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AMD XC3S1400AN-4FGG676C
- Part No.:
- XC3S1400AN-4FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S1400AN-4FGG676C.pdf
- Description:
- IC FPGA 502 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,535
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Product details
Overview
XC3S1400AN-4FGG676C from AMD (formerly Xilinx) is a Spartan-3AN field-programmable gate array (FPGA) with 1,400,000 system gates, 29,952 logic cells, and integrated non-volatile Flash memory for single-chip configuration. It operates at -4 speed grade (1.58 ns CLB delay), uses 1.2 V core voltage, and is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch.
For engineers reviewing the XC3S1400AN-4FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include embedded Flash configuration persistence, I/O count (502 user I/Os), differential signaling support (LVDS, RSDS), internal oscillator frequency (4 MHz), and compliance with IEEE 1149.1 JTAG boundary-scan.
Technical Context
The XC3S1400AN-4FGG676C integrates Flash-based configuration memory, eliminating external PROM and enabling instant-on operation. Its architecture includes SelectIO™ technology supporting 21 I/O standards, Digital Clock Managers (DCMs) for clock synthesis and phase alignment, and Block RAM (1,824 kbits) for data buffering and storage.
It supports multi-voltage I/O banks (1.2 V to 3.3 V), features internal pull-up/pull-down resistors per I/O, and implements JTAG boundary-scan for board-level test and programming. The device lacks transceivers but provides dedicated clock routing and global clock buffers for timing-critical designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,952 - defines maximum combinational/sequential logic capacity for custom digital logic implementation |
| User I/O Pins | 502 - supports high-density interface connectivity across multiple voltage domains |
| Block RAM | 1,824 kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| Embedded Flash | Integrated 22.5 Mbit - allows single-chip, instant-on configuration without external SPI PROM |
| DCM Units | 8 - provide clock multiplication, division, phase shifting, and duty-cycle correction for precise timing control |
| Speed Grade | -4 - guarantees 1.58 ns CLB propagation delay under worst-case industrial temperature conditions |
| Core Voltage | 1.2 V ± 3% - determines power delivery design and core regulator selection |
Pinout & Package
XC3S1400AN-4FGG676C is housed in a 676-ball Fine-Pitch BGA (FBGA) package with 0.8 mm ball pitch and 27 × 27 mm body size. The package supports lead-free (Pb-free) assembly and complies with JEDEC MO-230 standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be filtered and regulated at 1.2 V; decoupling required within 10 mm of each VCCINT ball |
| VCCO_0 | I/O bank 0 power | Configurable between 1.2 V–3.3 V; sets voltage level for all I/Os in Bank 0 |
| PROGRAM_B | Configuration reset | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration status | Open-drain output indicating configuration completion (high) or error (low) |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant test access port for programming, debugging, and boundary-scan testing |
| CCLK | Configuration clock | Input clock for master serial configuration mode; also used as DCM reference when configured |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash memory | Enables single-chip, zero-PROM configuration with automatic boot on power-up |
| SelectIO™ technology | Supports mixed-voltage I/O banks with programmable drive strength, slew rate, and termination |
| Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, phase alignment, and frequency synthesis without external PLL chips |
| Internal 4 MHz oscillator | Supplies clock for configuration logic and can serve as auxiliary clock source for user logic |
| JTAG boundary-scan | Allows in-system programming and PCB-level interconnect testing without additional test fixtures |
Applications
| Industrial PLC Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time logic for motion control sequencing and sensor fusion in programmable logic controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implementing deterministic state machines and I/O expansion with sub-microsecond response. Use Value: Integrated Flash ensures reliable restart after power loss; 502 I/Os support direct connection to analog front-ends and fieldbus transceivers. | Use Scenario: High-speed parallel data capture from CCD/CMOS image sensors in ultrasound and endoscopy systems. IC Role / Device Role / Timing Role: Synchronizes pixel clock domains, applies real-time gamma correction, and buffers frame data using Block RAM. Use Value: DCMs align sensor clocks with processing clocks; LVDS-capable I/Os reduce EMI during high-speed video transmission. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: Aggregating ARINC 429, discrete I/O, and CAN signals in line-replaceable units (LRUs). IC Role / Device Role / Timing Role: Protocol translation engine with deterministic latency and dual-clock domain bridging. Use Value: Multi-voltage I/O banks interface directly with legacy avionics buses; JTAG enables field firmware updates without hardware modification. | Use Scenario: Generating synchronized stimulus waveforms for IC functional validation and ATE systems. IC Role / Device Role / Timing Role: Programmable pattern generator with precise timing control via DCM-generated clocks. Use Value: 1.58 ns CLB delay ensures sub-nanosecond timing resolution; internal oscillator simplifies clock tree design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration and logic density applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | Lower logic density (19,200 LC), no embedded Flash, requires external configuration PROM | Limited to cost-sensitive, lower-I/O-count applications where instant-on is not required | Choose when BOM cost reduction outweighs configuration reliability and board space constraints |
| XC3S1600E-4FGG456C | Higher logic density (33,280 LC), no Flash, 456-pin FBGA, supports higher-speed I/O standards including LVDS | Better suited for high-throughput data path acceleration where external configuration is acceptable | Prefer when additional logic resources and faster I/O are needed, and external Flash/PROM is already in design |
Compared with XC3S1400AN-4FGG676C, the XC3S1000-4FGG456C reduces gate count and eliminates Flash-increasing board area and boot time-while the XC3S1600E-4FGG456C adds logic capacity but removes configuration autonomy and shrinks I/O count by 15%, limiting interface scalability.
Availability
XC3S1400AN-4FGG676C is available at Aetrix Electronics and suitable for industrial automation, medical imaging equipment, and avionics subsystems requiring stable component supply and long-term lifecycle support.
Supply support for XC3S1400AN-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan FPGA family as part of its adaptive computing portfolio.
The Spartan-3AN product line was designed for cost-sensitive, high-volume embedded applications requiring instant-on capability, reduced board complexity, and robust configuration security-especially where external configuration memory posed reliability or footprint challenges.
FAQ
What is the configuration method supported by XC3S1400AN-4FGG676C?
The XC3S1400AN-4FGG676C supports Master Serial, Slave Serial, Boundary Scan (JTAG), and Microprocessor Bus configuration modes. Its integrated Flash enables Master Serial configuration without external memory, allowing immediate operation after power-up. Configuration bitstream is stored permanently in on-chip Flash and can be reprogrammed in-system via JTAG or slave mode interfaces. XC3S1400AN-4FGG676C does not require external PROM or configuration controllers for basic operation.
Does XC3S1400AN-4FGG676C support differential I/O standards?
Yes, XC3S1400AN-4FGG676C supports LVDS, RSDS, and BLVDS differential signaling standards across compatible I/O banks. Each differential pair requires adjacent pins within the same bank and must comply with voltage referencing and termination requirements specified in DS099. XC3S1400AN-4FGG676C does not support current-mode logic (CML) or PECL, and differential standards are unavailable in banks powered below 2.5 V.
What is the operating temperature range for XC3S1400AN-4FGG676C?
XC3S1400AN-4FGG676C is rated for industrial temperature operation from –40 °C to +85 °C ambient. This rating applies to the -4 speed grade and is validated under JEDEC JESD22-A104 thermal cycling conditions. Thermal derating is not required within this range, and the device maintains full timing specifications across the entire span. XC3S1400AN-4FGG676C does not offer extended or military-grade temperature variants.
Can XC3S1400AN-4FGG676C be programmed in-system after soldering?
Yes, XC3S1400AN-4FGG676C supports in-system programming (ISP) via its IEEE 1149.1 JTAG interface. The on-chip Flash memory can be erased and reprogrammed while mounted on the target PCB, enabling field firmware updates and configuration recovery. ISP requires only TCK, TMS, TDI, TDO, and TREF pins connected per JTAG chain topology. XC3S1400AN-4FGG676C does not require power cycling to complete ISP operations.
How many Digital Clock Managers (DCMs) does XC3S1400AN-4FGG676C include?
XC3S1400AN-4FGG676C includes eight Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, frequency multiplication/division, and duty-cycle correction. All eight DCMs are fully functional and accessible in the placed-and-routed design. XC3S1400AN-4FGG676C does not include any PLLs or MMCMs-only DCMs-as confirmed in the Spartan-3AN Family Data Sheet (DS099, v2.5).
XC3S1400AN-4FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 502
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S1400AN-4FGG676C FAQ
1.How can I place an order for XC3S1400AN-4FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400AN-4FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400AN-4FGG676C reliable?
The price and inventory of XC3S1400AN-4FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400AN-4FGG676C is usually 5 days.
3.What payment methods are accepted for XC3S1400AN-4FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400AN-4FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400AN-4FGG676C?
XC3S1400AN-4FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400AN-4FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400AN-4FGG676C?
For technical support, including XC3S1400AN-4FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400AN-4FGG676C requirements.
6.How does Aetrix verify that XC3S1400AN-4FGG676C is sourced from the original manufacturer or authorized distributors?
All XC3S1400AN-4FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400AN-4FGG676C meets industry standards.
7.What is the process for return or replacement of XC3S1400AN-4FGG676C?
All XC3S1400AN-4FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400AN-4FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400AN-4FGG676C part is unused and in its original packaging.
Return procedure for XC3S1400AN-4FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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