AMD XC3S1400AN-5FGG676C

Overview

XC3S1400AN-5FGG676C from AMD (formerly Xilinx) is a Spartan-3AN FPGA featuring 1,400,000 system gates, 29,952 logic cells, and integrated 16 Mbit on-chip Flash memory for single-chip configuration. It operates at -5 speed grade (118 MHz system clock), uses 1.2 V core voltage, and is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch.

For engineers reviewing the XC3S1400AN-5FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include embedded Flash non-volatility, I/O count (502 user I/Os), LVCMOS33/LVDS interface support, and industrial temperature range (0°C to 85°C) suitability for reconfigurable logic in space-constrained embedded control systems.

Technical Context

This device belongs to the Spartan-3AN family, integrating Flash-based configuration memory and SRAM-based logic fabric in a single die. Its architecture supports JTAG, Master Serial, and Slave SelectMAP configuration modes, with built-in SEU mitigation via Flash lock bits and CRC checking.

The XC3S1400AN-5FGG676C includes 128 block RAMs (each 18 Kbits), 48 DCMs (Digital Clock Managers), and supports differential signaling standards including LVDS, RSDS, and BLVDS across dedicated I/O banks. All I/Os are configurable for voltage levels from 1.2 V to 3.3 V.

Key Specifications

Pinout & Package

XC3S1400AN-5FGG676C is housed in a 676-ball Fine-Pitch BGA (FGG) package with 0.8 mm ball pitch and 27 × 27 array. The package supports lead-free (Pb-free) assembly and meets JEDEC MO-251 specifications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC3S1400AN-5FGG676C, the XC3S1000-5FGG676C reduces gate count and Flash size but maintains pin compatibility and thermal profile, while the XC3S1600E-5FGG676C trades Flash integration for greater logic capacity-making each suitable for distinct trade-offs between configurability, density, and system-level component count.

Availability

XC3S1400AN-5FGG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, avionics data concentration, and programmable logic controller applications requiring stable component supply and long-term lifecycle support.

Supply support for XC3S1400AN-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops and supports the Spartan FPGA product families originally introduced by Xilinx. The company focuses on adaptive computing solutions for data center, AI, and embedded markets.

The Spartan-3AN family was designed specifically for cost-sensitive, space-constrained embedded systems requiring instant-on, non-volatile, and reprogrammable logic - especially where external configuration memory adds cost, complexity, or reliability risk.

FAQ

What is the operating temperature range for XC3S1400AN-5FGG676C?

The XC3S1400AN-5FGG676C is rated for industrial temperature operation from 0°C to +85°C ambient. This range is validated per device characterization and applies to all I/O and core logic functions under specified voltage and loading conditions. Thermal derating is not required within this envelope, and the device supports full-speed operation (-5 speed grade) across the entire range. XC3S1400AN-5FGG676C does not offer an extended or automotive temperature variant.

Does XC3S1400AN-5FGG676C require an external configuration device?

No, XC3S1400AN-5FGG676C integrates 16 Mbit of on-chip Flash memory, enabling complete bitstream storage and autonomous configuration at power-up. External PROMs or microcontrollers are optional only for advanced use cases like multi-image selection or remote updates. The XC3S1400AN-5FGG676C supports Master Serial, Slave SelectMAP, and JTAG configuration modes directly from its internal Flash.

How many differential I/O standards does XC3S1400AN-5FGG676C support?

XC3S1400AN-5FGG676C supports LVDS, RSDS, and BLVDS across dedicated I/O banks, with up to 252 differential pairs available depending on bank assignment and termination configuration. Each differential standard is implemented in hardware with matched internal delays and calibrated output drivers. XC3S1400AN-5FGG676C does not support TMDS or PCIe Gen1 signaling natively.

Can XC3S1400AN-5FGG676C be reprogrammed in-system?

Yes, XC3S1400AN-5FGG676C supports in-system programming (ISP) via JTAG or Slave SelectMAP interface. The on-chip Flash can be erased and rewritten multiple times (minimum 20,000 program/erase cycles per sector). Reprogramming preserves I/O states during transition, and XC3S1400AN-5FGG676C allows partial reconfiguration of logic regions without resetting the entire device.

What clock management resources are included in XC3S1400AN-5FGG676C?

XC3S1400AN-5FGG676C includes 48 Digital Clock Managers (DCMs), each capable of frequency synthesis, phase shifting, duty cycle correction, and clock doubling. DCM outputs drive global clock networks with sub-nanosecond skew. These resources are distributed across the die and support independent configuration per DCM. XC3S1400AN-5FGG676C does not include PLLs or MMCMs - DCMs are its sole clock synthesis primitive.