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AMD XC3S1400AN-5FG484C
- Part No.:
- XC3S1400AN-5FG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S1400AN-5FG484C.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,075
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Product details
Overview
XC3S1400AN-5FG484C from AMD (formerly Xilinx) is a Spartan-3AN field-programmable gate array (FPGA) with 1,400,000 system gates, 29,952 logic cells, and embedded flash configuration memory. It operates at -5 speed grade (118 MHz system clock), uses 484-pin Fine-Pitch Ball Grid Array (FBGA) packaging, and supports single-chip, non-volatile configuration for industrial control applications.
For engineers reviewing the XC3S1400AN-5FG484C datasheet, pinout, applications, or equivalent options, key selection factors include embedded Flash retention time, I/O bank voltage flexibility (1.2 V to 3.3 V), and integrated configuration memory eliminating external PROM dependency.
Technical Context
The XC3S1400AN-5FG484C integrates on-chip Flash memory enabling instant-on operation and reconfiguration without external configuration devices. Its architecture includes 176 SelectIO™ I/O pins organized across eight banks, each independently configurable for 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V signaling standards.
It features 128 dedicated multiplier blocks (18 × 18-bit), 520 Kbits of distributed RAM, and supports JTAG boundary-scan testing per IEEE 1149.1. Configuration occurs via Master Serial, Slave Serial, or JTAG modes, with full support for in-system programming (ISP) through the embedded Flash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,952 - provides scalable combinational and sequential logic resources for medium-complexity digital systems |
| System Gates | 1,400,000 - indicates total equivalent ASIC gate count for architectural sizing and capacity planning |
| Embedded Flash | 2 Mbits - enables single-chip configuration storage, eliminating external PROM and reducing BOM count |
| I/O Pins | 176 - supports multi-voltage interface bridging across mixed-signal subsystems |
| Speed Grade | -5 - guarantees 118 MHz maximum system clock frequency under worst-case industrial conditions |
| Distributed RAM | 520 Kbits - supplies fast, low-latency local memory for state machines and small buffers |
| Multipliers | 128 × 18×18-bit - accelerates arithmetic-intensive functions like filtering and motor control loops |
Pinout & Package
XC3S1400AN-5FG484C uses a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23 mm × 23 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-237AC footprint. Thermal pad is not present; package is RoHS-compliant and lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for internal logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, JTAG, and certain I/O banks |
| VCCO_0–VCCO_7 | I/O bank power | Independent 1.2–3.3 V supplies per bank enable mixed-voltage interfacing |
| PROGRAM_B | Configuration reset | Active-low signal initiating FPGA reinitialization and Flash reload |
| DONE | Configuration status | Open-drain output indicating successful configuration completion |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant test and programming access for debugging and ISP |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash memory | Enables zero-external-component configuration and eliminates boot PROM, reducing board area and startup latency |
| Multi-voltage I/O banks | Allows direct connection to diverse peripherals (e.g., 1.8 V sensors, 3.3 V microcontrollers) without level shifters |
| In-system programmability (ISP) | Supports field firmware updates via JTAG or serial interface without removing FPGA from PCB |
| Embedded block RAM | Provides 520 Kbits of fast, synchronous memory for FIFOs, lookup tables, and control state storage |
| Configurable I/O standards | Supports LVCMOS, LVTTL, PCI, SSTL, and HSTL standards per bank for flexible system integration |
Applications
| Industrial PLC Controllers | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time logic sequencing and I/O conditioning in modular PLC backplanes. IC Role / Device Role / Timing Role: Configurable logic fabric executing deterministic scan cycles with sub-microsecond I/O response. Use Value: Embedded Flash ensures reliable cold-start operation after power loss without external configuration delay. | Use Scenario: Pattern generation, response capture, and DUT interface adaptation in benchtop ATE platforms. IC Role / Device Role / Timing Role: High-speed digital pattern engine synchronizing multiple parallel test channels at up to 118 MHz. Use Value: 176 multi-voltage I/O pins allow direct connection to DUTs operating at 1.2 V to 3.3 V without external level translation. |
| Motor Drive Control Units | Communications Interface Gateways |
Use Scenario: Field-oriented control (FOC) loop execution and PWM signal generation in servo drive modules. IC Role / Device Role / Timing Role: Real-time hardware accelerator offloading CPU from timing-critical PWM edge placement and current sampling. Use Value: 128 dedicated 18×18 multipliers enable simultaneous execution of three-phase Clarke/Park transforms and PI regulators. | Use Scenario: Protocol bridging between CAN, RS-485, and Ethernet PHY layers in industrial gateways. IC Role / Device Role / Timing Role: Glue logic and packet routing engine managing asynchronous data flow between heterogeneous interfaces. Use Value: Independent I/O bank voltage control permits native interfacing to CAN transceivers (5 V tolerant), RS-485 drivers (3.3 V), and Ethernet MACs (1.8 V). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG456C | Lower logic density (19,200 LC), no embedded Flash, requires external configuration PROM | Suitable for cost-sensitive designs where Flash integration is non-critical and board space allows external memory | Select when lower gate count suffices and BOM cost reduction outweighs Flash convenience |
| XC3S1600E-4FG484C | Higher logic density (33,280 LC), no embedded Flash, same package footprint but different thermal profile | Better suited for larger state machines or multi-channel signal processing where extra resources justify external PROM use | Choose when design scale exceeds XC3S1400AN capacity but FBGA-484 mechanical compatibility is required |
Compared with XC3S1400AN-5FG484C, the XC3S1000-4FG456C reduces gate count and removes Flash-increasing board complexity but lowering unit cost; the XC3S1600E-4FG484C adds logic capacity while retaining pinout compatibility but reintroduces external configuration dependency.
Availability
XC3S1400AN-5FG484C is available at Aetrix Electronics and suitable for industrial automation, motor control, and communications gateway applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC3S1400AN-5FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and markets adaptive computing solutions including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and industrial applications.
The Spartan-3AN family was originally designed by Xilinx to deliver cost-optimized, flash-based FPGAs for industrial and automotive applications requiring instant-on, high-reliability configuration and extended temperature operation.
FAQ
What is the configuration method supported by XC3S1400AN-5FG484C?
The XC3S1400AN-5FG484C supports Master Serial, Slave Serial, and JTAG configuration modes. Its integrated 2 Mbit Flash enables Master Serial mode without external PROM, allowing immediate operation after power-up. JTAG supports in-system programming for field updates, and all modes comply with IEEE 1532 standards for configuration data integrity.
Does XC3S1400AN-5FG484C require external configuration memory?
No, XC3S1400AN-5FG484C does not require external configuration memory due to its on-chip 2 Mbit Flash. This eliminates the need for external SPI PROM or configuration controllers, simplifying board layout, reducing BOM count, and improving startup reliability in unattended industrial environments where XC3S1400AN-5FG484C is deployed.
What I/O standards are supported by XC3S1400AN-5FG484C?
XC3S1400AN-5FG484C supports LVCMOS, LVTTL, PCI, SSTL-2, SSTL-3, and HSTL I/O standards. Each of its eight I/O banks can be independently powered from 1.2 V to 3.3 V, enabling native interfacing with mixed-voltage peripherals without external level shifters-a key capability in systems using XC3S1400AN-5FG484C for protocol bridging or sensor aggregation.
What is the maximum operating junction temperature for XC3S1400AN-5FG484C?
The XC3S1400AN-5FG484C is rated for industrial temperature range (–40 °C to +100 °C junction). Its thermal design supports continuous operation at full speed grade (-5) under ambient conditions up to +85 °C with appropriate PCB copper pour and airflow, making it suitable for enclosed XC3S1400AN-5FG484C-based control units in factory-floor environments.
Can XC3S1400AN-5FG484C be reprogrammed in the field?
Yes, XC3S1400AN-5FG484C supports in-system programming (ISP) via JTAG or serial interface. Its embedded Flash allows full bitstream rewrites while powered and mounted on the target board, enabling firmware upgrades, bug fixes, and feature enhancements without physical device replacement-critical for remote XC3S1400AN-5FG484C deployments in infrastructure or transportation systems.
XC3S1400AN-5FG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2816
- Number of Logic Elements/Cells:
- 25344
- Total RAM Bits:
- 589824
- Number of I/O:
- 372
- Number of Gates:
- 1400000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S1400AN-5FG484C FAQ
1.How can I place an order for XC3S1400AN-5FG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1400AN-5FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1400AN-5FG484C reliable?
The price and inventory of XC3S1400AN-5FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1400AN-5FG484C is usually 5 days.
3.What payment methods are accepted for XC3S1400AN-5FG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1400AN-5FG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1400AN-5FG484C?
XC3S1400AN-5FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1400AN-5FG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1400AN-5FG484C?
For technical support, including XC3S1400AN-5FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1400AN-5FG484C requirements.
6.How does Aetrix verify that XC3S1400AN-5FG484C is sourced from the original manufacturer or authorized distributors?
All XC3S1400AN-5FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1400AN-5FG484C meets industry standards.
7.What is the process for return or replacement of XC3S1400AN-5FG484C?
All XC3S1400AN-5FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1400AN-5FG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1400AN-5FG484C part is unused and in its original packaging.
Return procedure for XC3S1400AN-5FG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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