subsystems |
| SelectIO Technology | Supports LVCMOS, LVTTL, PCI, HSTL Class I/II, and SSTL Class II - simplifies integration with DDR SDRAM, PCI controllers, and legacy parallel buses |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops - delivers balanced combinational and sequential logic density for real-time control loops |
Applications
| Industrial Motor Control Interface | Automated Test Equipment (ATE) Pattern Generator |
|---|---|
Use Scenario: Real-time PWM generation, encoder feedback decoding, and safety interlock monitoring in servo drive modules. IC Role / Device Role / Timing Role: Configurable logic fabric executes deterministic control algorithms with sub-microsecond latency; DCMs synchronize PWM and capture clocks. Use Value: Eliminates dual-FPGA or ASIC design by integrating motion control logic, I/O conditioning, and clock management in one XC3S1400A-4FG484I device. | Use Scenario: Generation of high-speed digital stimulus waveforms and response capture for semiconductor device validation. IC Role / Device Role / Timing Role: XC3S1400A-4FG484I acts as pattern sequencer and timing engine, driving 32+ parallel channels at up to 100 MHz. Use Value: Leverages 376 I/Os and block RAM to store and replay complex test vectors without external memory bottleneck. |
| Medical Imaging Data Preprocessor | Avionics Display Interface Bridge |
Use Scenario: Real-time pixel-level filtering and histogram equalization prior to JPEG compression in portable ultrasound units. IC Role / Device Role / Timing Role: XC3S1400A-4FG484I implements pipelined image processing pipeline with parallel LUT-based arithmetic and block RAM line buffers. Use Value: Achieves 60 fps 1024×768 grayscale processing using on-chip resources - avoids external DSP and reduces BOM cost. | Use Scenario: Protocol translation between ARINC 661-compliant graphics processors and legacy analog RGB/TTL display drivers. IC Role / Device Role / Timing Role: XC3S1400A-4FG484I serves as timing-critical bridge, converting serialized command streams into synchronized pixel clock, HSYNC, VSYNC, and data enable signals. Use Value: Uses DCMs to lock to incoming 25–65 MHz video clocks and generate stable 135 MHz pixel clocks - ensures zero-frame-drop display operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG456C | 1,000K gates, 17,280 logic cells, 456-pin BGA, commercial temp (0°C to +85°C) | Limited block RAM (384 kB) and I/O count (324); no industrial qualification | Lower-cost option where ambient temperature stays below 85°C and logic density suffices |
| XC3S1600E-4FG484I | 1,600K gates, 25,344 logic cells, same FG484 package, industrial temp | Higher logic density and 640 kB block RAM; requires updated place-and-route constraints | Drop-in replacement only if design fits within increased resource margins and timing closure is re-verified |
Compared with XC3S1400A-4FG484I, the XC3S1000-4FG456C offers reduced cost but lacks industrial temperature rating and I/O headroom, while the XC3S1600E-4FG484I provides scalable logic and memory for future feature expansion at identical packaging and thermal compliance.
Availability
XC3S1400A-4FG484I is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, medical imaging subsystems, and avionics display interfaces requiring stable component supply and long-term lifecycle support.
Supply support for XC3S1400A-4FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for high-performance embedded and datacenter applications.
The Spartan-3A family was designed for cost-sensitive, high-volume industrial and automotive applications requiring reliable reconfigurable logic with integrated clock management and multi-standard I/O.
FAQ
What is the maximum operating frequency supported by the XC3S1400A-4FG484I?
The XC3S1400A-4FG484I supports internal logic operation up to 500 MHz when using DCM outputs with proper timing constraints. Its -4 speed grade guarantees critical path delays ≤4.5 ns, enabling robust timing closure for designs targeting 200–300 MHz system clocks. Actual achievable frequency depends on routing, resource utilization, and I/O standard selection in the final implementation of XC3S1400A-4FG484I.
Does the XC3S1400A-4FG484I support JTAG boundary-scan testing?
Yes, the XC3S1400A-4FG484I includes IEEE 1149.1-compliant JTAG circuitry with TDI, TDO, TMS, TCK, and TRST pins. It supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions for board-level fault detection and programming. This capability is fully documented in the XC3S1400A-4FG484I configuration user guide (UG332).
Can the XC3S1400A-4FG484I be configured using a microcontroller?
Yes, the XC3S1400A-4FG484I supports Slave Serial and SelectMAP configuration modes, allowing initialization by an external microcontroller via GPIO or parallel bus. The microcontroller writes configuration bitstream bytes to the DIN pin while toggling CCLK, with INIT_B and DONE monitored for status. This method is commonly implemented in field-upgradable XC3S1400A-4FG484I systems.
What are the power supply requirements for the XC3S1400A-4FG484I?
The XC3S1400A-4FG484I requires three regulated supplies: 1.2 V ±3% for VCCINT (core), 2.5 V ±3% for VCCAUX (auxiliary), and 3.3 V ±5% for VCCO (I/O banks). Each supply must be decoupled with local ceramic capacitors (10 µF bulk + 0.1 µF high-frequency). Total typical power consumption ranges from 1.2 W (idle) to 4.8 W (full utilization), depending on toggle rate and I/O activity in XC3S1400A-4FG484I operation.
Is the XC3S1400A-4FG484I still in active production?
The XC3S1400A-4FG484I is listed as Not Recommended for New Designs (NRND) by AMD/Xilinx, but remains available through authorized distributors and Aetrix Electronics with verified inventory and extended lifecycle support. Last Time Buy (LTB) notifications have not been issued, and Aetrix maintains committed stock for ongoing industrial programs using XC3S1400A-4FG484I.
XC3S1400A-4FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 375
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S1400A-4FG484I FAQ
1.How can I place an order for XC3S1400A-4FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400A-4FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400A-4FG484I reliable?
The price and inventory of XC3S1400A-4FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400A-4FG484I is usually 5 days.
3.What payment methods are accepted for XC3S1400A-4FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400A-4FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400A-4FG484I?
XC3S1400A-4FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400A-4FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400A-4FG484I?
For technical support, including XC3S1400A-4FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400A-4FG484I requirements.
6.How does Aetrix verify that XC3S1400A-4FG484I is sourced from the original manufacturer or authorized distributors?
All XC3S1400A-4FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400A-4FG484I meets industry standards.
7.What is the process for return or replacement of XC3S1400A-4FG484I?
All XC3S1400A-4FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400A-4FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400A-4FG484I part is unused and in its original packaging.
Return procedure for XC3S1400A-4FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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