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AMD XC3S1400A-4FGG676I
- Part No.:
- XC3S1400A-4FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S1400A-4FGG676I.pdf
- Description:
- IC FPGA 502 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,864
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Product details
Overview
XC3S1400A-4FGG676I from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 1,400,000 system gates, 216 I/O pins, and a -4 speed grade with industrial temperature range (-40°C to +100°C). It integrates 128 embedded 18×18 multipliers, 128 Kbits of block RAM, and supports SelectIO standards including LVCMOS, LVTTL, and SSTL.
For engineers reviewing the XC3S1400A-4FGG676I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count, embedded multiplier density, block RAM capacity, and industrial-grade thermal performance for reconfigurable logic in space-constrained embedded control systems.
Technical Context
The XC3S1400A-4FGG676I implements a fine-grained, SRAM-based configurable logic architecture with 11,648 configurable logic blocks (CLBs), each containing two slices with four LUTs and eight flip-flops. It supports distributed RAM and shift register functionality within CLBs.
Configuration is performed via Master Serial or JTAG mode using external PROM or processor-controlled interface. The device includes Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction across up to 16 clock outputs per DCM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,648 CLBs - provides scalable combinational and sequential logic density for mid-range digital signal processing and protocol bridging. |
| System Gates | 1.4M - indicates gate-equivalent capacity for ASIC-style logic mapping and RTL synthesis targeting. |
| I/O Pins | 216 user-configurable I/O - enables high-pin-count interface consolidation (e.g., parallel bus, camera sensor, memory controller). |
| Block RAM | 128 Kbits - supports dual-port FIFOs, coefficient storage, or small on-chip buffers without external memory. |
| Embedded Multipliers | 128 × 18×18-bit - accelerates fixed-point arithmetic in motor control, filter design, and real-time encoding. |
| Speed Grade | -4 - guarantees timing closure at 450 MHz internal clocking with worst-case industrial temperature derating. |
| Operating Temp | -40°C to +100°C - validated for deployment in industrial automation, outdoor communications, and transportation electronics. |
Pinout & Package
XC3S1400A-4FGG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 27×27 array configuration. The package supports standard PCB assembly processes and provides thermal dissipation suitable for sustained 1.2 V core operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required for FPGA fabric and CLB operation; decoupling critical for signal integrity. |
| VCCO_0–VCCO_6 | I/O bank power | 1.2–3.3 V selectable per bank; enables mixed-voltage interface support (e.g., 3.3 V PCIe sideband + 1.8 V memory). |
| PROGRAM_B | Active-low configuration initiator | Pulls low to reset configuration state and initiate reload from external PROM or host processor. |
| DONE | Configuration status indicator | Open-drain output asserted high when bitstream loading completes and device enters user mode. |
| CCLK | Configuration clock input | Drives serial bitstream loading; may be driven externally or generated internally by DCM for self-booting designs. |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs per device provide jitter-reduced clock synthesis, phase alignment, and dynamic frequency scaling without external PLL components. |
| SelectIO Technology | Supports 19 I/O standards including LVDS, RSDS, and HSTL - enables direct interfacing to ADCs, FPD-Link, and DDR SDRAM without level-shifting ICs. |
| MultiBoot Configuration | Allows up to four independent bitstreams stored in external SPI PROM; enables field-upgradable firmware and fail-safe fallback modes. |
| Power-On Reset (POR) | Internal circuit ensures reliable initialization sequence and prevents metastability during voltage ramp-up across all supply domains. |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo positioning in CNC machines and robotic arms requiring deterministic latency and multi-axis synchronization. IC Role / Device Role / Timing Role: FPGA fabric executes PID computation, encoder interpolation, and PWM generation; DCMs lock to master motion clock and distribute phase-aligned timing to I/O banks. Use Value: 216 I/O pins enable simultaneous connection to encoders, analog inputs, and motor drivers; 128 multipliers accelerate real-time trajectory calculation. | Use Scenario: Converting MIPI CSI-2 camera streams to parallel RGB/YUV for FPGA-based image preprocessing in machine vision systems. IC Role / Device Role / Timing Role: Configurable I/O banks receive high-speed differential video data; internal logic deserializes and formats pixel streams for downstream processing. Use Value: SelectIO support for MIPI D-PHY-compatible signaling (via LVDS emulation) and 128 Kbits block RAM buffer full frames for noise reduction algorithms. |
| Secure Communications Module | Programmable Logic Controller (PLC) I/O Expansion |
Use Scenario: Field-deployable encryption gateway handling AES-128/256 acceleration and protocol parsing for SCADA networks. IC Role / Device Role / Timing Role: Reconfigurable logic implements cipher pipelines and packet inspection engines; DCMs synchronize crypto engine clocks with network PHY timing. Use Value: 1.4M system gates accommodate multiple concurrent cipher cores; industrial temp rating ensures reliability in uncontrolled telecom cabinets. | Use Scenario: Modular I/O backplane extension for legacy PLCs needing additional isolated digital/analog channels and protocol translation (e.g., Modbus RTU ↔ EtherCAT). IC Role / Device Role / Timing Role: FPGA acts as intelligent I/O concentrator - managing isolation, timing, and protocol conversion between field devices and main CPU. Use Value: 216 I/O pins support 64-channel digital input + 32-channel analog input + dual Ethernet MAC interfaces on single device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | 1.0M gates, 456-ball FBGA, commercial temp (0°C to +85°C), 17,280 logic cells | Limited I/O (195 pins) and no industrial temp rating; lower multiplier count (96) | Choose for cost-sensitive, non-industrial applications where board space and thermal margin allow smaller package. |
| XC3S1600E-4FGG484I | 1.6M gates, 484-ball FBGA, industrial temp, 15,888 logic cells, 144 multipliers | Higher gate count but fewer I/O pins (252 vs. 216) and larger footprint; lacks MultiBoot support | Prefer when additional logic resources are needed over I/O flexibility, and single-bitstream configuration suffices. |
Compared with XC3S1400A-4FGG676I, the XC3S1000-4FGG456C trades industrial reliability and I/O count for lower cost and smaller footprint, while the XC3S1600E-4FGG484I increases logic density at the expense of configuration flexibility and I/O scalability - making XC3S1400A-4FGG676I optimal for balanced industrial I/O + processing workloads.
Availability
XC3S1400A-4FGG676I is available at Aetrix Electronics and suitable for industrial motion control, video interface bridge, secure communications module, and programmable logic controller (PLC) I/O expansion requiring stable component supply and long-term lifecycle assurance.
Supply support for XC3S1400A-4FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-optimized, high-volume embedded applications.
The Spartan-3A product line was designed specifically for industrial, automotive, and communications equipment requiring reconfigurable logic with predictable timing, low power, and extended temperature operation - not general-purpose computing.
FAQ
What is the maximum operating frequency of the XC3S1400A-4FGG676I?
The XC3S1400A-4FGG676I has a -4 speed grade, guaranteeing internal logic operation up to 450 MHz under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design placement, routing, and resource utilization - verified through static timing analysis in Xilinx ISE software using the XC3S1400A-4FGG676I device model.
Does the XC3S1400A-4FGG676I support JTAG boundary-scan testing?
Yes, the XC3S1400A-4FGG676I fully complies with IEEE 1149.1 (JTAG) standard. It includes dedicated TDI, TDO, TMS, and TCK pins for boundary-scan testing, in-system programming, and debug access. The JTAG interface remains active regardless of configuration state, enabling verification of solder joints and interconnects before and after bitstream loading for the XC3S1400A-4FGG676I.
Can the XC3S1400A-4FGG676I configure itself from SPI flash without an external controller?
Yes, the XC3S1400A-4FGG676I supports Master Serial mode, allowing autonomous configuration from industry-standard SPI serial PROMs (e.g., XCFxxP series). In this mode, the XC3S1400A-4FGG676I generates its own CCLK and drives the PROM's address lines, eliminating need for microcontroller intervention during power-up.
How many Digital Clock Managers (DCMs) does the XC3S1400A-4FGG676I contain?
The XC3S1400A-4FGG676I contains two Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, frequency multiplication/division, and duty cycle correction. These DCMs are essential for synchronizing multiple I/O banks and internal logic domains in complex timing-critical applications using the XC3S1400A-4FGG676I.
Is the XC3S1400A-4FGG676I RoHS compliant and lead-free?
Yes, the XC3S1400A-4FGG676I is manufactured in a lead-free, RoHS-compliant process. The FGG676 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation for the XC3S1400A-4FGG676I is available in AMD's official product change notices and material declarations.
XC3S1400A-4FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 502
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S1400A-4FGG676I FAQ
1.How can I place an order for XC3S1400A-4FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400A-4FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400A-4FGG676I reliable?
The price and inventory of XC3S1400A-4FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400A-4FGG676I is usually 5 days.
3.What payment methods are accepted for XC3S1400A-4FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400A-4FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400A-4FGG676I?
XC3S1400A-4FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400A-4FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400A-4FGG676I?
For technical support, including XC3S1400A-4FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400A-4FGG676I requirements.
6.How does Aetrix verify that XC3S1400A-4FGG676I is sourced from the original manufacturer or authorized distributors?
All XC3S1400A-4FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400A-4FGG676I meets industry standards.
7.What is the process for return or replacement of XC3S1400A-4FGG676I?
All XC3S1400A-4FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400A-4FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400A-4FGG676I part is unused and in its original packaging.
Return procedure for XC3S1400A-4FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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