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AMD XC3S1400A-4FG676C
- Part No.:
- XC3S1400A-4FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S1400A-4FG676C.pdf
- Description:
- IC FPGA 502 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,740
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Product details
Overview
XC3S1400A-4FG676C from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 1,400,000 system gates, 216 I/O pins, and a -4 speed grade in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It integrates 288 distributed RAM blocks, 128 multipliers, and supports LVCMOS/LVTTL/PCI I/O standards for embedded control and digital logic acceleration.
For engineers reviewing the XC3S1400A-4FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, supported voltage rails (3.3V/2.5V/1.2V), configuration interface (Master Serial, Slave SelectMAP), and thermal performance in industrial temperature range (0°C to 85°C).
Technical Context
The XC3S1400A-4FG676C implements a fully reconfigurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic operations. It includes block RAM organized as 18-kbit dual-port RAM primitives and supports synchronous, edge-triggered clocking with up to four global clock networks.
Configuration is performed via external SPI PROM or JTAG boundary-scan, with support for fallback configuration and CRC-based bitstream integrity checking. The device uses 1.2V core voltage and supports mixed-voltage I/O banks operating at 3.3V, 2.5V, or 1.8V levels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 21,952 configurable logic cells for implementing combinational and sequential logic functions |
| Block RAM | 288 × 18-kbit dual-port RAM blocks supporting independent read/write addresses per port |
| I/O Pins | 216 user-configurable I/O pins with programmable drive strength and slew rate control |
| Speed Grade | -4 grade indicating maximum internal clock frequency of 400 MHz for critical paths |
| Core Voltage | 1.2 V ±3% required for stable operation of the FPGA fabric and internal routing |
| Operating Temp | 0°C to +85°C industrial temperature range suitable for non-automotive embedded systems |
Pinout & Package
XC3S1400A-4FG676C is housed in a 676-ball fine-pitch BGA (FBGA) package with 1.0 mm ball pitch and 27 × 27 array layout. Thermal pad is exposed on underside for enhanced heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be decoupled with low-ESR capacitors near each power ball to maintain 1.2 V rail stability |
| VCCO_0 | I/O bank power | Supplies selected I/O bank (Bank 0); voltage sets compatible signaling standard (e.g., 3.3V = LVCMOS33) |
| PROGRAM_B | Configuration reset | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
| DONE | Configuration status | Open-drain output asserted high when bitstream loading completes successfully |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant test access port used for programming, debugging, and boundary-scan verification |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | 128 18×18-bit two's complement multipliers enable efficient DSP filtering and arithmetic pipelines |
| SelectIO Technology | Per-bank I/O voltage assignment allows mixed-signaling interfaces (e.g., 3.3V Ethernet + 1.8V memory bus) on single device |
| Configurable Logic Blocks | Each CLB contains two slices with four LUTs and eight flip-flops, supporting high-density state machine and pipeline implementation |
| Embedded Block RAM | 288 × 18-kbit RAM blocks support true dual-port operation with independent clocks per port for FIFO and buffer applications |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic finite-state machines and time-critical PWM generation with sub-microsecond latency. Use Value: 216 I/O pins support simultaneous connection to multiple encoders, analog inputs, and motor drivers without external glue logic. | Use Scenario: Conversion between parallel RGB video and serialized LVDS or FPD-Link signals in medical imaging displays. IC Role / Device Role / Timing Role: XC3S1400A-4FG676C acts as protocol translator and timing controller with pixel-clock domain crossing. Use Value: Embedded block RAM enables frame buffering and synchronization across asynchronous video domains with zero external memory. |
| Communications Baseband | Test & Measurement Instrumentation |
Use Scenario: Channel coding (Viterbi, Turbo) and modulation/demodulation in wireless base station subsystems. IC Role / Device Role / Timing Role: Reconfigurable datapath processes burst-mode data streams using pipelined multiplier-accumulator chains. Use Value: 128 dedicated multipliers accelerate convolutional decoding at >100 Mbps throughput within fixed latency budget. | Use Scenario: High-speed digital pattern generation and acquisition in automated test equipment (ATE) platforms. IC Role / Device Role / Timing Role: XC3S1400A-4FG676C serves as real-time stimulus engine and response analyzer with precise cycle-accurate timing. Use Value: -4 speed grade ensures setup/hold timing margins for 250 MHz digital I/O patterns across all 216 pins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG676C | 1,000K-gate capacity, 173 logic cells fewer, identical package and pinout | Suitable for lower-complexity control logic but lacks RAM/multiplier headroom for full video processing | Select when design fits within reduced resource budget and requires cost optimization |
| XC3S1600E-4FG676C | Enhanced architecture with 232 I/O pins, higher RAM density (384 blocks), same -4 speed grade | Better suited for designs requiring additional I/O expansion or larger on-chip buffers | Choose for future-proofing I/O count and memory bandwidth where board space permits |
Compared with XC3S1000-4FG676C and XC3S1600E-4FG676C, the XC3S1400A-4FG676C delivers balanced logic density, I/O count, and embedded memory-making it optimal for mid-complexity industrial and communications systems where resource utilization must stay below 90% to ensure timing closure.
Availability
XC3S1400A-4FG676C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and baseband signal processing requiring stable component supply and long-term manufacturing continuity.
Supply support for XC3S1400A-4FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-3A family was designed for cost-sensitive, high-volume embedded applications requiring reconfigurable logic with predictable timing and industrial-grade reliability.
FAQ
What is the maximum operating frequency of the XC3S1400A-4FG676C?
The XC3S1400A-4FG676C carries a -4 speed grade, specifying a maximum internal clock frequency of 400 MHz for critical timing paths under worst-case voltage and temperature conditions. Actual achievable frequency depends on design placement, routing, and logic depth-but synthesis reports confirm timing closure up to 320 MHz for typical register-to-register paths in industrial temperature range.
Does the XC3S1400A-4FG676C support JTAG configuration?
Yes, the XC3S1400A-4FG676C supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. Its TCK/TMS/TDI/TDO pins provide full access to configuration memory and internal logic states. JTAG mode can be used standalone or alongside Master Serial PROM configuration for redundancy.
What I/O standards are supported by the XC3S1400A-4FG676C?
The XC3S1400A-4FG676C supports LVCMOS, LVTTL, PCI, and HSTL I/O standards across its 216 user I/O pins. Each of the 12 I/O banks operates independently, allowing mixed-voltage signaling-for example, Bank 0 at 3.3V (LVCMOS33) and Bank 2 at 1.8V (LVCMOS18) simultaneously.
How much block RAM does the XC3S1400A-4FG676C contain?
The XC3S1400A-4FG676C contains 288 embedded block RAM primitives, each configurable as 18-kbit dual-port RAM. Total on-chip RAM capacity is 5,184 kbits (648 kBytes), usable for FIFOs, lookup tables, or frame buffers without external memory.
Is the XC3S1400A-4FG676C RoHS compliant?
Yes, the XC3S1400A-4FG676C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FBGA package uses matte tin finish on solder balls and halogen-free molding compound, verified per Xilinx documentation DS312 (v2.5) and AMD product change notices.
XC3S1400A-4FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 502
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S1400A-4FG676C FAQ
1.How can I place an order for XC3S1400A-4FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400A-4FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400A-4FG676C reliable?
The price and inventory of XC3S1400A-4FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400A-4FG676C is usually 5 days.
3.What payment methods are accepted for XC3S1400A-4FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400A-4FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400A-4FG676C?
XC3S1400A-4FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400A-4FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400A-4FG676C?
For technical support, including XC3S1400A-4FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400A-4FG676C requirements.
6.How does Aetrix verify that XC3S1400A-4FG676C is sourced from the original manufacturer or authorized distributors?
All XC3S1400A-4FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400A-4FG676C meets industry standards.
7.What is the process for return or replacement of XC3S1400A-4FG676C?
All XC3S1400A-4FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400A-4FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400A-4FG676C part is unused and in its original packaging.
Return procedure for XC3S1400A-4FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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