AMD XC3S1400A-4FT256I

Overview

XC3S1400A-4FT256I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 1,400,000 system gates, 256-pin FTBGA package, and -4 speed grade supporting 500 MHz I/O operation. It integrates 17,280 logic cells, 576 Kbits of block RAM, and supports LVCMOS25/LVCMOS33 I/O standards for industrial control and embedded vision interface applications.

For engineers reviewing the XC3S1400A-4FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded RAM capacity, and thermal performance in compact BGA layouts.

Technical Context

The XC3S1400A-4FT256I implements a fully reconfigurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry chains for arithmetic functions. It includes twelve 18×18 multipliers and supports SelectIO technology for programmable I/O standards including SSTL, HSTL, and PCI.

Configuration is performed via Master Serial mode using external PROM or JTAG, with internal startup circuitry enabling automatic configuration after power-up. The device operates over industrial temperature range (–40°C to +85°C) and requires dual-supply voltages: 1.2 V core and 2.5 V or 3.3 V I/O.

Key Specifications

Pinout & Package

XC3S1400A-4FT256I uses a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and exposed thermal pad for enhanced heat dissipation in high-density PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1400A-4FT256I, XC3S1000-4FT256I offers lower cost but constrains logic reuse and feature expansion, while XC3S1600E-4FT256C trades industrial reliability for higher drive capability in benign thermal settings.

Availability

XC3S1400A-4FT256I is available at Aetrix Electronics and suitable for industrial motion control, machine vision interface, and programmable logic controller (PLC) applications requiring stable component supply across extended product lifecycles.

Supply support for XC3S1400A-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.

The Spartan-3A product line was designed specifically for industrial automation, test equipment, and video interface systems requiring predictable timing, moderate logic density, and long-term availability.

FAQ

What is the maximum operating frequency of the XC3S1400A-4FT256I logic fabric?

The XC3S1400A-4FT256I -4 speed grade guarantees 100% timing closure for logic paths operating up to 333 MHz in typical conditions. This is verified through static timing analysis using Xilinx ISE tools and reflects worst-case performance across voltage and temperature corners.

Does the XC3S1400A-4FT256I support JTAG boundary-scan testing?

Yes, the XC3S1400A-4FT256I includes full IEEE 1149.1-compliant JTAG circuitry with TCK, TMS, TDI, and TDO pins. This enables in-system programming, debug access, and production-level boundary-scan testing without requiring external configuration devices.

Can the XC3S1400A-4FT256I operate with a single 3.3 V supply?

No, the XC3S1400A-4FT256I requires two separate supplies: 1.2 V ±3% for the core logic and a configurable 1.8/2.5/3.3 V for I/O banks. Using only 3.3 V will damage the core voltage regulator and prevent functional operation of the XC3S1400A-4FT256I.

What configuration methods are supported by the XC3S1400A-4FT256I?

The XC3S1400A-4FT256I supports Master Serial (via external SPI PROM), JTAG, and Slave SelectMAP modes. Configuration bitstream loading is initiated automatically on power-up when PROGRAM_B is held high, making it suitable for standalone embedded deployment of the XC3S1400A-4FT256I.

Is the XC3S1400A-4FT256I RoHS compliant and lead-free?

Yes, the XC3S1400A-4FT256I is manufactured in a lead-free, RoHS-compliant process. The FTBGA package uses matte tin surface finish on solder balls, meeting JEDEC J-STD-609 Category 1 requirements for the XC3S1400A-4FT256I.