AMD XC3S1400A-4FG676I

Overview

XC3S1400A-4FG676I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 1,400,000 system gates, 21,952 logic cells, and 512 kB of total block RAM. It features 480 user I/Os, operates at -4 speed grade (1.14 ns CLB delay), and is rated for industrial temperature range (–40°C to +100°C). It is used in reconfigurable embedded control and digital signal preprocessing in industrial automation systems.

For engineers reviewing the XC3S1400A-4FG676I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count, block RAM depth, speed grade timing closure, and industrial-grade thermal reliability.

Technical Context

The XC3S1400A-4FG676I implements a fine-grained, SRAM-based configurable logic architecture with dedicated carry chains and distributed RAM. It integrates eight Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction across multiple clock domains.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan, with support for fallback configuration and multi-bitstream selection. The device includes SelectIO technology enabling SSTL, HSTL, LVCMOS, and LVTTL I/O standards with programmable drive strength and slew rate control.

Key Specifications

Pinout & Package

XC3S1400A-4FG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 3.5 W under typical industrial operating conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC3S1400A-4FG676I, the XC3S1000-4FG676I reduces gate count and I/Os for cost-sensitive deployments, while the XC3S1600E-4FG676I extends logic capacity without altering board layout or thermal management - both retain identical speed grade and industrial temperature qualification.

Availability

XC3S1400A-4FG676I is available at Aetrix Electronics and suitable for industrial automation, machine vision, and programmable logic controller applications requiring stable component supply and long-term manufacturing continuity.

Supply support for XC3S1400A-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Spartan-3A family was designed for cost-sensitive, high-volume industrial and embedded applications requiring predictable timing, robust configuration security, and industrial temperature operation - XC3S1400A-4FG676I represents its highest-density variant in the FG676 package.

FAQ

What is the configuration method supported by XC3S1400A-4FG676I?

XC3S1400A-4FG676I supports Master Serial mode using external SPI PROM and IEEE 1149.1 JTAG boundary-scan. It also enables fallback configuration and multi-bitstream selection. The device uses a 4-byte configuration header with CRC checking, and PROGRAM_B initiates reload. No external microcontroller is required for basic configuration flow.

Does XC3S1400A-4FG676I support differential I/O standards?

Yes, XC3S1400A-4FG676I supports LVDS, RSDS, and BLVDS through dedicated differential I/O pairs in SelectIO banks. Each differential pair requires adjacent pins with matched length routing. Termination resistors must be placed externally, and voltage reference (VREF) must be supplied per bank for proper receiver biasing.

What is the maximum operating frequency of the DCMs in XC3S1400A-4FG676I?

The Digital Clock Managers (DCMs) in XC3S1400A-4FG676I support input frequencies from 1.0 MHz to 200 MHz and generate output frequencies up to 320 MHz. Phase shift resolution is ±125 ps, and jitter is specified at <200 ps peak-to-peak for internally generated clocks under industrial temperature conditions.

Is XC3S1400A-4FG676I pin-compatible with other Spartan-3A devices in FG676 packaging?

XC3S1400A-4FG676I shares the same 676-ball FBGA footprint with XC3S1000-4FG676I and XC3S1600E-4FG676I, including identical power, ground, configuration, and I/O ball assignments. However, logic resource mapping and internal routing differ - bitstreams are not interchangeable without re-synthesis and place-and-route.

What thermal management guidance applies to XC3S1400A-4FG676I in industrial enclosures?

XC3S1400A-4FG676I is rated for –40°C to +100°C junction temperature. In sealed industrial enclosures, a 2-layer thermal pad under the package and 2 oz copper on inner layers reduce thermal resistance. Thermal vias beneath the die area should be filled and capped; airflow >0.5 m/s lowers case temperature by ~8°C at 3.5 W dissipation.