AMD XC3S1500-4FG320C

Overview

XC3S1500-4FG320C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,471,248 system gates, 1500 logic cells, 128 KB of block RAM, and a 4 ns CLB delay. It features 232 user I/Os in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package, used in industrial control logic and reconfigurable digital signal processing systems.

For engineers reviewing the XC3S1500-4FG320C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, CLB propagation delay, and temperature grade compliance for embedded control and protocol bridging.

Technical Context

The XC3S1500-4FG320C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports LVCMOS, LVTTL, PCI, and HSTL I/O standards across its 232 user-accessible pins, with internal global clock networks and DLL-based clock management.

This device uses 90 nm CMOS process technology and operates at 1.2 V core voltage with commercial temperature range (0°C to 85°C). Its configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan interface.

Key Specifications

Pinout & Package

XC3S1500-4FG320C is housed in a 320-ball fine-pitch BGA (FBGA) package with 1.0 mm × 1.0 mm body size and 0.8 mm ball pitch. Pin assignments follow Xilinx Spartan-3 family standard ball map, with dedicated configuration, clock, and I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1500-4FG320C, the XC3S1000-4FG320C offers lower cost but constrains memory-intensive tasks, while the XC3S2000-4FG320C delivers headroom for feature expansion-both retain identical thermal and mechanical integration requirements.

Availability

XC3S1500-4FG320C is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and video processing applications requiring stable component supply and long-term design-in support.

Supply support for XC3S1500-4FG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.

The Spartan-3 family was designed for cost-sensitive, high-volume embedded logic replacement-targeting industrial control, consumer video, and communications infrastructure where performance-per-dollar matters.

FAQ

What is the maximum operating frequency supported by XC3S1500-4FG320C?

The XC3S1500-4FG320C achieves a maximum system clock frequency of up to 280 MHz under typical conditions, based on its 4 ns CLB delay and Digital Clock Manager (DCM) capabilities. Actual achievable frequency depends on design routing, logic depth, and I/O timing constraints. The XC3S1500-4FG320C datasheet specifies timing parameters for all speed grades, with -4 indicating the fastest commercial-grade variant.

Does XC3S1500-4FG320C support JTAG programming?

Yes, XC3S1500-4FG320C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and in-system verification. The TCK, TMS, TDI, and TDO pins are dedicated and electrically compatible with standard JTAG adapters. This capability allows direct programming and real-time signal observation without requiring external configuration PROM, making the XC3S1500-4FG320C suitable for development and field updates.

What voltage supplies are required for XC3S1500-4FG320C operation?

XC3S1500-4FG320C requires two distinct supply voltages: 1.2 V ±3% for the core logic (VCCINT) and 2.5 V ±5% for the I/O banks and auxiliary circuitry (VCCAUX). Decoupling capacitors must be placed near respective power balls per Xilinx layout guidelines. The XC3S1500-4FG320C does not support single-supply operation or voltage regulation internally.

Is XC3S1500-4FG320C RoHS compliant?

Yes, XC3S1500-4FG320C is RoHS-6 compliant, meeting EU Directive 2011/65/EU requirements for restriction of hazardous substances. Lead-free soldering is supported with standard Pb-free reflow profiles. The XC3S1500-4FG320C packaging uses matte tin finish on solder balls and halogen-free molding compound, as documented in Xilinx's official material declarations.

Can XC3S1500-4FG320C be used in automotive applications?

No, XC3S1500-4FG320C is rated only for commercial temperature range (0°C to +85°C) and lacks AEC-Q100 qualification. It is not intended for under-hood or safety-critical automotive systems. For such use cases, designers should consider Xilinx Automotive-grade Spartan-3A or later families. The XC3S1500-4FG320C remains appropriate for cabin-infotainment or test equipment used in automotive R&D environments.