AMD XC3S1500-4FG676I
- Part No.:
- XC3S1500-4FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S1500-4FG676I.pdf
- Description:
- IC FPGA 487 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC3S1500-4FG676I from AMD (formerly Xilinx) is a Spartan-3 FPGA featuring 1,474,560 system gates, 116 I/O pins, and a -4 speed grade operating at up to 600 MHz internal clock frequency. It integrates 128 embedded 18×18 multipliers and supports SelectIO standards including LVCMOS, LVTTL, PCI, and HSTL. It is used in industrial motion control systems requiring real-time logic reconfiguration.
For engineers reviewing the XC3S1500-4FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded multiplier count, configuration mode support (Master Serial, Slave Serial, JTAG), and thermal performance in extended temperature industrial environments.
Technical Context
The XC3S1500-4FG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (576 Kbits), and digital clock managers (DCMs) for phase-matched clock synthesis and jitter reduction. It supports dual-edge clocking and global clock routing with low skew.
Configuration is performed via external PROM, processor, or JTAG interface using bitstream files generated by Xilinx ISE Design Suite. The device uses 1.2 V core voltage and supports multiple I/O bank voltages (1.2 V to 3.3 V) with programmable drive strength and slew rate per pin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,440 - provides gate-equivalent capacity for medium-complexity digital controllers and protocol bridges |
| Block RAM | 576 Kbits - enables local data buffering for video frame storage or FIFO implementation without external memory |
| Embedded Multipliers | 128 × 18×18 - supports parallel DSP operations such as FIR filtering and motor control loop computation |
| I/O Pins | 116 user-configurable - allows direct interfacing to ADCs, encoders, and industrial bus transceivers |
| DCM Units | 8 - delivers deterministic clock deskew, frequency synthesis, and duty-cycle correction across multiple domains |
| Speed Grade | -4 - guarantees timing closure at 600 MHz internal logic performance under worst-case industrial temperature (-40°C to +100°C) |
| Core Voltage | 1.2 V ±3% - requires tight regulation and decoupling for stable operation in noise-sensitive environments |
Pinout & Package
Package: 676-pin Fine-Pitch Ball Grid Array (FBGA), 27×27 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives serial bitstream loading during Master Serial mode; must be driven by external oscillator or microcontroller |
| DIN | Configuration Data Input | Receives configuration bitstream; tied high when unused in Slave Parallel mode |
| PROGRAM_B | Active-Low Configuration Reset | Initiates reconfiguration sequence; pulled high via external resistor for normal operation |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant programming, debugging, and interconnect testing |
| VCCO_0 | I/O Bank Power Supply | Supplies 1.2–3.3 V to Bank 0 pins; independent of other banks for mixed-voltage interface support |
| GND | Ground Reference | Multiple dedicated balls ensure low-inductance return paths for signal integrity and EMI control |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Supports 18 I/O standards with programmable termination, enabling direct connection to legacy and modern peripherals without level shifters |
| Digital Clock Manager (DCM) | Provides zero-delay buffering, frequency synthesis (×2 to ÷2), and 90° phase shift-critical for synchronous sampling and encoder quadrature decoding |
| Embedded Multiplier Blocks | 128 hardwired 18×18 multipliers deliver deterministic latency and power efficiency vs. LUT-based arithmetic |
| Multi-Boot Configuration | Allows dual-bitstream storage in external PROM for fail-safe field updates and hardware version rollback |
| Partial Reconfiguration Support | Enables dynamic logic module swapping during runtime-used in adaptive communication protocol stacks and modular control firmware |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time interpolation and PWM generation for multi-axis servo drives. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop position control algorithms; DCMs synchronize encoder feedback and PWM outputs. Use Value: Deterministic sub-microsecond timing ensures jitter-free commutation and reduces motor torque ripple. | Use Scenario: Converting HDMI 1.3a pixel data to LVDS for industrial panel displays. IC Role / Device Role / Timing Role: Implements serializer/deserializer logic and pixel clock domain crossing with DCM-based clock alignment. Use Value: Eliminates external timing ICs and reduces BOM cost while maintaining <10 ps inter-pair skew. |
| PCI Bus Interface | Protocol Translation Gateway |
Use Scenario: Bridging legacy PCI peripherals to modern ARM-based host processors. IC Role / Device Role / Timing Role: Acts as PCI target endpoint with configurable address mapping and burst transaction handling. Use Value: Enables reuse of certified industrial PCI cards without redesigning host hardware or drivers. | Use Scenario: Translating Modbus RTU over RS-485 to EtherCAT for PLC-to-field-device integration. IC Role / Device Role / Timing Role: Implements dual-protocol state machines with time-stamped packet buffering in block RAM. Use Value: Achieves deterministic <50 µs gateway latency and supports concurrent protocol sessions on shared I/O banks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1600E-4FG484C | Higher logic density (33,280 CLBs), fewer I/O (224), no embedded multipliers, different package (484-pin FBGA) | Better suited for logic-intensive but I/O-light designs; lacks DSP capability for motor control | Choose if design prioritizes gate count over multiplier count and fits 484-pin footprint |
| XC6SLX150-3FGG484C | Newer Spartan-6 architecture, 147,400 logic cells, 128 DSP slices, 326 I/O, 1.2 V core, but requires updated toolchain (Vivado) | Offers higher performance and lower static power, but not pin-compatible and needs full RTL migration | Choose for new designs requiring scalability and long-term roadmap support, not for drop-in replacement |
Compared with XC3S1500-4FG676I, the XC3S1600E-4FG484C trades DSP resources for raw logic capacity in a smaller package, while the XC6SLX150-3FGG484C delivers generational improvements in density and power but mandates architectural re-evaluation and toolchain transition.
Availability
XC3S1500-4FG676I is available at Aetrix Electronics and suitable for industrial automation, motion control, and legacy system upgrades requiring stable component supply and long-lifecycle support.
Supply support for XC3S1500-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume industrial applications.
The Spartan-3 family was designed for mainstream embedded logic implementation where predictable timing, I/O flexibility, and mature tool support outweigh cutting-edge process advantages.
FAQ
What is the maximum operating junction temperature for XC3S1500-4FG676I?
The XC3S1500-4FG676I is rated for industrial temperature range: –40°C to +100°C case temperature. Its maximum allowable junction temperature is 125°C, verified under worst-case power dissipation and airflow conditions per Xilinx DS151 specification. Thermal design must account for 1.2 V core power and I/O bank current draw to maintain safe junction limits in sealed enclosures.
Does XC3S1500-4FG676I support JTAG boundary-scan testing?
Yes, XC3S1500-4FG676I fully supports IEEE 1149.1 JTAG boundary-scan via dedicated TCK, TMS, TDI, and TDO pins. This enables in-circuit programming, interconnect testing, and visibility into I/O pin states during system bring-up-critical for validating complex industrial backplane interfaces before full firmware load.
Can XC3S1500-4FG676I be configured using a microcontroller?
Yes, XC3S1500-4FG676I supports Slave Serial and Slave Parallel configuration modes, allowing initialization by an external microcontroller via GPIO or SPI peripheral. The microcontroller writes the bitstream to DIN while toggling CCLK, enabling field-upgradable logic without dedicated PROM or JTAG hardware.
What I/O standards are supported by XC3S1500-4FG676I?
XC3S1500-4FG676I supports 18 SelectIO standards including LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, PCI, HSTL Class I/II, SSTL2 Class I/II, and GTL+. Each I/O bank is independently configurable for voltage and standard, enabling mixed-signal interface consolidation on a single device.
Is partial reconfiguration supported on XC3S1500-4FG676I?
Yes, XC3S1500-4FG676I supports partial reconfiguration through Xilinx ISE 14.7 tools and associated bitstream manipulation utilities. This allows dynamic swapping of functional modules-such as protocol engines or filter coefficients-without resetting the entire FPGA fabric, preserving real-time system state during updates.
XC3S1500-4FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3328
- Number of Logic Elements/Cells:
- 29952
- Total RAM Bits:
- 589824
- Number of I/O:
- 487
- Number of Gates:
- 1500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S1500-4FG676I FAQ
1.How can I place an order for XC3S1500-4FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1500-4FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1500-4FG676I reliable?
The price and inventory of XC3S1500-4FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1500-4FG676I is usually 5 days.
3.What payment methods are accepted for XC3S1500-4FG676I?
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XC3S1500-4FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1500-4FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1500-4FG676I?
For technical support, including XC3S1500-4FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1500-4FG676I requirements.
6.How does Aetrix verify that XC3S1500-4FG676I is sourced from the original manufacturer or authorized distributors?
All XC3S1500-4FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1500-4FG676I meets industry standards.
7.What is the process for return or replacement of XC3S1500-4FG676I?
All XC3S1500-4FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1500-4FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1500-4FG676I part is unused and in its original packaging.
Return procedure for XC3S1500-4FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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