AMD XC3S1400A-4FGG484I

Overview

XC3S1400A-4FGG484I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 1,400,000 system gates, 29,952 logic cells, and 512 KB of total block RAM. It features 376 user I/Os, operates at -4 speed grade (t_PD = 4.5 ns), and supports LVCMOS/LVTTL/SSTL/HSTL I/O standards. It is used in industrial control logic and reconfigurable digital signal processing subsystems.

For engineers reviewing the XC3S1400A-4FGG484I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, speed grade timing closure, block RAM depth, and single-ended/differential I/O compatibility for legacy interface bridging.

Technical Context

The XC3S1400A-4FGG484I implements a fine-grained, SRAM-based configurable logic architecture with dedicated carry chains, distributed RAM, and 18×18 multipliers. Its configuration is loaded via Master Serial or JTAG mode using external PROM or processor-controlled SPI.

It integrates Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction across up to eight independent clock domains. All I/O banks support independent V_CCO and termination controls, enabling mixed-voltage interface operation without level shifters.

Key Specifications

Pinout & Package

XC3S1400A-4FGG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 array, 1.0 mm ball pitch, and 29.4 mm × 29.4 mm body size. Thermal pad on underside requires solder paste stencil design per Xilinx UG380.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O expansion applications.

Compared with XC3S1400A-4FGG484I, the XC3S1000-4FGG456C offers lower cost and power but reduced I/O and memory; the XC3S1600E-4FGG484C provides greater logic capacity and DSP capability at identical footprint, easing migration paths for scaling designs.

Availability

XC3S1400A-4FGG484I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and video processing applications requiring stable component supply and long-term obsolescence management.

Supply support for XC3S1400A-4FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines.

The Spartan-3A family was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with robust I/O flexibility and industrial-grade reliability.

FAQ

What is the operating temperature range for XC3S1400A-4FGG484I?

The XC3S1400A-4FGG484I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification ensures reliable functionality in factory-floor controllers, outdoor telecom equipment, and motor drive enclosures where ambient conditions exceed commercial-grade limits. The "I" suffix explicitly denotes industrial temperature grade per Xilinx DS229.

Does XC3S1400A-4FGG484I support JTAG boundary-scan testing?

Yes, XC3S1400A-4FGG484I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. The TDI, TDO, TMS, TCK, and TRTS pins are dedicated and electrically compliant with JTAG specifications. Configuration via JTAG is supported alongside Master Serial mode, enabling debug and field updates without external PROM.

How many Digital Clock Managers (DCMs) does XC3S1400A-4FGG484I contain?

XC3S1400A-4FGG484I contains two fully independent Digital Clock Managers (DCMs). Each DCM supports input clock frequencies from 5 MHz to 333 MHz, provides up to eight phase-shifted or frequency-multiplied outputs, and includes dynamic reconfiguration capability. These DCMs are essential for synchronizing multiple clock domains in video timing and data acquisition systems.

Can XC3S1400A-4FGG484I configure itself from a serial PROM without external controller intervention?

Yes, XC3S1400A-4FGG484I supports Master Serial configuration mode, allowing autonomous boot from standard SPI-compatible PROMs such as Xilinx Platform Flash XL. Upon power-up, the FPGA initiates readback of the configuration bitstream directly, eliminating need for host processor involvement. This enables truly standalone operation in embedded control modules.

What is the maximum differential I/O standard supported by XC3S1400A-4FGG484I?

XC3S1400A-4FGG484I supports LVDS, RSDS, and BLVDS differential I/O standards across compatible I/O banks. LVDS operation is validated up to 622 Mbps per channel with proper termination and layout. These standards are used in high-speed serial links, camera interfaces, and backplane communication where noise immunity and low power are critical.