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AMD XC3S1500-4FG456I

Part No.:
XC3S1500-4FG456I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
456-BBGA
Datasheet:
AetrixXC3S1500-4FG456I.pdf
Description:
IC FPGA 333 I/O 456FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,450

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Product details

Overview

XC3S1500-4FG456I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,474,560 system gates, 116 I/O pins, and a -4 speed grade operating at up to 333 MHz logic performance in the 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It integrates 128 embedded 18×18 multipliers and supports SelectIO™ standards including LVCMOS, LVTTL, PCI, and HSTL.

For engineers reviewing the XC3S1500-4FG456I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage flexibility (1.2 V to 3.3 V), distributed RAM capacity (576 Kbits), and support for JTAG boundary-scan testing per IEEE 1149.1.

Technical Context

The XC3S1500-4FG456I implements a configurable logic block (CLB) architecture with four 3-input LUTs and eight flip-flops per CLB, enabling high-density synchronous logic implementation. It includes dedicated carry logic for fast arithmetic and supports dual-edge clocking for efficient register utilization.

Configuration is performed via Master Serial mode using an external PROM or through JTAG, with internal startup circuitry managing power-on reset and configuration sequencing. The device supports full IEEE 1149.1 boundary-scan testing and features programmable I/O drive strength (2 mA to 24 mA) and slew rate control.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells29,440 - provides gate-equivalent density for medium-complexity digital control and interface logic
System Gates1,474,560 - indicates total combinational logic capacity for ASIC replacement or glue logic consolidation
I/O Pins116 - supports multi-protocol interface bridging with bank-wise voltage isolation
Distributed RAM576 Kbits - enables small FIFOs, state machines, and lookup tables without block RAM usage
Embedded Multipliers128 × 18×18 - accelerates DSP functions such as FIR filtering and motor control algorithms
Speed Grade-4 - guarantees timing closure at 333 MHz for critical path logic in industrial control designs
Configuration ModeMaster Serial / JTAG - allows flexible programming via PROM or in-system debugging during development

Pinout & Package

Package: 456-pin Fine-Pitch Ball Grid Array (FBGA), 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant, lead-free.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCINT1.2 V core supply input for internal logic and CLBs
P2VCCAUX2.5 V auxiliary supply for configuration circuitry and JTAG
A1VCCO_03.3 V I/O bank supply for Bank 0 (pins A1–D12)
T1PROGRAM_BActive-low asynchronous reset initiating reconfiguration sequence
R2INIT_BOpen-drain status output indicating configuration progress and completion
U1CCLKConfiguration clock input driving serial bitstream loading
W2DINSerial data input for Master Serial configuration mode
Y1TCKJTAG test clock for boundary-scan and debug access

Key Features

FeatureDesign Value
SelectIO™ TechnologySupports 15+ I/O standards across 8 banks with independent VCCO per bank for mixed-voltage interfacing
Dedicated Carry ChainEnables high-speed arithmetic (e.g., counters, adders) with < 0.5 ns carry propagation per stage
Four-Input LUTsEach CLB contains four 4-LUTs with local interconnect, optimizing logic depth and reducing routing congestion
Block RAM576 Kbits of distributed RAM + 576 Kbits of block RAM (36 × 16 Kbit blocks) for memory-intensive tasks
Multi-Voltage I/OConfigurable I/O banks accept 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V VCCO, enabling direct connection to diverse peripherals

Applications

Industrial Motion ControlAutomotive ADAS Interface

Use Scenario: Real-time servo loop coordination and encoder signal processing in CNC machine controllers.

IC Role / Device Role / Timing Role: FPGA fabric implements deterministic PWM generation, quadrature decoding, and safety-critical logic with sub-microsecond latency.

Use Value: 116 I/O pins enable simultaneous connection to multiple axes, analog inputs, and fieldbus interfaces without external glue logic.

Use Scenario: Sensor fusion preprocessing between radar, camera, and CAN-FD modules in Level 2 ADAS domain controllers.

IC Role / Device Role / Timing Role: Configurable logic handles protocol translation, timestamp alignment, and pre-filtering before MCU ingestion.

Use Value: SelectIO™ support for 1.8 V LVDS and 3.3 V CAN transceivers allows direct sensor and bus interfacing within one device.

Medical Imaging Data PathTest & Measurement Instrumentation

Use Scenario: High-throughput pixel data aggregation and real-time histogram computation in ultrasound beamformers.

IC Role / Device Role / Timing Role: Embedded 18×18 multipliers execute parallel FIR filtering on echo return streams; distributed RAM buffers sample windows.

Use Value: 128 multipliers deliver >2.1 GOPS at 100 MHz, meeting real-time processing deadlines for 12-bit/40 MSPS data paths.

Use Scenario: Digital pattern generation and acquisition synchronization in automated test equipment (ATE) platforms.

IC Role / Device Role / Timing Role: FPGA implements precise timing engines, jitter-tolerant clock recovery, and parallel-to-serial conversion for 100+ channel DUT interfacing.

Use Value: -4 speed grade ensures setup/hold timing margins under worst-case temperature and voltage conditions across production units.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic and interface bridging applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S1000-4FG456I1,000,000 system gates, 21,120 logic cells, identical package and pinout but reduced multiplier count (96 vs. 128)Suitable for lower gate-count control logic where DSP resources are not requiredSelect when design fits within 1M gate budget and avoids over-provisioning logic resources
XC3S2000-4FG456I2,000,000 system gates, 33,280 logic cells, same I/O count and package, higher multiplier count (160 vs. 128)Required for larger state machines, wider datapaths, or additional protocol stacks (e.g., PCIe endpoint logic)Choose when XC3S1500-4FG456I fails timing closure or exceeds resource utilization by >15%

Compared with XC3S1000-4FG456I and XC3S2000-4FG456I, the XC3S1500-4FG456I offers balanced logic density, I/O count, and DSP resources-making it optimal for mid-scale industrial controllers where cost, performance, and footprint must be jointly optimized.

Availability

XC3S1500-4FG456I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging subsystems, and test instrumentation requiring stable component supply and long-term manufacturing continuity.

Supply support for XC3S1500-4FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues to support the Spartan-3 product family for legacy industrial and aerospace applications.

The Spartan-3 FPGA family was designed for cost-sensitive, high-volume applications requiring reliable programmable logic with integrated I/O and DSP capability-targeting industrial automation, medical devices, and communications infrastructure.

FAQ

What is the maximum operating frequency of the XC3S1500-4FG456I?

The XC3S1500-4FG456I has a -4 speed grade, guaranteeing timing closure for logic paths operating up to 333 MHz under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design topology, placement, and routing, but the device's dedicated carry chain and fast LUTs support sub-3 ns critical path delays in typical implementations of the XC3S1500-4FG456I.

Does the XC3S1500-4FG456I support JTAG boundary-scan testing?

Yes, the XC3S1500-4FG456I fully complies with IEEE 1149.1 and supports JTAG boundary-scan testing for PCB-level interconnect verification. Pins TCK, TMS, TDI, and TDO are dedicated for this function, and the device includes internal scan chains covering I/O buffers and configuration logic-enabling in-circuit validation without requiring the XC3S1500-4FG456I to be operational.

What configuration methods are supported by the XC3S1500-4FG456I?

The XC3S1500-4FG456I supports Master Serial, Slave Serial, and JTAG configuration modes. In Master Serial mode, it drives CCLK and reads bitstream from an external PROM; JTAG mode enables in-system programming and debugging. All modes use the same XC3S1500-4FG456I configuration logic and retain full functionality regardless of method selected.

Can the XC3S1500-4FG456I operate with mixed I/O voltages on different banks?

Yes, the XC3S1500-4FG456I features eight independently powered I/O banks, each supporting VCCO from 1.2 V to 3.3 V. This allows simultaneous interfacing with 1.8 V sensors, 3.3 V microcontrollers, and 2.5 V memory-without level shifters-as long as each bank's VCCO matches the connected peripheral's I/O voltage, a capability confirmed in the XC3S1500-4FG456I datasheet.

Is the XC3S1500-4FG456I still in active production?

The XC3S1500-4FG456I is in continued production under AMD's longevity program for industrial and aerospace customers. While no new design wins are encouraged, AMD maintains committed supply for existing programs with documented lifecycle requirements, and Aetrix Electronics stocks the XC3S1500-4FG456I with full traceability and extended availability planning.

XC3S1500-4FG456I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
456-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
333
Number of Gates:
1500000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
456-FBGA (23x23)

XC3S1500-4FG456I FAQ

1.How can I place an order for XC3S1500-4FG456I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S1500-4FG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S1500-4FG456I reliable?

The price and inventory of XC3S1500-4FG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1500-4FG456I is usually 5 days.

3.What payment methods are accepted for XC3S1500-4FG456I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1500-4FG456I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S1500-4FG456I?

XC3S1500-4FG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S1500-4FG456I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S1500-4FG456I?

For technical support, including XC3S1500-4FG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1500-4FG456I requirements.

6.How does Aetrix verify that XC3S1500-4FG456I is sourced from the original manufacturer or authorized distributors?

All XC3S1500-4FG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1500-4FG456I meets industry standards.

7.What is the process for return or replacement of XC3S1500-4FG456I?

All XC3S1500-4FG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1500-4FG456I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S1500-4FG456I part is unused and in its original packaging.

Return procedure for XC3S1500-4FG456I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S1500-4FG456I Tags

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