AMD XC3S1400AN-4FG676I

Overview

XC3S1400AN-4FG676I from AMD (formerly Xilinx) is a Spartan-3AN field-programmable gate array (FPGA) with 1,400,000 system gates, 29,952 logic cells, and integrated non-volatile flash memory. It features 676-pin Fine-Pitch Ball Grid Array (FBGA) packaging, operates at -4 speed grade (1.2 V core voltage), and supports in-system programming for configuration storage and security.

For engineers reviewing the XC3S1400AN-4FG676I datasheet, pinout, applications, or equivalent options, key selection considerations include embedded flash capacity, I/O count (502 user I/Os), single-chip configuration capability, and industrial temperature range (-40°C to +100°C).

Technical Context

The XC3S1400AN-4FG676I integrates a full FPGA fabric with dedicated digital clock managers (DCMs), block RAM (2,088 kbits), and multipliers (36 total). Its embedded 2 MB flash eliminates external configuration PROMs and enables secure bitstream storage with AES encryption support.

It supports LVCMOS, LVTTL, SSTL, HSTL, and differential signaling standards across its I/O banks, with programmable drive strength and slew rate control per bank. Configuration occurs via JTAG, Master Serial, or Slave SelectMAP modes.

Key Specifications

Pinout & Package

XC3S1400AN-4FG676I uses a 676-ball fine-pitch BGA (19×19 mm, 1.0 mm pitch) with standard ball assignment per Xilinx DS312 v2.1. Power, ground, configuration, and I/O balls are distributed across multiple banks supporting independent voltage domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC3S1400AN-4FG676I, the XC3S1000-4FG676C trades flash integration and temperature range for lower cost, while the XC3S1600E-4FG676I prioritizes raw logic capacity over embedded configuration security-making XC3S1400AN-4FG676I optimal for compact, secure, single-chip industrial deployments.

Availability

XC3S1400AN-4FG676I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging interface, avionics data concentrators, and test & measurement equipment requiring stable component supply and long-term lifecycle support.

Supply support for XC3S1400AN-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family. Xilinx pioneered FPGA architecture and programmable logic solutions for high-reliability applications.

The Spartan-3AN product line was designed specifically for cost-sensitive, space-constrained industrial and embedded systems requiring non-volatile configuration, security, and robust operation without external memory.

FAQ

What is the core voltage requirement for XC3S1400AN-4FG676I?

The XC3S1400AN-4FG676I requires a regulated 1.2 V ±3% core supply (VCCINT) delivered to all designated VCCINT pins. This voltage powers the FPGA logic fabric and must be filtered with low-ESR ceramic capacitors placed near each power ball to ensure stable operation under dynamic switching loads. The XC3S1400AN-4FG676I specification mandates strict noise tolerance to prevent timing violations or configuration corruption.

Does XC3S1400AN-4FG676I support JTAG boundary-scan testing?

Yes, XC3S1400AN-4FG676I fully supports IEEE 1149.1 JTAG boundary-scan via dedicated TCK, TMS, TDI, and TDO pins. This enables in-circuit testing, device programming, and debug access throughout the product lifecycle. The XC3S1400AN-4FG676I implements mandatory JTAG instructions including SAMPLE/PRELOAD, EXTEST, and IDCODE, and supports BSDL file-based test vector generation.

How does the embedded flash in XC3S1400AN-4FG676I improve system reliability?

The 2 MB embedded flash in XC3S1400AN-4FG676I eliminates reliance on external configuration PROMs, reducing interconnect failure points and improving resistance to vibration, thermal cycling, and ESD events. Because the XC3S1400AN-4FG676I loads configuration directly from on-die flash at power-up, it avoids timing skew and data corruption risks associated with serial PROM readout delays or signal integrity issues on external buses.

Can XC3S1400AN-4FG676I operate in extended temperature environments?

Yes, XC3S1400AN-4FG676I is rated for industrial temperature operation from -40°C to +100°C. This rating is verified per Xilinx DS312 specifications and applies to the full functional performance envelope-including logic operation, I/O signaling, DCM stability, and flash programming/erase cycles. The XC3S1400AN-4FG676I maintains timing compliance and configuration integrity across this range without derating.

What configuration modes does XC3S1400AN-4FG676I support?

XC3S1400AN-4FG676I supports three primary configuration modes: Master Serial (using on-chip oscillator and SPI flash interface), Slave SelectMAP (for parallel loading from microcontroller or processor), and JTAG (for programming and debugging). All modes leverage the integrated flash, and the XC3S1400AN-4FG676I automatically selects mode based on M[2:0] pin states at power-up.