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AMD XC3S1400A-5FGG484C
- Part No.:
- XC3S1400A-5FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S1400A-5FGG484C.pdf
- Description:
- IC FPGA 375 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,852
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Product details
Overview
XC3S1400A-5FGG484C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 1,400,000 system gates, 29,952 logic cells, and 576 Kbits of block RAM. It operates at -5 speed grade (118 MHz system clock), uses 1.2 V core voltage, and is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA). It targets high-volume embedded control and interface bridging applications.
For engineers reviewing the XC3S1400A-5FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (376 user I/Os), differential signaling support (LVDS, RSDS), embedded multiplier usage (32 × 18-bit), and thermal performance in industrial temperature range (0°C to 85°C).
Technical Context
The XC3S1400A-5FGG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It supports SelectIO standards including LVCMOS, LVTTL, PCI, HSTL, SSTL, and differential interfaces such as LVDS and RSDS.
It integrates 32 embedded 18×18 multipliers for DSP-intensive tasks and provides up to 576 Kbits of fast block RAM organized in 128 blocks of 4,096 bits each. Configuration is performed via master serial, slave serial, or JTAG modes using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,952 - determines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 1,400,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| Block RAM | 576 Kbits across 128 blocks - enables on-chip FIFOs, buffers, and data storage without external memory |
| User I/O Pins | 376 - supports wide parallel buses, multiple peripheral interfaces, or high-pin-count sensor aggregation |
| Embedded Multipliers | 32 × 18-bit - accelerates arithmetic operations in motor control, filtering, and protocol processing |
| Speed Grade | -5 (118 MHz max system clock) - defines timing closure margin for synchronous design implementation |
| Operating Temperature | 0°C to +85°C - qualifies for commercial and industrial ambient environments |
Pinout & Package
XC3S1400A-5FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 array, 1.0 mm ball pitch, and 27 mm × 27 mm body size. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be locally decoupled with low-ESR ceramic capacitors |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration and I/O banks - shared across multiple banks |
| A1 | PROGRAM_B | Active-low asynchronous reset - initiates reconfiguration when pulled low |
| D3 | INIT_B | Open-drain status output - indicates configuration status and CRC error detection |
| E2 | CCLK | Configuration clock input - drives internal shift registers during master serial mode |
| H1 | DONE | Open-drain completion indicator - goes high when configuration completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Digital Clock Managers (DCMs) | Four DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication/division |
| SelectIO Technology | Supports 19 I/O standards including LVDS, RSDS, and SSTL - enables direct interfacing with memory, ADCs, and FPGAs |
| MultiBoot Configuration | Allows two independent bitstreams stored in external PROM - enables field-upgradable firmware and fail-safe recovery |
| Power-On Reset Circuitry | Internal POR ensures reliable initialization without external reset IC - reduces BOM count and board space |
| IEEE 1149.1 JTAG Boundary Scan | Enables in-system testing and programming - simplifies production test and debug workflows |
Applications
| Industrial Motion Control | Video Interface Bridging |
|---|---|
Use Scenario: Real-time closed-loop servo drive with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric implements position loop computation, PWM timing engine, and encoder interpolation logic. Use Value: 32 embedded multipliers enable simultaneous PID calculations; 376 I/Os route encoder A/B/Z signals, analog inputs, and isolated gate drivers. | Use Scenario: Converting HDMI 1.3a video stream to LVDS panel interface for industrial displays. IC Role / Device Role / Timing Role: Acts as protocol translator and timing controller with pixel clock domain crossing. Use Value: SelectIO supports both TMDS input (via resistor termination) and LVDS output; DCMs clean and retimes clocks across domains. |
| Medical Imaging Data Acquisition | Automated Test Equipment (ATE) |
Use Scenario: High-speed digitization and preprocessing of ultrasound echo data from 128-channel transducer arrays. IC Role / Device Role / Timing Role: Synchronizes ADC sampling, applies FIR filtering, and buffers data before PCIe transfer. Use Value: 576 Kbits block RAM stores multiple scan-line buffers; 18×18 multipliers execute real-time beamforming coefficients. | Use Scenario: Pin electronics per channel in modular ATE platforms requiring programmable waveform generation and response analysis. IC Role / Device Role / Timing Role: Configurable digital pattern generator and comparator with sub-ns timing resolution. Use Value: -5 speed grade guarantees 8.4 ns minimum clock-to-out delay; 376 I/Os support parallel 32-channel DUT interfacing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000A-5FGG484C | 1,000,000 system gates, 21,504 logic cells, 432 Kbits block RAM - lower density and memory capacity | Suitable for less complex control logic or smaller interface bridges where resource headroom is not required | Select when design fits within reduced resources and cost sensitivity outweighs future scalability needs |
| XC3S1600E-5FGG484C | 1,600,000 system gates, 33,072 logic cells, 512 Kbits block RAM - higher logic density but less block RAM than XC3S1400A-5FGG484C | Better suited for compute-heavy logic with moderate memory needs, such as protocol stack offload or encryption acceleration | Choose when additional CLBs are critical and block RAM reduction is acceptable for target algorithm footprint |
Compared with XC3S1000A-5FGG484C and XC3S1600E-5FGG484C, the XC3S1400A-5FGG484C offers balanced logic density and block RAM-ideal for applications requiring both substantial state-machine complexity and on-chip data buffering, such as real-time video processing or multi-axis motion control.
Availability
XC3S1400A-5FGG484C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging subsystems, automated test equipment, and video interface bridging requiring stable component supply and long-term manufacturability.
Supply support for XC3S1400A-5FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs acquired through the Xilinx merger. The company focuses on high-performance, energy-efficient programmable logic for data center, AI, and embedded markets.
The Spartan-3A family was designed for cost-sensitive, high-volume applications requiring reliable logic density, flexible I/O, and low-power operation - especially in industrial automation, video, and communications infrastructure.
FAQ
What is the maximum operating frequency of the XC3S1400A-5FGG484C?
The XC3S1400A-5FGG484C has a -5 speed grade, supporting a maximum system clock frequency of 118 MHz under typical conditions. This rating applies to internal logic paths meeting timing constraints after place-and-route; actual achievable frequency depends on design topology, routing congestion, and I/O standard selection.
Does the XC3S1400A-5FGG484C support differential I/O standards?
Yes, the XC3S1400A-5FGG484C supports LVDS and RSDS differential signaling across compatible I/O banks. Each differential pair requires adjacent pins within the same bank and proper termination. Support is implemented in hardware via SelectIO circuitry - no external components needed beyond standard 100 Ω differential termination.
How many configuration modes does the XC3S1400A-5FGG484C support?
The XC3S1400A-5FGG484C supports three primary configuration modes: master serial (using on-chip oscillator), slave serial (clocked by external source), and JTAG (boundary-scan programming). It also supports MultiBoot with dual-bitstream capability when used with external SPI PROM.
What is the purpose of the VCCAUX supply on the XC3S1400A-5FGG484C?
The VCCAUX supply powers internal configuration circuitry, JTAG TAP controller, and I/O bank reference voltages for certain standards (e.g., HSTL, SSTL). It must be regulated at 2.5 V ±5% and decoupled near the package. VCCAUX is shared across all I/O banks, so noise on this rail affects multiple interfaces simultaneously.
Is the XC3S1400A-5FGG484C RoHS compliant and lead-free?
Yes, the XC3S1400A-5FGG484C is RoHS compliant and manufactured with lead-free (Pb-free) packaging. The FG484 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements for surface-mount assembly.
XC3S1400A-5FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 375
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S1400A-5FGG484C FAQ
1.How can I place an order for XC3S1400A-5FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400A-5FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400A-5FGG484C reliable?
The price and inventory of XC3S1400A-5FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400A-5FGG484C is usually 5 days.
3.What payment methods are accepted for XC3S1400A-5FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400A-5FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400A-5FGG484C?
XC3S1400A-5FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400A-5FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400A-5FGG484C?
For technical support, including XC3S1400A-5FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400A-5FGG484C requirements.
6.How does Aetrix verify that XC3S1400A-5FGG484C is sourced from the original manufacturer or authorized distributors?
All XC3S1400A-5FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400A-5FGG484C meets industry standards.
7.What is the process for return or replacement of XC3S1400A-5FGG484C?
All XC3S1400A-5FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400A-5FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400A-5FGG484C part is unused and in its original packaging.
Return procedure for XC3S1400A-5FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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