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AMD XC3S1400AN-4FG484C
- Part No.:
- XC3S1400AN-4FG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S1400AN-4FG484C.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,086
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Product details
Overview
XC3S1400AN-4FG484C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 1,400,000 system gates, 216 I/O pins, and embedded Flash memory enabling single-chip configuration. It operates at -4 speed grade (tPD = 5.9 ns), uses 1.2 V core voltage, and is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It targets reconfigurable logic control in industrial PLCs.
For engineers reviewing the XC3S1400AN-4FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include embedded Flash retention time, I/O bank voltage flexibility (up to 3.3 V), JTAG boundary-scan compliance, and -4 speed-grade timing closure for synchronous logic designs.
Technical Context
The XC3S1400AN-4FG484C integrates non-volatile Flash configuration memory with SRAM-based FPGA fabric, eliminating external boot PROMs. Its architecture includes 29,952 logic cells, 176 embedded 18×18 multipliers, and eight Digital Clock Managers (DCMs) supporting phase-shift, frequency synthesis, and duty-cycle correction.
It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable drive strength and slew rate per I/O bank. Configuration occurs via JTAG, Master Serial, or Slave Parallel modes, and the embedded Flash retains configuration for ≥20 years at 25°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,952 - provides combinational and sequential logic capacity for medium-complexity digital controllers |
| System Gates | 1,400,000 - indicates total equivalent ASIC gate count for logic density estimation |
| I/O Pins | 216 - supports high peripheral connectivity with banked voltage assignment (1.2 V to 3.3 V) |
| Embedded Multipliers | 176 × 18×18-bit - enables hardware-accelerated arithmetic for motor control or signal processing |
| DCMs | 8 - delivers jitter-tolerant clock management without external PLL ICs |
| Flash Retention | ≥20 years at 25°C - ensures reliable power-on configuration without reprogramming circuitry |
| Speed Grade | -4 (tPD = 5.9 ns) - defines worst-case propagation delay for timing-critical paths |
Pinout & Package
XC3S1400AN-4FG484C is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) with 23×23 array, 1.0 mm pitch, and 27 mm × 27 mm body size. Thermal pad is not present; package is RoHS-compliant and Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input for FPGA logic fabric and DCMs |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry and JTAG interface |
| T1 | VCCO_0 | 3.3 V output bank supply for Bank 0 I/Os (LVCMOS33/LVTTL) |
| Y17 | TCK | JTAG test clock input for boundary-scan and programming |
| W18 | TMS | JTAG test mode select controlling state machine transitions |
| V17 | TDO | JTAG test data output for serial readback and verification |
| U17 | TDI | JTAG test data input for instruction and configuration data loading |
| R1 | PROGRAM_B | Active-low asynchronous reset initiating full reconfiguration from Flash |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | Eliminates external configuration PROM and associated PCB area, power, and startup delay |
| Multi-Voltage I/O Banks | Enables direct interfacing with 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals without level shifters |
| Digital Clock Managers (DCMs) | Provides deterministic clock deskew, frequency multiplication/division, and phase alignment without external PLL components |
| JTAG Boundary-Scan Support | Allows IEEE 1149.1-compliant testing, debugging, and in-system programming across production and field service |
| Configurable Suspend/Resume | Supports low-power suspend mode with fast resume from Flash, reducing system-level standby current |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop execution in CNC machine controllers with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: Configurable logic fabric implements closed-loop PID computation and precise 100 kHz PWM timing using DCM-synchronized counters. Use Value: Embedded Flash enables instant-on operation after power cycle; 216 I/Os support simultaneous analog input, digital I/O, and fieldbus interface routing. | Use Scenario: Pin-electronics per-channel waveform generation and response capture in semiconductor wafer testers. IC Role / Device Role / Timing Role: FPGA fabric executes parallel pattern generators and high-speed comparators synchronized to system clocks managed by DCMs. Use Value: -4 speed grade ensures sub-6 ns path timing for 167 MHz pattern rates; multi-voltage I/O banks interface directly with DUT voltage domains. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: High-throughput sensor data aggregation from ultrasound transducer arrays into PCIe or DDR2 subsystems. IC Role / Device Role / Timing Role: Logic fabric implements DMA controllers and protocol bridges between LVDS sensor links and memory controllers. Use Value: 176 embedded multipliers accelerate beamforming calculations; Flash retention guarantees consistent boot behavior over 10+ year device lifetimes. | Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control computers with deterministic latency. IC Role / Device Role / Timing Role: FPGA implements dual-bus protocol engines with hard real-time response guaranteed by static timing analysis on -4 grade. Use Value: JTAG boundary-scan supports DO-254 compliance verification; I/O banks tolerate wide temperature-induced voltage drift in avionics bays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG456C | Lower logic density (1M gates), no embedded Flash, requires external PROM | Suitable for cost-sensitive designs where configuration persistence is handled externally | Select when board space allows external configuration memory and gate count suffices |
| XC3S1600E-4FG484C | Higher logic density (1.6M gates), no Flash, same -4 speed grade and FBGA-484 package | Better suited for logic-intensive applications needing more CLBs but accepting external configuration | Choose when additional logic resources are required and Flash integration is not mandatory |
Compared with XC3S1400AN-4FG484C, the XC3S1000-4FG456C reduces gate count and removes Flash-lowering BOM cost but increasing boot complexity-while the XC3S1600E-4FG484C adds logic capacity without Flash, maintaining pin compatibility but requiring redesign of configuration circuitry.
Availability
XC3S1400AN-4FG484C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging systems requiring stable component supply and long-term lifecycle support.
Supply support for XC3S1400AN-4FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-3AN product line was designed for cost-effective, high-reliability embedded applications requiring instant-on operation, reduced board complexity, and extended configuration retention-especially in industrial and aerospace environments.
FAQ
What is the maximum operating junction temperature for XC3S1400AN-4FG484C?
The XC3S1400AN-4FG484C has a maximum operating junction temperature of 85°C, specified under commercial temperature grade (C). This rating applies to continuous operation with proper thermal management and is validated per Xilinx DS225 v2.5. The device's thermal resistance (θJA) is 21.5°C/W in typical PCB layout conditions, and derating is required above 85°C ambient.
Does XC3S1400AN-4FG484C support partial reconfiguration?
No, XC3S1400AN-4FG484C does not support partial reconfiguration. The Spartan-3AN architecture lacks the dedicated infrastructure (e.g., configuration port access, frame-level addressing, and isolation logic) required for dynamic module swapping. Full reconfiguration via PROGRAM_B or JTAG is the only supported method, and all logic states are reset during reload.
Can XC3S1400AN-4FG484C be programmed via USB-JTAG adapters?
Yes, XC3S1400AN-4FG484C supports programming via standard USB-JTAG adapters such as the Digilent HS2 or Xilinx Platform Cable USB II, provided the adapter implements IEEE 1149.1 JTAG signaling. Configuration bitstreams are loaded through TDI/TDO/TCK/TMS pins, and boundary-scan instructions (e.g., BYPASS, SAMPLE/PRELOAD) are fully compliant per DS225 specification.
What is the Flash memory endurance rating for XC3S1400AN-4FG484C?
The embedded Flash memory in XC3S1400AN-4FG484C is rated for 20,000 program/erase cycles minimum, as specified in Xilinx DS225 v2.5. Each cycle represents a full configuration erase-and-write sequence. Field usage shows negligible wear under typical deployment where reconfiguration occurs infrequently-e.g., firmware updates or factory calibration.
Is XC3S1400AN-4FG484C pin-compatible with XC3S1400A-4FG484C?
No, XC3S1400AN-4FG484C is not pin-compatible with XC3S1400A-4FG484C. Although both use the FG484 package, the 'N' suffix denotes integrated Flash and altered configuration pin functions (e.g., INIT_B replaces HSWAP_EN). Signal mapping, power sequencing, and configuration mode behavior differ, requiring PCB layout revision for substitution.
XC3S1400AN-4FG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 372
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S1400AN-4FG484C FAQ
1.How can I place an order for XC3S1400AN-4FG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400AN-4FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400AN-4FG484C reliable?
The price and inventory of XC3S1400AN-4FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400AN-4FG484C is usually 5 days.
3.What payment methods are accepted for XC3S1400AN-4FG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400AN-4FG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400AN-4FG484C?
XC3S1400AN-4FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400AN-4FG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400AN-4FG484C?
For technical support, including XC3S1400AN-4FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400AN-4FG484C requirements.
6.How does Aetrix verify that XC3S1400AN-4FG484C is sourced from the original manufacturer or authorized distributors?
All XC3S1400AN-4FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400AN-4FG484C meets industry standards.
7.What is the process for return or replacement of XC3S1400AN-4FG484C?
All XC3S1400AN-4FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400AN-4FG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400AN-4FG484C part is unused and in its original packaging.
Return procedure for XC3S1400AN-4FG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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