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AMD XC3S1400AN-4FGG484C
- Part No.:
- XC3S1400AN-4FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S1400AN-4FGG484C.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,511
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Product details
Overview
XC3S1400AN-4FGG484C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 1,400,000 system gates, 29,952 logic cells, and integrated 4-Mbit platform flash memory. It features 376 user I/Os, operates at -4 speed grade (1.14 ns CLB delay), and supports single-chip configuration in industrial temperature range (0°C to 85°C). It is used in embedded control systems requiring reconfigurable logic with non-volatile configuration storage.
For engineers reviewing the XC3S1400AN-4FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include integrated flash capacity, I/O count, speed grade timing compliance, industrial temperature rating, and JTAG/Slave Serial configuration support.
Technical Context
The XC3S1400AN-4FGG484C implements a fully SRAM-based logic fabric with integrated flash for instant-on configuration. Its architecture includes 18 × 18 multipliers, distributed RAM blocks, and block RAM totaling 576 Kbits. Configuration occurs via JTAG, Slave Serial, or Master Serial modes without external PROM.
It supports SelectIO™ standards including LVCMOS, LVTTL, PCI, HSTL, and SSTL across its 376 user I/O pins. The device uses 1.2 V core voltage and 3.3 V or 2.5 V I/O voltage options, with internal VCCO regulation for mixed-voltage operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,952 - defines maximum combinational and sequential logic capacity per design |
| System Gates | 1,400,000 - industry-standard metric for relative logic density |
| Block RAM | 576 Kbits - supports on-chip data buffering, FIFOs, and lookup tables |
| User I/O Pins | 376 - enables high-pin-count interface bridging and peripheral expansion |
| Integrated Flash | 4 Mbit - eliminates external configuration PROM and enables secure, single-chip boot |
| Speed Grade | -4 - guarantees 1.14 ns CLB propagation delay for timing-critical paths |
| Operating Temp | 0°C to +85°C - qualified for industrial environment deployment without derating |
Pinout & Package
XC3S1400AN-4FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23 mm × 23 mm body size and 1.0 mm ball pitch. The package supports lead-free (RoHS-compliant) assembly and thermal dissipation up to 2.5 W under typical operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew routing to all clock regions for synchronous timing integrity |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant programming, debugging, and interconnect testing |
| PROGRAM_B | Configuration Reset | Active-low signal that clears configuration memory and initiates reconfiguration |
| CCLK | Configuration Clock | Drives serial configuration data into FPGA during Slave Serial mode |
| VCCINT | Core Power Supply | Provides regulated 1.2 V to logic fabric and internal resources |
| VCCO_0–VCCO_3 | I/O Bank Power | Independent 3.3 V or 2.5 V supplies per I/O bank enable mixed-voltage interface support |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 4-Mbit Flash | Eliminates external configuration memory, reduces BOM count, and enables tamper-resistant bitstream storage |
| Single-Chip Configuration | Supports power-on initialization without external controllers or boot code, reducing boot time to <100 ms |
| SelectIO Technology | Allows per-bank voltage selection and simultaneous interface to multiple standards (LVCMOS, SSTL, HSTL) |
| Multi-Voltage I/O Banks | Enables direct connection to 1.8 V, 2.5 V, and 3.3 V peripherals without level shifters |
| IEEE 1149.1 JTAG Support | Provides boundary-scan testability, in-system programming, and debug visibility across production and field service |
Applications
| Industrial PLC Controller | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time logic for motion control sequencing and sensor fusion in programmable logic controllers. IC Role / Device Role / Timing Role: Configurable logic fabric executing deterministic control loops with sub-microsecond latency. Use Value: Integrated flash ensures reliable cold-start operation after power loss, eliminating configuration reload delays. | Use Scenario: High-speed parallel data capture from CCD/CMOS image sensors in portable ultrasound units. IC Role / Device Role / Timing Role: Synchronizes pixel clock domains, buffers frame data in block RAM, and formats output for USB 2.0 or LVDS transmission. Use Value: 376 I/Os support wide parallel sensor buses; -4 speed grade meets real-time pixel processing timing constraints. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: Aggregating ARINC 429, discrete I/O, and analog sensor signals in line-replaceable units (LRUs). IC Role / Device Role / Timing Role: Protocol translation engine with deterministic latency and fault-isolated I/O banks. Use Value: Industrial temperature rating and integrated flash meet DO-254 hardware assurance requirements for Level A/B functions. | Use Scenario: Generating synchronized digital stimulus waveforms for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: State-machine-driven pattern sequencer with precise cycle-accurate timing control. Use Value: -4 speed grade guarantees setup/hold timing margins for 100+ MHz vector rates; 576 Kbits block RAM stores deep test patterns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration and logic density applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | Lower logic density (19,200 LCs), no integrated flash, 456-pin FBGA | Requires external PROM for configuration; suitable where flash integration is not required | Select when cost sensitivity outweighs single-chip boot requirement and I/O count can be reduced by 20 pins |
| XC3S1600E-4FGG484C | Higher logic density (33,280 LCs), no integrated flash, same 484-pin package | Lacks on-chip non-volatile storage; requires external configuration memory | Choose when additional logic resources are needed and external flash is acceptable in the system architecture |
Compared with XC3S1400AN-4FGG484C, the XC3S1000-4FGG456C trades flash integration and I/O count for lower unit cost, while the XC3S1600E-4FGG484C offers more logic capacity but increases BOM complexity due to mandatory external configuration memory.
Availability
XC3S1400AN-4FGG484C is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and avionics data concentrators requiring stable component supply and long-term lifecycle support.
Supply support for XC3S1400AN-4FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the legacy Spartan family as part of its adaptive computing portfolio.
The Spartan-3AN product line was designed for cost-sensitive, high-volume embedded applications requiring instant-on capability, configuration security, and industrial-grade reliability without external memory dependencies.
FAQ
What is the configuration method supported by XC3S1400AN-4FGG484C?
XC3S1400AN-4FGG484C supports JTAG, Slave Serial, and Master Serial configuration modes. Its integrated 4-Mbit flash enables single-chip, instant-on startup without external PROM. The device automatically loads configuration from flash on power-up, and JTAG allows in-system reprogramming of both flash and SRAM fabric. XC3S1400AN-4FGG484C does not require external configuration controllers or boot code.
Does XC3S1400AN-4FGG484C support mixed-voltage I/O operation?
Yes, XC3S1400AN-4FGG484C supports mixed-voltage I/O operation through eight independent I/O banks. Each bank has dedicated VCCO pins allowing simultaneous use of LVCMOS 3.3 V, 2.5 V, and 1.8 V signaling standards. This enables direct interfacing with diverse peripherals without external level shifters. XC3S1400AN-4FGG484C maintains signal integrity across voltage domains using bank-specific termination and drive strength controls.
What is the maximum operating frequency for logic implemented in XC3S1400AN-4FGG484C?
The -4 speed grade of XC3S1400AN-4FGG484C guarantees a 1.14 ns CLB propagation delay, supporting system clock frequencies up to 250 MHz for well-constrained designs. Actual maximum frequency depends on logic depth, routing congestion, and I/O timing closure. XC3S1400AN-4FGG484C achieves this performance with 1.2 V core voltage and optimized place-and-route using Xilinx ISE tools.
Is XC3S1400AN-4FGG484C qualified for industrial temperature operation?
Yes, XC3S1400AN-4FGG484C is rated for industrial temperature operation from 0°C to +85°C. It undergoes full characterization and screening across this range for parameters including setup/hold times, I/O drive strength, and configuration stability. XC3S1400AN-4FGG484C meets JEDEC JESD22-A104 reliability standards and is suitable for deployment in fanless enclosures and uncontrolled ambient environments.
How does the integrated flash in XC3S1400AN-4FGG484C improve system security?
The 4-Mbit flash in XC3S1400AN-4FGG484C supports bitstream encryption and write-protection features, preventing unauthorized readback or modification of configuration data. Flash contents remain non-volatile across power cycles, eliminating exposure during boot. XC3S1400AN-4FGG484C allows secure field updates via JTAG while maintaining cryptographic integrity of stored bitstreams, meeting basic IP protection requirements for deployed systems.
XC3S1400AN-4FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 372
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S1400AN-4FGG484C FAQ
1.How can I place an order for XC3S1400AN-4FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400AN-4FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400AN-4FGG484C reliable?
The price and inventory of XC3S1400AN-4FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400AN-4FGG484C is usually 5 days.
3.What payment methods are accepted for XC3S1400AN-4FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400AN-4FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400AN-4FGG484C?
XC3S1400AN-4FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400AN-4FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400AN-4FGG484C?
For technical support, including XC3S1400AN-4FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400AN-4FGG484C requirements.
6.How does Aetrix verify that XC3S1400AN-4FGG484C is sourced from the original manufacturer or authorized distributors?
All XC3S1400AN-4FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400AN-4FGG484C meets industry standards.
7.What is the process for return or replacement of XC3S1400AN-4FGG484C?
All XC3S1400AN-4FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400AN-4FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400AN-4FGG484C part is unused and in its original packaging.
Return procedure for XC3S1400AN-4FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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