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AMD XC3S1400A-4FTG256C
- Part No.:
- XC3S1400A-4FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S1400A-4FTG256C.pdf
- Description:
- IC FPGA 161 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
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Product details
Overview
XC3S1400A-4FTG256C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 1,400,000 system gates, 256-pin FTBGA package, 186 I/O pins, and -4 speed grade. It integrates up to 216 distributed RAM blocks, supports LVCMOS/LVTTL I/O standards, and targets cost-sensitive embedded control and industrial interface applications.
For engineers reviewing the XC3S1400A-4FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, logic cell density, supported voltage rails (3.3V/2.5V), and availability of dedicated DSP slices for signal processing tasks.
Technical Context
The XC3S1400A-4FTG256C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic operations. It includes block RAM (18 kbits total), digital clock managers (DCMs) for clock synthesis and phase alignment, and supports SelectIO™ technology for multi-standard I/O interfacing.
Configuration is performed via master serial mode using external PROM or JTAG boundary-scan. The device operates at core voltage of 1.2 V and supports I/O banks independently configurable for 3.3 V, 2.5 V, 1.8 V, or 1.5 V signaling levels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 28,672 - provides combinational and sequential logic capacity for medium-complexity digital controllers |
| System Gates | 1,400,000 - indicates overall logic density suitable for protocol bridging and peripheral aggregation |
| I/O Pins | 186 - supports multi-interface connectivity including parallel buses and serial peripherals |
| Block RAM | 216 × 18 kbits - enables local data buffering, FIFOs, and small lookup tables without external memory |
| DCMs | 4 - delivers jitter-reduced clocks, frequency synthesis, and phase shifting for synchronous design timing closure |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and thermal budget for PCB layout |
| Speed Grade | -4 - specifies maximum operating frequency for timing-critical paths (e.g., 333 MHz DCM output) |
Pinout & Package
XC3S1400A-4FTG256C is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and standard JEDEC MO-251AC footprint. Thermal pad on underside requires solder paste stencil design per Xilinx UG380.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be filtered with low-ESR ceramic capacitors near package corner balls |
| VCCAUX | Auxiliary power rail | Supplies configuration logic and DCMs; requires separate 3.3 V regulation |
| VCCO_0 | I/O bank 0 power | Configurable for 3.3 V/2.5 V/1.8 V/1.5 V; sets voltage level for associated I/O pins |
| PROGRAM_B | Active-low configuration initiator | Pulling low forces reconfiguration from PROM or JTAG; must be pulled high during normal operation |
| DONE | Configuration status indicator | Open-drain output; goes high-Z after successful bitstream load and internal initialization |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant programming, debugging, and interconnect testing |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Digital Clock Managers (DCMs) | Four independent DCMs provide deterministic clock skew control, duty-cycle correction, and frequency multiplication/division without external PLLs |
| SelectIO™ Technology | Supports mixed-voltage I/O banks enabling direct interfacing with legacy 3.3 V peripherals and modern 1.8 V sensors |
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-LUTs + flip-flops, enabling efficient implementation of state machines and arithmetic pipelines |
| Embedded Block RAM | 216 × 18-kbit blocks allow dual-port RAM instantiation for simultaneous read/write in control loops or data acquisition buffers |
| Multi-Standard Configuration Interface | Supports master serial PROM, slave serial, JTAG, and boundary-scan modes - simplifies production programming and field updates |
Applications
| Industrial PLC I/O Expansion | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Adding isolated digital input/output channels to programmable logic controller backplanes. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and real-time I/O aggregator between fieldbus (e.g., CANopen) and CPU subsystem. Use Value: Leverages 186 I/O pins and DCM-based timing control to synchronize sensor sampling and actuator drive signals within 1 µs jitter. | Use Scenario: Implementing OBD-II to USB/CAN gateway in vehicle service tools. IC Role / Device Role / Timing Role: FPGA serves as flexible bridge between microcontroller UART and automotive CAN transceiver, handling protocol framing and error recovery. Use Value: Uses SelectIO™ banks to interface 3.3 V MCU and 5 V CAN PHY simultaneously without level shifters. |
| Medical Imaging Data Formatter | Test Equipment Pattern Generator |
Use Scenario: Formatting raw pixel streams from CMOS image sensors into standardized video interfaces (e.g., BT.656). IC Role / Device Role / Timing Role: FPGA performs pixel clock domain crossing, line buffering, and sync pulse insertion using block RAM and DCMs. Use Value: 216 × 18-kbit RAM blocks enable full-line buffering for 1280×1024@60 Hz imaging without external memory. | Use Scenario: Generating high-speed digital stimulus patterns for IC functional testing. IC Role / Device Role / Timing Role: FPGA functions as deterministic pattern sequencer with precise edge placement controlled by DCM outputs. Use Value: -4 speed grade supports 333 MHz DCM output, enabling 166.5 MHz pattern rates with sub-nanosecond timing resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FTG256C | 1,000,000 system gates, 21,504 logic cells, identical package and pinout | Limited logic capacity reduces support for multi-protocol stacks or large FIFO buffers | Choose when design fits within lower gate count and cost reduction is primary driver |
| XC3S1600E-4FTG256C | 1,600,000 system gates, 33,280 logic cells, same package but higher static power | Additional logic enables integration of soft-core processors (e.g., MicroBlaze) alongside custom logic | Choose when expanding functionality beyond XC3S1400A-4FTG256C's capacity without changing PCB layout |
Compared with XC3S1000-4FTG256C and XC3S1600E-4FTG256C, the XC3S1400A-4FTG256C offers balanced logic density and I/O count for mid-tier embedded control - avoiding overdesign while retaining headroom for feature upgrades.
Availability
XC3S1400A-4FTG256C is available at Aetrix Electronics and suitable for industrial automation, test equipment, and medical electronics requiring stable component supply across extended product lifecycles.
Supply support for XC3S1400A-4FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan family as part of its adaptive computing portfolio for cost-optimized, high-volume embedded applications.
The Spartan-3A FPGA family was designed specifically for non-volatile, low-power, and high-I/O-count applications in industrial control, communications infrastructure, and consumer electronics where ASIC economics are prohibitive.
FAQ
What is the maximum operating frequency of the XC3S1400A-4FTG256C?
The XC3S1400A-4FTG256C has a -4 speed grade, meaning its internal logic paths are characterized to operate reliably up to 333 MHz when driven by DCM outputs. Actual achievable frequency depends on design routing, temperature, and voltage conditions - verified timing analysis must be performed using Xilinx ISE software with the specific XC3S1400A-4FTG256C device model.
Does the XC3S1400A-4FTG256C support JTAG programming?
Yes, the XC3S1400A-4FTG256C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and interconnect testing. Pins TCK, TMS, TDI, and TDO are dedicated for this purpose and appear in the official pinout documentation. JTAG mode allows in-system programming without requiring external PROM devices.
What I/O standards are supported by the XC3S1400A-4FTG256C?
The XC3S1400A-4FTG256C supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards across its 12 configurable I/O banks. Each bank can be independently set to 3.3 V, 2.5 V, 1.8 V, or 1.5 V, enabling mixed-voltage interfacing. This capability is documented in Xilinx DS225 and confirmed in UG380.
How many block RAMs does the XC3S1400A-4FTG256C contain?
The XC3S1400A-4FTG256C contains 216 block RAMs, each 18 kbits in size, for a total of 3,888 kbits. These are true dual-port RAMs usable for FIFOs, lookup tables, or data buffering. Their placement and routing are fixed in the silicon architecture and mapped in the Xilinx ISE device library for XC3S1400A-4FTG256C.
Is the XC3S1400A-4FTG256C pin-compatible with other Spartan-3A devices?
The XC3S1400A-4FTG256C shares the same 256-ball FTBGA package and pinout with XC3S1000-4FTG256C and XC3S1600E-4FTG256C, enabling PCB reuse across that subset. However, not all pins have identical electrical behavior or function mapping - users must verify I/O bank voltage assignments and configuration pin usage before substitution.
XC3S1400A-4FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 161
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S1400A-4FTG256C FAQ
1.How can I place an order for XC3S1400A-4FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400A-4FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400A-4FTG256C reliable?
The price and inventory of XC3S1400A-4FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400A-4FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S1400A-4FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400A-4FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400A-4FTG256C?
XC3S1400A-4FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400A-4FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400A-4FTG256C?
For technical support, including XC3S1400A-4FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400A-4FTG256C requirements.
6.How does Aetrix verify that XC3S1400A-4FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S1400A-4FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400A-4FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S1400A-4FTG256C?
All XC3S1400A-4FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400A-4FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400A-4FTG256C part is unused and in its original packaging.
Return procedure for XC3S1400A-4FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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