AMD XC3S1400AN-4FG484I

Overview

XC3S1400AN-4FG484I from AMD (formerly Xilinx) is a Spartan-3AN FPGA featuring 1,400,000 system gates, 216 I/O pins, and integrated non-volatile Flash configuration memory. It operates at -4 speed grade with 1.2 V core voltage and supports industrial temperature range (-40°C to +100°C). It is used in embedded control systems requiring single-chip reconfigurable logic with instant-on capability.

For engineers reviewing the XC3S1400AN-4FG484I datasheet, pinout, applications, or equivalent options, key selection factors include Flash-based configuration retention, I/O voltage flexibility (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and built-in SEU mitigation for reliable operation in harsh environments.

Technical Context

This FPGA integrates Flash memory for single-chip configuration storage, eliminating external PROMs and enabling true instant-on behavior after power-up. Its architecture includes 29,952 logic cells, 520 Kbits of distributed RAM, and 1,728 Kbits of block RAM.

The device supports SelectIO™ technology with programmable drive strength, slew rate, and on-chip termination across all I/O banks. It implements internal configuration watchdog and cyclic redundancy check (CRC) for configuration integrity verification.

Key Specifications

Pinout & Package

XC3S1400AN-4FG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 216 user I/Os distributed across 12 I/O banks. The package supports 1.2 V core and multiple I/O standards per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA configuration and logic density applications.

Compared with XC3S1400AN-4FG484I, the XC3S1000-4FG456C sacrifices reliability features for lower cost, while the XC3S1600E-4FG484I trades integrated Flash for higher logic capacity-making XC3S1400AN-4FG484I optimal for compact, robust, instant-on industrial designs.

Availability

XC3S1400AN-4FG484I is available at Aetrix Electronics and suitable for industrial control, avionics subsystems, and medical imaging equipment requiring stable component supply and long-term lifecycle assurance.

Supply support for XC3S1400AN-4FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs acquired through the Xilinx merger in 2022.

The Spartan-3AN product line was designed for cost-sensitive, high-reliability embedded applications where instant-on operation, configuration security, and industrial temperature tolerance are critical.

FAQ

What is the configuration method supported by XC3S1400AN-4FG484I?

XC3S1400AN-4FG484I uses on-chip Flash memory for master serial configuration, enabling autonomous power-up initialization without external PROM. It also supports JTAG programming for development and in-system reconfiguration. The device does not require an external configuration controller, simplifying system design and improving boot reliability.

Does XC3S1400AN-4FG484I support partial reconfiguration?

No, XC3S1400AN-4FG484I does not support partial reconfiguration. Its configuration architecture is based on full-bitstream loading from internal Flash or external sources. Partial reconfiguration requires Spartan-6 or later FPGA families with dedicated infrastructure; XC3S1400AN-4FG484I is limited to complete configuration reloads.

What I/O standards are compatible with XC3S1400AN-4FG484I?

XC3S1400AN-4FG484I supports LVCMOS, LVTTL, PCI, GTL, HSTL, and SSTL I/O standards across its 12 configurable I/O banks. Each bank operates independently at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, allowing mixed-voltage interfacing with processors, sensors, and legacy peripherals without level shifters.

Is XC3S1400AN-4FG484I RoHS compliant?

Yes, XC3S1400AN-4FG484I is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FBGA package uses matte tin finish, and manufacturing follows AMD's environmental compliance program. Full material declarations and certificates are available upon request for qualifying orders.

What debug interfaces does XC3S1400AN-4FG484I provide?

XC3S1400AN-4FG484I provides IEEE 1149.1 JTAG (TCK/TMS/TDI/TDO/EMU0/EMU1) for boundary-scan testing, programming, and runtime debugging. It does not include embedded logic analyzers like ChipScope Pro; external tools such as Xilinx iMPACT or third-party JTAG adapters are required for configuration and diagnostics.