AMD XC3S1400AN-5FGG484C

Overview

XC3S1400AN-5FGG484C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 1,400,000 system gates, 29,952 logic cells, and embedded Flash memory enabling single-chip configuration. It features 484-pin Fine-Pitch Ball Grid Array (FBGA) packaging, operates at -5 speed grade (1.57 ns CLB delay), and supports 3.3 V/2.5 V/1.2 V I/O standards. It is used in industrial control logic and reconfigurable embedded interfaces.

For engineers reviewing the XC3S1400AN-5FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include embedded Flash retention, I/O voltage flexibility, CLB timing performance, and industrial temperature range compliance.

Technical Context

The XC3S1400AN-5FGG484C integrates non-volatile Flash configuration memory with SRAM-based logic fabric, eliminating external configuration PROMs. It supports JTAG boundary-scan and SelectMAP parallel programming modes, and includes 128 Kbits of distributed RAM plus 1,872 Kbits of block RAM.

Its I/O bank architecture allows mixed-voltage operation across four independent banks, each supporting LVCMOS, LVTTL, PCI, and SSTL-2 I/O standards. The device implements Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction without external components.

Key Specifications

Pinout & Package

Package: 484-ball Fine-Pitch BGA (FGG), 23×23 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC3S1400AN-5FGG484C, XC3S1000-5FGG456C reduces cost and complexity where Flash is unnecessary, while XC6SLX150-3FGG484C extends capabilities with hardened memory controllers and higher logic capacity-both require layout adaptation due to differing pin functions and power delivery requirements.

Availability

XC3S1400AN-5FGG484C is available at Aetrix Electronics and suitable for industrial control, medical imaging subsystems, and avionics interface modules requiring stable component supply and long-term manufacturability.

Supply support for XC3S1400AN-5FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Spartan FPGA portfolio for cost-optimized, high-volume programmable logic applications.

The Spartan-3AN family was designed for embedded systems requiring instant-on operation, reduced board space, and elimination of external configuration memory in industrial and communications equipment.

FAQ

What is the configuration method supported by XC3S1400AN-5FGG484C?

The XC3S1400AN-5FGG484C supports multiple configuration methods including Master Serial (via dedicated CCLK and DIN pins), Slave Serial, SelectMAP parallel, and JTAG boundary-scan. Its integrated Flash allows autonomous startup without external PROM, and configuration can be reloaded in-system via JTAG or processor-controlled SelectMAP.

Does XC3S1400AN-5FGG484C require external configuration memory?

No, XC3S1400AN-5FGG484C does not require external configuration memory. It contains 4 Mbit of embedded Flash that stores the configuration bitstream, enabling power-on initialization without external devices. This simplifies system design and improves reliability in environments prone to power interruption.

What I/O standards are supported by XC3S1400AN-5FGG484C?

XC3S1400AN-5FGG484C supports LVCMOS, LVTTL, PCI, and SSTL-2 I/O standards across its four independent I/O banks. Each bank can be independently powered at 3.3 V, 2.5 V, or 1.2 V, enabling direct interfacing with mixed-voltage peripherals such as legacy 5 V-tolerant devices, modern low-voltage sensors, and memory interfaces.

What is the operating temperature range of XC3S1400AN-5FGG484C?

XC3S1400AN-5FGG484C is rated for 0°C to +85°C ambient operation (Commercial Extended grade). This range supports deployment in industrial control cabinets, medical equipment enclosures, and transportation electronics where passive cooling and moderate thermal cycling are expected.

How many Digital Clock Managers (DCMs) does XC3S1400AN-5FGG484C include?

XC3S1400AN-5FGG484C includes two fully featured Digital Clock Managers (DCMs). Each DCM provides clock doubling, frequency synthesis, phase shifting in 0–255° steps, and 50% duty cycle correction-enabling precise clock domain management without external PLL ICs or discrete timing components.