My Inquiry
My Account
AMD XC3S1400A-5FTG256C
- Part No.:
- XC3S1400A-5FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S1400A-5FTG256C.pdf
- Description:
- IC FPGA 161 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,603
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S1400A-5FTG256C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 1,400,000 system gates, 256-pin Fine-Pitch Ball Grid Array (FBGA) package, and -5 speed grade supporting 500 MHz I/O operation. It integrates 216 user I/Os, 17,280 logic cells, and embedded block RAM up to 576 Kbits for digital logic implementation in industrial control and communication interface designs.
For engineers reviewing the XC3S1400A-5FTG256C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count, logic cell density, embedded RAM capacity, speed grade timing closure, and FBGA thermal/mechanical compatibility with PCB layout constraints.
Technical Context
The XC3S1400A-5FTG256C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic and shift register functionality per slice. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL-2/3 across its 216 user I/O pins.
Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled loading. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction without external PLL components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - defines maximum combinational and sequential logic capacity for RTL synthesis |
| System Gates | 1,400,000 - indicates relative logic density benchmarked against ASIC gate count |
| User I/O Pins | 216 - supports high-pin-count parallel interfaces like DDR memory or video data buses |
| Block RAM | 576 Kbits - enables on-chip FIFOs, buffers, or small lookup tables without external memory |
| Speed Grade | -5 - guarantees timing closure at 500 MHz I/O toggle rate and 333 MHz internal clock frequency |
| Package | 256-pin FTBGA (Fine-Pitch TBGA) - 17×17 mm body, 1.0 mm ball pitch, RoHS-compliant |
Pinout & Package
XC3S1400A-5FTG256C uses a 256-ball Fine-Pitch TBGA (FTG256) package with 17×17 array, 1.0 mm ball pitch, and thermal pad exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be locally decoupled with low-ESR ceramic capacitors |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration and I/O banks - shared across multiple banks |
| A1 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration when pulsed low |
| T14 | DONE | Open-drain status output - goes high when configuration completes successfully |
| R15 | INIT_B | Open-drain initialization indicator - pulled low during configuration, released on success |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs per device provide jitter-reduced clock synthesis, 90° phase shift, and 2x/4x multiplication without external PLL |
| SelectIO Technology | Supports 19 I/O standards including LVCMOS33, LVTTL, PCI, and SSTL2_I - enables direct interfacing with memory and legacy peripherals |
| Embedded Multiplier Blocks | Four 18×18-bit multipliers support DSP functions like FIR filtering and motor control algorithms |
| Configuration Security | Bitstream encryption option prevents reverse engineering of programmed logic design |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop execution and encoder signal processing in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers and quadrature decoder logic with deterministic sub-microsecond latency. Use Value: 17,280 logic cells and 216 I/Os enable integration of motion control IP cores and parallel bus interfaces to stepper drivers. | Use Scenario: Conversion between HDMI source and LVDS display panels in medical imaging equipment. IC Role / Device Role / Timing Role: Timing-critical pixel data remapping and protocol translation using embedded DCMs for clock domain crossing. Use Value: 576 Kbits block RAM buffers video lines while DCMs generate precise pixel clocks synchronized to input timing. |
| Communications Baseband Processing | Test Equipment Pattern Generation |
Use Scenario: Channel coding (Viterbi, Turbo) and modulation mapping in point-to-point wireless transceivers. IC Role / Device Role / Timing Role: Configurable logic executes custom forward error correction pipelines with parallel bit-level operations. Use Value: 1,400,000 system gates support high-throughput encoding engines operating at 333 MHz internal clock speed. | Use Scenario: High-speed digital stimulus generation for IC validation in ATE systems. IC Role / Device Role / Timing Role: FPGA generates synchronized multi-channel test vectors with nanosecond-level edge alignment. Use Value: -5 speed grade ensures reliable 500 MHz I/O toggle rates required for 2 Gbps pattern rates across 216 pins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG320C | Lower logic density (15,360 LC), 320-pin FBGA, -4 speed grade (400 MHz I/O) | Suitable for cost-sensitive designs with reduced I/O and timing margin requirements | Choose when 216 I/Os and 500 MHz toggle rate are not required |
| XC3S1600E-4FG320C | Higher logic density (23,040 LC), same 320-pin FBGA, but E-series with larger block RAM (924 Kbits) | Better suited for memory-intensive DSP or packet buffering where RAM >576 Kbits is critical | Prefer when additional embedded RAM or logic headroom justifies migration |
Compared with XC3S1400A-5FTG256C, XC3S1000-4FG320C trades I/O count and speed for lower cost and power, while XC3S1600E-4FG320C adds logic and RAM at the expense of larger footprint and higher static current - both require PCB redesign due to different packages and pinouts.
Availability
XC3S1400A-5FTG256C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridge, communications baseband processing, and test equipment pattern generation requiring stable component supply across extended product lifecycles.
Supply support for XC3S1400A-5FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-3A product line for legacy industrial and aerospace applications requiring long-term availability and proven reliability.
The Spartan-3A family was designed for cost-sensitive, high-volume embedded systems needing moderate logic density, flexible I/O, and integrated clock management - targeting industrial automation, video infrastructure, and communications equipment.
FAQ
What is the maximum I/O toggle rate supported by XC3S1400A-5FTG256C?
The XC3S1400A-5FTG256C supports a maximum I/O toggle rate of 500 MHz, enabled by its -5 speed grade. This specification is verified under standard load and temperature conditions per the official Xilinx DS312 datasheet. The XC3S1400A-5FTG256C achieves this performance using optimized I/O buffer architecture and fine-pitch BGA routing integrity.
Does XC3S1400A-5FTG256C include on-chip clock management resources?
Yes, XC3S1400A-5FTG256C integrates two Digital Clock Managers (DCMs) that provide clock doubling, phase shifting, duty cycle correction, and jitter reduction. These DCMs eliminate the need for external clock synthesizers in many XC3S1400A-5FTG256C-based designs, simplifying board layout and reducing BOM cost.
What configuration modes are supported by XC3S1400A-5FTG256C?
XC3S1400A-5FTG256C supports Master Serial, Slave Serial, and JTAG configuration modes. Master Serial uses an on-chip oscillator to drive external PROM; Slave Serial allows host processor control; JTAG enables boundary-scan testing and in-system programming. All three modes are fully documented in the XC3S1400A-5FTG256C configuration user guide.
Is XC3S1400A-5FTG256C RoHS compliant?
Yes, XC3S1400A-5FTG256C is RoHS compliant and manufactured with lead-free solder finish on all 256 balls. The FTG256 package meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and requires bake conditioning before reflow if exposed beyond floor life limits. This applies specifically to the XC3S1400A-5FTG256C production lot.
What is the total embedded block RAM capacity of XC3S1400A-5FTG256C?
The XC3S1400A-5FTG256C provides 576 Kbits of total embedded block RAM, distributed across 24 block RAM primitives (each 18 Kbits). This RAM is synchronous, byte-write capable, and supports true dual-port operation - enabling efficient implementation of FIFOs, buffers, and lookup tables directly within the XC3S1400A-5FTG256C fabric.
XC3S1400A-5FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 161
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S1400A-5FTG256C FAQ
1.How can I place an order for XC3S1400A-5FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400A-5FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400A-5FTG256C reliable?
The price and inventory of XC3S1400A-5FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400A-5FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S1400A-5FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400A-5FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400A-5FTG256C?
XC3S1400A-5FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400A-5FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400A-5FTG256C?
For technical support, including XC3S1400A-5FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400A-5FTG256C requirements.
6.How does Aetrix verify that XC3S1400A-5FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S1400A-5FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400A-5FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S1400A-5FTG256C?
All XC3S1400A-5FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400A-5FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400A-5FTG256C part is unused and in its original packaging.
Return procedure for XC3S1400A-5FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S1400A-5FTG256C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
