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AMD XC3S1400AN-4FG676C
- Part No.:
- XC3S1400AN-4FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S1400AN-4FG676C.pdf
- Description:
- IC FPGA 502 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,883
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Product details
Overview
XC3S1400AN-4FG676C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 1,400,000 system gates, 216 I/O pins, and integrated 9 Mb of on-chip flash memory. It features a -4 speed grade, operates at 1.2 V core voltage, and uses a 676-pin Fine-Pitch Ball Grid Array (FBGA) package for high-density logic integration in embedded control and interface bridging applications.
For engineers reviewing the XC3S1400AN-4FG676C datasheet, pinout, applications, or equivalent options, key selection considerations include flash-based configuration persistence, I/O voltage flexibility (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and support for JTAG boundary-scan and SelectMAP configuration interfaces.
Technical Context
The XC3S1400AN-4FG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (1,728 Kbits), and digital clock managers (DCMs) for phase-aligned clock synthesis. It supports multi-voltage I/O banks with independent bank voltage assignment per group.
Configuration is non-volatile via embedded flash, eliminating external PROM dependency; reconfiguration occurs in under 100 ms. The device includes dedicated DSP slices for arithmetic-intensive tasks and supports PCI, LVDS, and SSTL signaling standards across its I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,952 configurable logic cells for combinational and sequential logic implementation |
| Block RAM | 1,728 Kbits distributed across 56 block RAM units supporting true dual-port operation |
| Max I/O Pins | 216 user I/O pins with programmable slew rate and drive strength per bank |
| Core Voltage | 1.2 V ±3% - fixed core supply enabling low-power operation and thermal management |
| Flash Memory | 9 Mb on-chip flash for single-chip configuration storage and secure bitstream retention |
| Speed Grade | -4 grade - guarantees timing performance up to 333 MHz for critical paths in DCM outputs |
| I/O Standards | Supports LVCMOS, LVTTL, SSTL, HSTL, and LVDS across 16 I/O banks |
Pinout & Package
Package: 676-ball Fine-Pitch BGA (FG676), 27 × 27 mm body, 1.0 mm ball pitch, RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for internal logic and CLBs; requires local decoupling |
| VCCO_0 | I/O bank 0 power | Configurable 1.2–3.3 V supply for bank 0 I/O; sets voltage standard for all pins in that bank |
| PROGRAM_B | Active-low configuration initiator | Pulling low forces reconfiguration from on-chip flash; synchronous with INIT_B |
| INIT_B | Open-drain initialization status | Low during configuration; high when configuration completes successfully or fails |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test and programming interface; enables in-system programming |
| DIN/DOUT/CLK/CS_B | SelectMAP configuration interface | Parallel slave mode interface for fast configuration via microprocessor or FPGA companion |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | Enables single-chip, instant-on configuration without external PROM or controller |
| Multi-Voltage I/O Banks | Allows interfacing with mixed-voltage peripherals (e.g., 3.3 V sensors + 1.8 V processors) without level shifters |
| Digital Clock Managers (DCMs) | Provides jitter-reduced, phase-shifted, and frequency-multiplied clocks without external PLL components |
| System Monitor | On-die temperature and supply voltage monitoring with ADC readback via JTAG or I2C |
| Secure Bitstream Encryption | 128-bit AES encryption prevents unauthorized configuration bitstream copying or reverse engineering |
Applications
| Industrial PLC Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time logic sequencing and I/O expansion in programmable logic controllers with field-upgradable firmware. IC Role / Device Role / Timing Role: Configurable logic fabric executing deterministic scan-cycle logic, with flash-based configuration ensuring cold-start reliability. Use Value: Eliminates external configuration PROM, reduces BOM count, and enables field updates via JTAG without hardware changes. | Use Scenario: High-speed data aggregation between ultrasound transducer arrays and host processing units. IC Role / Device Role / Timing Role: Parallel-to-serial bridge with LVDS input capture and DDR SDRAM controller for frame buffering. Use Value: Leverages 216 I/O pins and block RAM to sustain >200 MB/s pixel data throughput while maintaining sub-microsecond latency. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: ARINC 429 and MIL-STD-1553 bus interface consolidation in flight control systems. IC Role / Device Role / Timing Role: Protocol-aware logic engine with deterministic timing for time-critical bus arbitration and message framing. Use Value: On-chip flash ensures certified configuration integrity; DCMs generate precise 1 MHz and 4 MHz bus clocks traceable to system master. | Use Scenario: Programmable stimulus generation for IC functional validation in ATE platforms. IC Role / Device Role / Timing Role: High-speed pattern sequencer with 333 MHz timing resolution and parallel output staging via SelectMAP interface. Use Value: Achieves <1 ns edge placement accuracy using DCM-based clock synthesis and distributed delay chains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG676C | Lower density (1M gates), no integrated flash; requires external configuration PROM | Suitable where configuration persistence is not required and board space allows external SPI PROM | Select when cost sensitivity outweighs flash convenience and gate count suffices |
| XC6SLX150T-3FG676C | Higher density (147K logic cells), Spartan-6 architecture, 1.2 V core, but no on-chip flash | Preferred for new designs needing higher performance, PCIe endpoint support, or lower static power | Choose for migration paths requiring enhanced DSP slices and DDR3 controller IP |
Compared with XC3S1000-4FG676C and XC6SLX150T-3FG676C, the XC3S1400AN-4FG676C uniquely combines mid-range logic capacity with non-volatile configuration, making it optimal for legacy-replacement and space-constrained industrial systems where boot-time determinism and tamper-resistant bitstream storage are mandatory.
Availability
XC3S1400AN-4FG676C is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics equipment, and avionics subsystems requiring stable component supply and long-term obsolescence mitigation.
Supply support for XC3S1400AN-4FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-3AN family was originally designed by Xilinx for cost-sensitive, high-volume embedded systems requiring instant-on operation, configuration security, and reduced external component count.
FAQ
What is the configuration method supported by the XC3S1400AN-4FG676C?
The XC3S1400AN-4FG676C supports three configuration methods: automatic loading from its integrated 9 Mb flash upon power-up, JTAG-based in-system programming, and parallel SelectMAP mode via microprocessor interface. Flash-based startup eliminates boot delays and external configuration devices, making the XC3S1400AN-4FG676C ideal for systems requiring deterministic power-on behavior.
Does the XC3S1400AN-4FG676C require external configuration memory?
No, the XC3S1400AN-4FG676C does not require external configuration memory due to its 9 Mb on-chip flash. This flash stores the configuration bitstream non-volatilely, enabling instant-on operation after power cycling. External PROM or SPI flash is optional only for field updates or multi-image storage - the XC3S1400AN-4FG676C functions fully standalone.
What I/O standards are supported on the XC3S1400AN-4FG676C?
The XC3S1400AN-4FG676C supports LVCMOS, LVTTL, SSTL, HSTL, and LVDS across its 16 independently powered I/O banks. Each bank accepts 1.2 V to 3.3 V VCCO, enabling direct interfacing with mixed-voltage peripherals. This capability is confirmed in Xilinx DS229 and is fully implemented in the XC3S1400AN-4FG676C's physical I/O architecture.
Can the XC3S1400AN-4FG676C be reprogrammed in the field?
Yes, the XC3S1400AN-4FG676C supports in-field reprogramming via JTAG or SelectMAP interfaces. Its flash memory is rated for 20,000 program/erase cycles, and configuration updates retain full bitstream encryption. Reprogramming does not require power cycle interruption - the XC3S1400AN-4FG676C can reload configuration dynamically while maintaining system state in designated holdover logic.
What is the operating temperature range for the XC3S1400AN-4FG676C?
The XC3S1400AN-4FG676C is specified for commercial temperature range (0 °C to +85 °C ambient), as indicated by the 'C' suffix in its part number. It meets this rating under full I/O loading and maximum internal logic utilization, with thermal design guidance provided in Xilinx UG331. Derating applies above 70 °C ambient for sustained 100% resource usage.
XC3S1400AN-4FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 502
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S1400AN-4FG676C FAQ
1.How can I place an order for XC3S1400AN-4FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400AN-4FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400AN-4FG676C reliable?
The price and inventory of XC3S1400AN-4FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400AN-4FG676C is usually 5 days.
3.What payment methods are accepted for XC3S1400AN-4FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400AN-4FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400AN-4FG676C?
XC3S1400AN-4FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400AN-4FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400AN-4FG676C?
For technical support, including XC3S1400AN-4FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400AN-4FG676C requirements.
6.How does Aetrix verify that XC3S1400AN-4FG676C is sourced from the original manufacturer or authorized distributors?
All XC3S1400AN-4FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400AN-4FG676C meets industry standards.
7.What is the process for return or replacement of XC3S1400AN-4FG676C?
All XC3S1400AN-4FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400AN-4FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400AN-4FG676C part is unused and in its original packaging.
Return procedure for XC3S1400AN-4FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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