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AMD XC3S1400A-4FGG484C
- Part No.:
- XC3S1400A-4FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S1400A-4FGG484C.pdf
- Description:
- IC FPGA 375 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:340
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Product details
Overview
XC3S1400A-4FGG484C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 1,400,000 system gates, 21,952 logic cells, and 512 kB of total block RAM. It features 376 user I/Os, operates at -4 speed grade (tPD = 4.5 ns), and uses a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It is used in industrial control logic, video interface bridging, and reconfigurable digital signal processing.
For engineers reviewing the XC3S1400A-4FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, block RAM capacity, speed grade timing, and FBGA thermal/mechanical compatibility with PCB layout constraints.
Technical Context
The XC3S1400A-4FGG484C implements a fully SRAM-based configurable logic architecture with dedicated carry chains, distributed RAM, and 18×18 multipliers. It supports SelectIO standards including LVCMOS, LVTTL, PCI, HSTL, and SSTL interfaces across its 376 user I/O pins.
Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled loading. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction - supporting input frequencies from 12 MHz to 240 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 21,952 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| System Gates | 1,400,000 - industry-standard metric for relative logic density vs. ASIC gate count |
| Block RAM | 512 kB - supports large FIFOs, frame buffers, or lookup tables without external memory |
| User I/O Pins | 376 - enables high-pin-count parallel interfaces (e.g., video data buses, memory controllers) |
| Speed Grade | -4 - guarantees worst-case propagation delay ≤4.5 ns for internal logic paths |
| Package | 484-pin FGG (Fine-Pitch BGA) - 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant |
| DCM Units | 8 - provides independent clock domain management for multi-clock system design |
Pinout & Package
XC3S1400A-4FGG484C is housed in a 484-ball Fine-Pitch Ball Grid Array (FGG) package with 23×23 array, 1.0 mm pitch, and standard thermal pad configuration. Pin functions are organized into banks with voltage-referenced I/O standards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 3.3 V supply for configuration circuitry, DCMs, and SelectIO banks |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface support |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reload |
| DONE | Configuration status | Open-drain output indicating successful configuration completion (pulled high externally) |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test and programming access to internal logic and configuration memory |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated 18×18 multipliers | 40 units enable hardware-accelerated DSP functions without consuming logic cells |
| SelectIO technology | Supports 15+ I/O standards per bank, allowing direct interfacing with DDR SDRAM, video DACs, and microcontrollers |
| Digital Clock Manager (DCM) | 8 independent DCMs provide jitter-free clock synthesis, frequency multiplication/division, and phase alignment |
| Configuration security | Bitstream encryption option prevents reverse engineering of programmed logic design |
| Partial reconfiguration support | Enables dynamic logic module updates during operation without full system reset |
Applications
| Industrial Motion Control | Video Interface Bridging |
|---|---|
Use Scenario: Real-time closed-loop servo motor control with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric implements PID controller, pulse-width modulator, and position interpolator; DCMs synchronize encoder sampling and PWM edges. Use Value: Deterministic sub-microsecond latency enables <1 µs jitter on PWM outputs for precise torque regulation. | Use Scenario: Converting HDMI 1.3a pixel data to LVDS panel interface for medical display systems. IC Role / Device Role / Timing Role: Acts as protocol translator and timing bridge; uses block RAM for pixel buffering and DCMs for pixel clock recovery and skew compensation. Use Value: 512 kB block RAM absorbs bursty HDMI traffic while maintaining constant LVDS output rate up to 1080p60. |
| Reconfigurable Test Equipment | Communications Baseband Processing |
Use Scenario: Modular automated test equipment (ATE) requiring field-upgradable signal generation and analysis logic. IC Role / Device Role / Timing Role: Hosts multiple instrument IP cores (arbitrary waveform generator, logic analyzer, pattern generator); configured via JTAG or serial PROM. Use Value: 376 I/Os support simultaneous high-speed digital stimulus capture and analog front-end control lines. | Use Scenario: Channel coding (Viterbi, Turbo) and modulation (QPSK, 16-QAM) in point-to-point wireless backhaul radios. IC Role / Device Role / Timing Role: Implements soft-core DSP pipelines using logic cells and 18×18 multipliers; DCMs align symbol clocks across transmit/receive chains. Use Value: 40 dedicated multipliers accelerate convolutional decoding by >12× versus pure logic implementation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | Lower logic density (17,280 LCs), 396 I/Os, 456-pin FBGA, no built-in encryption | Reduced gate count limits complex DSP or multi-interface integration | Choose when design fits within 1M-gate budget and requires identical speed grade but lower cost |
| XC3S1600E-4FGG484C | Higher density (24,192 LCs), same package/pinout, enhanced DCM features, larger block RAM (576 kB) | Supports more concurrent IP cores and deeper buffering for high-throughput protocols | Choose when migrating legacy designs needing headroom for future feature expansion |
Compared with XC3S1400A-4FGG484C, the XC3S1000-4FGG456C offers cost savings at reduced capacity, while the XC3S1600E-4FGG484C delivers scalable logic and memory headroom - both share the same speed grade and thermal profile but differ in security, I/O routing, and configuration flexibility.
Availability
XC3S1400A-4FGG484C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and reconfigurable test equipment requiring stable component supply and long-term lifecycle support.
Supply support for XC3S1400A-4FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and industrial markets.
The Spartan-3A family was designed for cost-sensitive, high-volume applications requiring reliable performance, low power, and flexible I/O - targeting industrial automation, video infrastructure, and embedded control.
FAQ
What is the maximum operating frequency supported by the DCMs in XC3S1400A-4FGG484C?
The Digital Clock Managers (DCMs) in XC3S1400A-4FGG484C support input frequencies from 12 MHz to 240 MHz and can generate output frequencies up to 320 MHz through multiplication. This capability allows XC3S1400A-4FGG484C to meet timing requirements for high-speed video pixel clocks and communication symbol rates without external PLLs.
Does XC3S1400A-4FGG484C support JTAG boundary-scan testing?
Yes, XC3S1400A-4FGG484C includes full IEEE 1149.1-compliant JTAG circuitry with TCK, TMS, TDI, and TDO pins. This enables in-circuit testing, configuration programming, and debug access to internal logic states - critical for production test coverage and field firmware updates in XC3S1400A-4FGG484C-based systems.
Can XC3S1400A-4FGG484C be configured using a microcontroller?
Yes, XC3S1400A-4FGG484C supports Slave Serial configuration mode, allowing a microcontroller to stream the bitstream over a synchronous serial interface. This enables field-upgradable logic functionality and dynamic reconfiguration - a key advantage of XC3S1400A-4FGG484C in adaptive embedded systems.
What is the purpose of the PROGRAM_B pin on XC3S1400A-4FGG484C?
The PROGRAM_B pin on XC3S1400A-4FGG484C is an active-low asynchronous input that forces the device to clear its configuration memory and restart the configuration process. Asserting PROGRAM_B resets all internal logic and I/O states, making it essential for recovery sequences and safe reinitialization in XC3S1400A-4FGG484C deployments.
Is XC3S1400A-4FGG484C compatible with Xilinx ISE Design Suite?
Yes, XC3S1400A-4FGG484C is fully supported by Xilinx ISE 14.7 - the final official tool release for Spartan-3A devices. Synthesis, place-and-route, timing analysis, and bitstream generation for XC3S1400A-4FGG484C are validated in this environment, ensuring design closure and timing compliance for legacy and maintenance projects.
XC3S1400A-4FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 375
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S1400A-4FGG484C FAQ
1.How can I place an order for XC3S1400A-4FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400A-4FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400A-4FGG484C reliable?
The price and inventory of XC3S1400A-4FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400A-4FGG484C is usually 5 days.
3.What payment methods are accepted for XC3S1400A-4FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400A-4FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400A-4FGG484C?
XC3S1400A-4FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400A-4FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400A-4FGG484C?
For technical support, including XC3S1400A-4FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400A-4FGG484C requirements.
6.How does Aetrix verify that XC3S1400A-4FGG484C is sourced from the original manufacturer or authorized distributors?
All XC3S1400A-4FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400A-4FGG484C meets industry standards.
7.What is the process for return or replacement of XC3S1400A-4FGG484C?
All XC3S1400A-4FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400A-4FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400A-4FGG484C part is unused and in its original packaging.
Return procedure for XC3S1400A-4FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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