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AMD XC3S1500-4FG676C

Part No.:
XC3S1500-4FG676C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BGA
Datasheet:
AetrixXC3S1500-4FG676C.pdf
Description:
IC FPGA 487 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,193

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Product details

Overview

XC3S1500-4FG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA featuring 1,474,560 system gates, 112 I/O pins, and a -4 speed grade in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It integrates up to 576 Kbits of block RAM, 96 multipliers, and supports LVCMOS/LVTTL I/O standards for embedded control and digital logic acceleration.

For engineers reviewing the XC3S1500-4FG676C datasheet, pinout, applications, or equivalent options, key selection factors include system gate count, I/O voltage compatibility, block RAM depth, multiplier count, and timing closure at -4 speed grade.

Technical Context

The XC3S1500-4FG676C implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry logic for arithmetic functions. It includes eight Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction across multiple clock domains.

Configuration is performed via Master Serial or JTAG mode using external PROM or processor-controlled interface. The device supports SelectIO standards including LVCMOS 3.3V/2.5V/1.8V, LVTTL, PCI, and SSTL, with programmable slew rate and drive strength per bank.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells29,440 configurable logic cells (CLBs), each with two 4-LUTs and flip-flops - determines maximum combinational/sequential logic density.
System Gates1,474,560 system gates - benchmark for relative logic capacity vs. ASIC equivalents.
Block RAM576 Kbits total (144 × 4K-bit blocks) - enables on-chip FIFOs, buffers, and small lookup tables without external memory.
I/O Pins112 user I/O pins in FG676 package - defines maximum parallel interface width and peripheral connectivity.
DCMs8 Digital Clock Managers - provides jitter-tolerant clock synthesis, phase alignment, and input clock doubling for synchronous design.
Speed Grade-4 grade - guarantees timing performance up to 333 MHz for internal logic paths under specified conditions.

Pinout & Package

Package: 676-ball Fine-Pitch Ball Grid Array (FBGA), 27 × 27 mm, 1.0 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCINT1.2 V core supply input - powers CLB and block RAM logic; requires low-noise local regulation.
P2VCCAUX2.5 V auxiliary supply - powers DCMs, configuration logic, and JTAG interface.
A1VCCO_03.3 V I/O bank supply - sets output voltage level and input threshold for Bank 0 pins.
T14PROGRAM_BActive-low configuration reset - initiates reconfiguration when pulled low asynchronously.
R15INIT_BOpen-drain status output - indicates configuration memory readiness during startup.
T15DONEOpen-drain configuration completion - goes high when bitstream loading and verification succeed.

Key Features

FeatureDesign Value
Eight DCMsEnables independent clock domain management with ±150 ps phase shift resolution and 0.1% duty cycle correction.
144 × 4K-bit block RAMSupports dual-port read/write access with byte-write enable - suitable for asynchronous FIFO implementation.
96 dedicated 18×18 multipliersPerforms signed/unsigned multiplication in one cycle - accelerates FIR filters and motor control algorithms.
SelectIO technologyAllows per-bank I/O standard assignment (LVCMOS, LVTTL, PCI) - simplifies mixed-voltage board design.

Applications

Industrial Motion ControlCommunications Baseband Processing

Use Scenario: Real-time servo loop execution with encoder feedback and PWM generation in CNC machines.

IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controller and high-resolution PWM timing engine.

Use Value: 112 I/O pins support simultaneous analog input sampling, digital I/O, and serial comms; -4 speed grade ensures sub-microsecond loop latency.

Use Scenario: Channelization and symbol mapping in wireless infrastructure base stations.

IC Role / Device Role / Timing Role: Configurable datapath processes QPSK/QAM modulation symbols with deterministic latency.

Use Value: 96 multipliers and 576 Kbits block RAM enable parallel filter banks and symbol buffer storage without external memory.

Automotive ADAS PreprocessingTest & Measurement Pattern Generation

Use Scenario: Pixel-level image preprocessing (gamma correction, edge detection) before sensor fusion in driver assistance systems.

IC Role / Device Role / Timing Role: Parallel pixel pipeline implemented in LUT fabric with synchronized clock domains via DCMs.

Use Value: Block RAM used for line buffers; 8 DCMs manage sensor clock recovery, pixel clocking, and host interface timing.

Use Scenario: High-speed digital pattern generation for IC functional validation and boundary-scan testing.

IC Role / Device Role / Timing Role: Generates synchronized multi-channel stimulus waveforms with precise setup/hold timing.

Use Value: -4 speed grade guarantees 333 MHz internal timing; 112 I/O pins support wide parallel bus patterns at 100+ MHz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S1000-4FG676C1,011,456 system gates, 21,248 CLBs, 468 Kbits block RAM - lower logic density and memory capacity.Suitable for smaller control logic or fewer parallel datapaths; insufficient for full baseband channelization.Select when cost sensitivity outweighs gate count requirements and design fits within reduced resources.
XC3S2000-4FG676C2,030,592 system gates, 37,440 CLBs, 720 Kbits block RAM - higher density and memory bandwidth.Required for complex video pipelines or multi-channel DSP where XC3S1500-4FG676C reaches resource limits.Choose when additional CLBs or block RAM are needed post-place-and-route analysis.

Compared with XC3S1000-4FG676C and XC3S2000-4FG676C, the XC3S1500-4FG676C offers balanced logic capacity and memory for mid-complexity real-time control and signal processing - avoiding overdesign while maintaining margin for timing closure and future feature expansion.

Availability

XC3S1500-4FG676C is available at Aetrix Electronics and suitable for industrial motion control, communications baseband processing, and test & measurement equipment requiring stable component supply and long-term production support.

Supply support for XC3S1500-4FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Virtex, and Artix FPGA families for adaptive computing applications.

The Spartan-3 family, including XC3S1500-4FG676C, was designed for cost-sensitive, high-volume embedded systems requiring reconfigurable logic with predictable timing and low power consumption.

FAQ

What is the maximum operating frequency of the XC3S1500-4FG676C?

The XC3S1500-4FG676C has a -4 speed grade, guaranteeing internal logic path timing performance up to 333 MHz under specified voltage and temperature conditions. Actual achievable frequency depends on design complexity, routing, and clock domain constraints - verified through static timing analysis in Xilinx ISE.

Does the XC3S1500-4FG676C support JTAG configuration?

Yes, the XC3S1500-4FG676C supports IEEE 1149.1 JTAG boundary-scan and configuration via the TCK/TMS/TDI/TDO pins. JTAG mode allows in-system programming, debugging, and verification without requiring external PROM or microcontroller intervention.

How many Digital Clock Managers (DCMs) does the XC3S1500-4FG676C include?

The XC3S1500-4FG676C includes eight fully independent Digital Clock Managers (DCMs). Each DCM provides input clock multiplication, phase shifting, duty cycle correction, and clock deskew - essential for managing multiple synchronous domains in complex designs.

What I/O standards are supported by the XC3S1500-4FG676C?

The XC3S1500-4FG676C supports SelectIO standards including LVCMOS 1.2V/1.5V/1.8V/2.5V/3.3V, LVTTL, PCI, and SSTL18. I/O voltage is configured per bank using VCCO pins, enabling mixed-voltage interface coexistence on a single device.

Is the XC3S1500-4FG676C still in active production?

The XC3S1500-4FG676C is a mature Spartan-3 device no longer in active production by AMD/Xilinx, but Aetrix Electronics maintains inventory and offers extended lifecycle support, including traceable legacy sourcing and obsolescence mitigation planning for ongoing manufacturing programs.

XC3S1500-4FG676C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
676-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
487
Number of Gates:
1500000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FBGA (27x27)

XC3S1500-4FG676C FAQ

1.How can I place an order for XC3S1500-4FG676C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S1500-4FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S1500-4FG676C reliable?

The price and inventory of XC3S1500-4FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1500-4FG676C is usually 5 days.

3.What payment methods are accepted for XC3S1500-4FG676C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1500-4FG676C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S1500-4FG676C?

XC3S1500-4FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S1500-4FG676C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S1500-4FG676C?

For technical support, including XC3S1500-4FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1500-4FG676C requirements.

6.How does Aetrix verify that XC3S1500-4FG676C is sourced from the original manufacturer or authorized distributors?

All XC3S1500-4FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1500-4FG676C meets industry standards.

7.What is the process for return or replacement of XC3S1500-4FG676C?

All XC3S1500-4FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1500-4FG676C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S1500-4FG676C part is unused and in its original packaging.

Return procedure for XC3S1500-4FG676C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S1500-4FG676C Tags

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