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AMD XC3S1400AN-4FGG484I
- Part No.:
- XC3S1400AN-4FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S1400AN-4FGG484I.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,431
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Product details
Overview
XC3S1400AN-4FGG484I from AMD (formerly Xilinx) is a Spartan-3AN field-programmable gate array (FPGA) with 1,400,000 system gates, 29,952 logic cells, and integrated 9 Mb of on-chip flash memory. It features 484-pin Fine-Pitch Ball Grid Array (FBGA) packaging, -4 speed grade, and industrial temperature range (-40°C to +100°C), deployed in embedded control and reconfigurable I/O bridging applications.
For engineers reviewing the XC3S1400AN-4FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include embedded flash retention, I/O count (376 user I/Os), single-event upset (SEU) immunity, and compatibility with Xilinx ISE Design Suite v14.7 for synthesis and place-and-route.
Technical Context
The XC3S1400AN-4FGG484I integrates non-volatile flash configuration memory, eliminating external boot PROMs and enabling instant-on operation. Its architecture supports JTAG boundary-scan, SelectMAP, and serial mode configuration, with built-in SEU detection and correction logic for enhanced reliability in harsh environments.
It delivers up to 500 MHz clock performance, supports LVCMOS, LVTTL, SSTL, HSTL, and differential signaling standards, and includes 128 embedded 18×18 multipliers for DSP-intensive tasks such as motor control and digital power conversion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,952 - provides scalable programmable logic resources for custom state machines and protocol engines |
| System Gates | 1,400,000 - indicates total combinational logic capacity suitable for medium-complexity digital systems |
| User I/O Pins | 376 - supports high-density interface bridging between processors, sensors, and peripherals |
| Embedded Flash | 9 Mb - enables single-chip configuration storage and eliminates external SPI PROM dependency |
| Speed Grade | -4 - guarantees timing closure at 500 MHz maximum internal clock frequency under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded deployments |
| DSP Slices | 128 × 18×18 multipliers - accelerates real-time filtering, PWM generation, and closed-loop control algorithms |
Pinout & Package
XC3S1400AN-4FGG484I is housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package with 23×23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Pin assignments follow Xilinx's standard Spartan-3AN pinout convention, with dedicated configuration, clock, JTAG, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master serial or SelectMAP mode |
| DIN | Serial Data Input | Accepts bitstream during JTAG or master serial configuration |
| PROGRAM_B | Active-Low Configuration Initiate | Resets configuration logic and clears SRAM contents before reload |
| INIT_B | Active-Low Configuration Status | Indicates readiness to accept new bitstream after power-up or PROGRAM_B assertion |
| Done | Configuration Completion Flag | Signals successful loading and release of I/O pins from high-impedance state |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | 9 Mb on-chip flash eliminates external configuration PROM and reduces BOM count by one component |
| Single-Event Upset (SEU) Mitigation | Hardware-based CRC checking and automatic scrubbing protect configuration memory in radiation-prone environments |
| Multi-Voltage I/O Banks | Four independent I/O banks support mixed-voltage interfaces (1.2 V to 3.3 V) without level shifters |
| Embedded Block RAM | 360 Kb distributed RAM and 1,728 Kb block RAM enable large FIFOs, buffers, and lookup tables |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops, optimized for pipelined data paths |
Applications
| Industrial Motor Control | Automotive ADAS Sensor Hub |
|---|---|
Use Scenario: Real-time PWM generation, encoder feedback decoding, and current loop monitoring in servo drives. IC Role / Device Role / Timing Role: Reconfigurable logic fabric executing deterministic control loops with sub-microsecond latency. Use Value: On-chip flash enables field-upgradable motor profiles without external memory access delay. | Use Scenario: Aggregating and preprocessing camera, radar, and ultrasonic sensor data before forwarding to host processor. IC Role / Device Role / Timing Role: Protocol bridge and pre-processing engine handling multiple asynchronous sensor interfaces. Use Value: 376 user I/Os support simultaneous connection of 4+ MIPI CSI-2 lanes and CAN FD transceivers. |
| Medical Imaging Front-End | Test & Measurement Equipment |
Use Scenario: Digitizing and conditioning analog signals from ultrasound transducers and ADCs in portable imaging devices. IC Role / Device Role / Timing Role: High-speed data acquisition controller with real-time FIR filtering and packetization logic. Use Value: 128 embedded 18×18 multipliers accelerate beamforming calculations without offloading to host CPU. | Use Scenario: Generating precise stimulus waveforms and analyzing response signatures in automated test systems. IC Role / Device Role / Timing Role: Programmable pattern generator and digital signal analyzer core with deterministic timing. Use Value: -4 speed grade ensures stable 500 MHz internal clocks for nanosecond-resolution timing capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | Lower density (1M gates, 21,952 logic cells), no embedded flash, commercial temp range (0°C to +85°C) | Lacks instant-on capability and SEU protection; requires external configuration PROM | Choose when cost sensitivity outweighs reliability and boot-time requirements |
| XC6SLX150T-3FGG484C | Higher density (147K logic cells), Spartan-6 architecture, no integrated flash, commercial temp rating | Offers DDR3 controller and PCIe endpoint blocks but increases design complexity and toolchain migration effort | Prefer for new designs requiring higher bandwidth interfaces and longer product lifecycle support |
Compared with XC3S1000-4FGG456C and XC6SLX150T-3FGG484C, the XC3S1400AN-4FGG484I uniquely combines embedded flash, industrial temperature rating, and proven SEU resilience-making it optimal for legacy-replacement and ruggedized embedded systems where configuration integrity and fast startup are mandatory.
Availability
XC3S1400AN-4FGG484I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging front-ends, and automotive sensor hub applications requiring stable component supply across extended product lifecycles.
Supply support for XC3S1400AN-4FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its portfolio in programmable logic and heterogeneous acceleration.
The Spartan-3AN family was developed by Xilinx to deliver cost-effective, flash-based FPGAs for industrial, automotive, and medical applications demanding instant-on operation and configuration security.
FAQ
What is the configuration method supported by XC3S1400AN-4FGG484I?
The XC3S1400AN-4FGG484I supports multiple configuration modes including JTAG, master serial (via CCLK/DIN), and SelectMAP. Its integrated 9 Mb flash allows autonomous startup without external configuration devices, and configuration bitstreams can be updated in-system via JTAG or slave parallel interface.
Does XC3S1400AN-4FGG484I require an external configuration PROM?
No, XC3S1400AN-4FGG484I does not require an external configuration PROM due to its 9 Mb on-chip flash memory. This flash stores the configuration bitstream and enables instant-on functionality, reducing system component count and improving boot reliability compared to SRAM-based FPGAs like the Spartan-3E series.
What is the maximum operating junction temperature for XC3S1400AN-4FGG484I?
The XC3S1400AN-4FGG484I is rated for industrial temperature operation with a maximum junction temperature of +100°C. Its thermal design supports sustained operation in enclosed enclosures or high-ambient environments typical of factory automation and transportation equipment.
Can XC3S1400AN-4FGG484I be used in radiation-tolerant applications?
Yes, XC3S1400AN-4FGG484I includes hardware-based Single-Event Upset (SEU) detection and automatic scrubbing logic for its configuration memory. While not fully radiation-hardened, this feature provides measurable resilience against soft errors in terrestrial industrial and avionics-adjacent applications.
Which design tools are compatible with XC3S1400AN-4FGG484I?
XC3S1400AN-4FGG484I is fully supported by Xilinx ISE Design Suite v14.7-the final official toolchain for Spartan-3 devices. It is not supported by Vivado; migration to newer families like Spartan-6 or Artix-7 requires redesign and toolchain transition.
XC3S1400AN-4FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 372
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S1400AN-4FGG484I FAQ
1.How can I place an order for XC3S1400AN-4FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400AN-4FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400AN-4FGG484I reliable?
The price and inventory of XC3S1400AN-4FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400AN-4FGG484I is usually 5 days.
3.What payment methods are accepted for XC3S1400AN-4FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400AN-4FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400AN-4FGG484I?
XC3S1400AN-4FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400AN-4FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400AN-4FGG484I?
For technical support, including XC3S1400AN-4FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400AN-4FGG484I requirements.
6.How does Aetrix verify that XC3S1400AN-4FGG484I is sourced from the original manufacturer or authorized distributors?
All XC3S1400AN-4FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400AN-4FGG484I meets industry standards.
7.What is the process for return or replacement of XC3S1400AN-4FGG484I?
All XC3S1400AN-4FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400AN-4FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400AN-4FGG484I part is unused and in its original packaging.
Return procedure for XC3S1400AN-4FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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