My Inquiry
My Account
AMD XC3S1400AN-4FGG676I
- Part No.:
- XC3S1400AN-4FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S1400AN-4FGG676I.pdf
- Description:
- IC FPGA 502 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,615
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S1400AN-4FGG676I from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 1,400,000 system gates, 29,952 logic cells, and integrated 16-Mb Flash memory for single-chip configuration. It features 502 user I/Os, operates at -4 speed grade (1.13 ns CLB delay), and supports industrial temperature range (-40°C to +100°C). It is used in reconfigurable embedded control and interface bridging applications.
For engineers reviewing the XC3S1400AN-4FGG676I datasheet, pinout, applications, or equivalent options, key selection factors include Flash-integrated configuration reliability, I/O count and voltage support (3.3V/2.5V/1.8V), CLB timing performance, industrial temperature rating, and migration path within Spartan-3AN family.
Technical Context
The XC3S1400AN-4FGG676I implements a fully SRAM-based logic fabric with integrated Flash for instant-on configuration retention. Its architecture includes dedicated DSP slices, block RAM (576 Kbits), and Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty-cycle correction.
It supports SelectIO standards including LVCMOS, LVTTL, PCI, HSTL, and SSTL across multiple banks, each independently configurable for 1.2V–3.3V I/O voltages. Configuration occurs via JTAG, Master Serial, or Slave Parallel modes, with Flash enabling power-up without external PROM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,952 - defines maximum combinational and sequential logic capacity for custom digital functions |
| System Gates | 1,400,000 - indicates relative logic density benchmarked against ASIC gate count |
| User I/O Pins | 502 - supports high-pin-count interface bridging and multi-protocol connectivity |
| Block RAM | 576 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| Speed Grade | -4 - guarantees 1.13 ns CLB propagation delay for timing-critical synchronous logic paths |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating or thermal management overhead |
| Integrated Flash | 16 Mbit - eliminates external configuration PROM, reduces BOM count, and enables secure bitstream storage |
Pinout & Package
XC3S1400AN-4FGG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 27×27 array, 1.0 mm ball pitch, and 35 mm × 35 mm body size. The package supports thermal dissipation up to 2.5 W under typical operating conditions and is RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply - sets output voltage level and input threshold for pins in Bank 0 |
| P2 | GCLK1 | Global clock input - low-skew routing to all clock-capable resources across device |
| T14 | M0 | Configuration mode select - determines boot source (Master Serial, Slave Parallel, JTAG) |
| V17 | PROGRAM_B | Active-low configuration initiator - forces reconfiguration and clears SRAM contents |
| W18 | DONE | Open-drain status indicator - signals successful configuration completion and releases INIT_B |
| Y16 | CCLK | Configuration clock - generated internally or supplied externally during Master Serial mode |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash memory | Enables single-chip, instant-on operation with no external configuration device required |
| Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, 90° phase shift, and 50% duty cycle correction without external PLL ICs |
| SelectIO technology | Allows per-bank I/O voltage assignment (1.2V–3.3V) and mixed-voltage interface coexistence on same device |
| Boundary-scan (JTAG) | Supports IEEE 1149.1 compliance for PCB-level interconnect testing and in-system programming |
| MultiBoot capability | Permits storage and runtime selection of up to two independent configuration bitstreams for field-upgradable logic |
Applications
| Industrial PLC I/O Module | Medical Imaging Interface Bridge |
|---|---|
Use Scenario: Real-time acquisition and protocol translation between legacy analog sensors and EtherCAT fieldbus. IC Role / Device Role / Timing Role: Configurable logic fabric implementing sensor signal conditioning, SPI-to-EtherCAT packet mapping, and deterministic timing control. Use Value: Integrated Flash ensures reliable cold-start operation in unattended equipment; 502 I/Os accommodate diverse sensor channel counts and bus interfaces. | Use Scenario: High-speed pixel data aggregation from multiple CMOS image sensors to a PCIe host controller. IC Role / Device Role / Timing Role: Synchronizing parallel sensor streams, applying pixel-level corrections, and packing data into PCIe TLPs using embedded block RAM. Use Value: DCM-generated clocks align sensor sampling and PCIe transmit timing; 576 Kbits block RAM buffers bursty image frames without external memory latency. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O signals into a unified Ethernet backbone. IC Role / Device Role / Timing Role: Protocol-specific state machines, time-stamped message queuing, and deterministic arbitration logic. Use Value: Industrial temperature rating (-40°C to +100°C) meets DO-160E environmental test requirements; Flash retention prevents configuration loss during power cycling. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: High-speed pattern sequencer with precise edge placement, variable depth FIFOs, and programmable slew rate control. Use Value: -4 speed grade guarantees sub-1.2 ns timing resolution; per-bank I/O voltage support allows direct interfacing to 1.8V, 2.5V, and 3.3V DUTs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000AN-4FGG484C | Lower density (1M gates, 21,696 logic cells), 484-pin FBGA, commercial temp (0°C to +85°C), same Flash integration | Suitable for cost-sensitive, lower-I/O-count designs where industrial temp is not required | Select when BOM cost reduction and smaller footprint outweigh need for 502 I/Os and extended temperature operation |
| XC3S1600E-4FGG484C | No integrated Flash, requires external PROM, higher gate count (1.6M), same -4 speed grade, commercial temp only | Fits designs needing more logic but accepting external configuration complexity and reduced reliability | Choose if design already uses external configuration infrastructure and requires additional logic resources beyond XC3S1400AN |
Compared with XC3S1400AN-4FGG676I, the XC3S1000AN-4FGG484C trades I/O count and temperature range for lower cost and footprint, while the XC3S1600E-4FGG484C offers greater logic capacity at the expense of configuration reliability and industrial qualification - making XC3S1400AN-4FGG676I optimal for sealed, maintenance-free embedded systems requiring instant-on robustness.
Availability
XC3S1400AN-4FGG676I is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and avionics data concentrators requiring stable component supply and long-term lifecycle support.
Supply support for XC3S1400AN-4FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the legacy Spartan FPGA families, including Spartan-3AN, for industrial and aerospace applications.
The Spartan-3AN product line was designed to deliver nonvolatile, single-chip FPGA solutions for space-constrained, reliability-critical embedded systems requiring instant-on operation and configuration security.
FAQ
What is the configuration method supported by XC3S1400AN-4FGG676I?
The XC3S1400AN-4FGG676I supports three configuration modes: Master Serial (using on-chip Flash), Slave Parallel, and JTAG. Its integrated 16-Mb Flash enables autonomous power-up configuration without external PROM, reducing system startup time and component count. The XC3S1400AN-4FGG676I also supports MultiBoot for dual-bitstream field updates.
Does XC3S1400AN-4FGG676I require an external configuration PROM?
No, the XC3S1400AN-4FGG676I does not require an external configuration PROM due to its integrated 16-Mb Flash memory. This Flash stores the configuration bitstream and enables instant-on operation after power application. The XC3S1400AN-4FGG676I can be reprogrammed in-system via JTAG or through the configuration interface without hardware modification.
What I/O standards are supported by XC3S1400AN-4FGG676I?
The XC3S1400AN-4FGG676I supports LVCMOS, LVTTL, PCI, HSTL Class I/II, and SSTL Class II across independently powered I/O banks. Each bank accepts 1.2V–3.3V VCCO, enabling mixed-voltage interfaces on a single device. The XC3S1400AN-4FGG676I does not support differential standards like LVDS or RSDS natively without external termination.
Is XC3S1400AN-4FGG676I qualified for industrial temperature operation?
Yes, the XC3S1400AN-4FGG676I is rated for industrial temperature operation from -40°C to +100°C, as indicated by the "I" suffix in the part number. This qualification applies to the full functional specification, including I/O timing, configuration reliability, and logic performance - making the XC3S1400AN-4FGG676I suitable for fanless enclosures and thermally demanding environments.
Can XC3S1400AN-4FGG676I be used as a drop-in replacement for XC3S1400A-4FGG676I?
No, the XC3S1400AN-4FGG676I is not a drop-in replacement for the XC3S1400A-4FGG676I. While pin-compatible, the "N" suffix denotes integrated Flash memory and different configuration behavior. The XC3S1400AN-4FGG676I requires updated configuration circuitry and software flow; migrating from XC3S1400A to XC3S1400AN-4FGG676I necessitates board-level review and bitstream regeneration.
XC3S1400AN-4FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 502
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S1400AN-4FGG676I FAQ
1.How can I place an order for XC3S1400AN-4FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400AN-4FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400AN-4FGG676I reliable?
The price and inventory of XC3S1400AN-4FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400AN-4FGG676I is usually 5 days.
3.What payment methods are accepted for XC3S1400AN-4FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400AN-4FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400AN-4FGG676I?
XC3S1400AN-4FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400AN-4FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400AN-4FGG676I?
For technical support, including XC3S1400AN-4FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400AN-4FGG676I requirements.
6.How does Aetrix verify that XC3S1400AN-4FGG676I is sourced from the original manufacturer or authorized distributors?
All XC3S1400AN-4FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400AN-4FGG676I meets industry standards.
7.What is the process for return or replacement of XC3S1400AN-4FGG676I?
All XC3S1400AN-4FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400AN-4FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400AN-4FGG676I part is unused and in its original packaging.
Return procedure for XC3S1400AN-4FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S1400AN-4FGG676I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
