AMD XC3S1400A-4FGG676C

Overview

XC3S1400A-4FGG676C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 1,400,000 system gates, 21,952 logic cells, and 512 kB of total block RAM. It features 480 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at -4 speed grade (tPD = 4.8 ns). It is used in industrial control logic, video interface bridging, and reconfigurable embedded processing.

For engineers reviewing the XC3S1400A-4FGG676C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, block RAM capacity, speed grade timing, and FBGA676 thermal/mechanical compatibility with existing PCB layouts.

Technical Context

The XC3S1400A-4FGG676C implements a fully SRAM-based configurable logic architecture with dedicated carry chains, distributed RAM, and 18×18 multipliers. It supports SelectIO standards including LVCMOS, LVTTL, PCI, HSTL, and SSTL across its 480 user I/Os.

Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. Built-in Digital Clock Managers (DCMs) provide clock synthesis, phase shifting, and duty cycle correction for up to eight independent clock domains.

Key Specifications

Pinout & Package

XC3S1400A-4FGG676C is housed in a 676-ball Fine-Pitch Ball Grid Array (FGG) package with 27×27 array, 1.0 mm ball pitch, and thermal pad center. Pin functions are defined by configuration mode, bank voltage, and I/O standard assignment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1400A-4FGG676C, XC3S1000-4FGG456C offers lower cost and footprint at the expense of logic and I/O headroom, while XC3S1600E-4FGG484C delivers greater routing flexibility and logic capacity in a mechanically distinct package requiring layout revision.

Availability

XC3S1400A-4FGG676C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and avionics data acquisition requiring stable component supply and long-term lifecycle support.

Supply support for XC3S1400A-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Spartan-3A family was designed for cost-optimized, high-volume embedded applications requiring reliable reconfigurable logic with integrated clock management and I/O flexibility.

FAQ

What is the maximum operating frequency supported by XC3S1400A-4FGG676C?

The XC3S1400A-4FGG676C has a -4 speed grade, guaranteeing a maximum clock-to-output delay of 4.8 ns. Its internal DCMs support input frequencies up to 200 MHz and can generate output clocks up to 320 MHz with jitter reduction. Actual system frequency depends on design placement, routing, and I/O standard constraints.

Does XC3S1400A-4FGG676C support JTAG boundary-scan testing?

Yes, XC3S1400A-4FGG676C fully supports IEEE 1149.1 JTAG boundary-scan for device programming, debugging, and interconnect testing. The TAP controller enables configuration via JTAG, and the BSCAN primitive allows access to internal logic states during operation.

What configuration modes are available for XC3S1400A-4FGG676C?

XC3S1400A-4FGG676C supports Master Serial (via on-chip oscillator), Slave Serial, Slave SelectMAP, and JTAG configuration modes. Configuration bitstreams may be loaded from external SPI PROM, microcontroller, or host processor through dedicated configuration pins.

Is XC3S1400A-4FGG676C RoHS compliant?

Yes, XC3S1400A-4FGG676C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FGG676 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3.

Can XC3S1400A-4FGG676C implement PCI interface logic?

Yes, XC3S1400A-4FGG676C supports PCI 2.2-compliant signaling through its SelectIO banks configured for 3.3 V LVTTL with programmable drive strength and slew rate control. It requires external PCI termination resistors and adheres to PCI timing specifications when implemented per Xilinx UG380 guidelines.