AMD XC3S1400A-4FTG256I

Overview

XC3S1400A-4FTG256I from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 1,400,000 system gates, 256 I/O pins, and a 4 ns input-to-output delay. It integrates 18,688 logic cells, 576 Kbits of block RAM, and supports LVCMOS25/LVCMOS33 I/O standards. It is used in industrial control logic replacement and reconfigurable digital signal processing subsystems.

For engineers reviewing the XC3S1400A-4FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, block RAM capacity, and -4 speed grade timing performance for deterministic logic implementation.

Technical Context

The XC3S1400A-4FTG256I implements a fine-grained, SRAM-based configurable logic architecture with dedicated carry chains and distributed RAM. It includes 24 multipliers (18×18-bit), 24 Digital Clock Managers (DCMs), and supports SelectIO™ technology for single-ended and differential signaling.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device operates at 1.2 V core voltage and supports 3.3 V or 2.5 V I/O banks with independent bank voltage control.

Key Specifications

Pinout & Package

XC3S1400A-4FTG256I is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package with 1.0 mm pitch and 17×17 array. Pin assignment follows Xilinx Spartan-3A footprint standard for FTG256.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1400A-4FTG256I, XC3S1000-4FTG256I reduces logic and memory for cost-constrained implementations, while XC3S1600E-4FTG256I extends capacity within identical PCB footprint and thermal envelope - enabling scalable FPGA adoption without layout revision.

Availability

XC3S1400A-4FTG256I is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and avionics sensor interface designs requiring stable component supply over extended production lifecycles.

Supply support for XC3S1400A-4FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Spartan family as part of its adaptive computing portfolio for cost-sensitive, high-volume applications.

The Spartan-3A product line was engineered for non-volatile, reprogrammable logic in industrial control, communications infrastructure, and embedded vision - emphasizing I/O flexibility, deterministic timing, and long-term manufacturability.

FAQ

What is the core voltage requirement for XC3S1400A-4FTG256I?

The XC3S1400A-4FTG256I requires a regulated 1.2 V ±3% core supply (VCCINT) delivered to pin A1. This voltage powers the internal logic fabric and CLBs. Deviation beyond tolerance risks timing violations or configuration loss. Decoupling capacitors must be placed within 10 mm of the pin per Xilinx UG331 guidelines. The XC3S1400A-4FTG256I does not support dynamic voltage scaling.

Does XC3S1400A-4FTG256I support JTAG programming in-system?

Yes, XC3S1400A-4FTG256I supports IEEE 1149.1 JTAG boundary-scan for in-system programming and debugging. The TDI, TDO, TCK, and TMS pins are assigned to dedicated JTAG port locations (e.g., T12, U12, T11, R11). Configuration via JTAG bypasses external PROM and enables field updates. The XC3S1400A-4FTG256I JTAG chain can be daisy-chained with other Xilinx devices sharing compatible voltage levels.

How many Digital Clock Managers (DCMs) are integrated in XC3S1400A-4FTG256I?

The XC3S1400A-4FTG256I integrates 24 Digital Clock Managers (DCMs), each capable of frequency synthesis, phase shifting, and duty-cycle correction. These DCMs operate independently per clock region and support input frequencies from 5 MHz to 333 MHz. The XC3S1400A-4FTG256I uses DCMs to eliminate external clock generators in applications like video timing and motor control where jitter <100 ps RMS is required.

What I/O standards are supported by XC3S1400A-4FTG256I?

XC3S1400A-4FTG256I supports LVCMOS12/15/18/25/33, LVTTL, PCI, GTL, HSTL, SSTL, and differential standards including LVDS, RSDS, and LVPECL. Each of the 16 I/O banks is independently configurable for voltage and standard. The XC3S1400A-4FTG256I does not support MIPI or DDR4 signaling natively - those require external PHYs or newer FPGA families.

Is XC3S1400A-4FTG256I RoHS compliant and lead-free?

Yes, XC3S1400A-4FTG256I is RoHS compliant and manufactured with lead-free (Pb-free) packaging per EU Directive 2011/65/EU. The FTG256 package uses matte tin finish on all solder balls. Xilinx documentation (DS312 v2.5) confirms exemption status for homogeneous materials and full compliance with Annex II substance restrictions. The XC3S1400A-4FTG256I meets JEDEC J-STD-020 moisture sensitivity level 3 requirements.