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AMD XC3S1500-4FGG320C
- Part No.:
- XC3S1500-4FGG320C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1500-4FGG320C.pdf
- Description:
- IC FPGA 221 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,234
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Product details
Overview
XC3S1500-4FGG320C from AMD (formerly Xilinx) is a Spartan-3 FPGA featuring 1,474,560 system gates, 116 I/O pins, and a 4 ns logic delay (TPD). It integrates 128 embedded 18×18 multipliers, 64 block RAMs (each 18 Kbits), and supports LVCMOS25/LVCMOS33 I/O standards. It is used in industrial motion control systems requiring real-time logic reconfiguration and deterministic timing.
For engineers reviewing the XC3S1500-4FGG320C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility, embedded multiplier count for servo loop acceleration, block RAM depth for local instruction buffering, and -4 speed grade timing compliance in temperature-cycled environments.
Technical Context
The XC3S1500-4FGG320C implements a hierarchical CLB-based architecture with four-input LUTs and distributed RAM per slice. Its configuration logic supports Master Serial, Slave Serial, and SelectMAP modes via dedicated CCLK, DIN, and DOUT pins.
It includes Digital Clock Managers (DCMs) providing phase-matched clock synthesis, duty-cycle correction, and frequency multiplication/division - all without external PLL components. The device operates across industrial temperature range (-40°C to +85°C) and requires separate VCCINT (1.2 V), VCCO (2.5 V or 3.3 V), and VREF supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,440 configurable logic cells - determines maximum combinational/sequential logic density per design |
| System Gates | 1,474,560 - correlates to ASIC-equivalent gate count for logic synthesis estimation |
| I/O Pins | 116 user-programmable I/Os - defines parallel interface width and peripheral connectivity capacity |
| Block RAM | 64 × 18 Kbit blocks - enables local data buffering, FIFOs, or small lookup tables without external memory |
| Embedded Multipliers | 128 × 18×18-bit - accelerates motor control algorithms, FIR filters, and real-time math operations |
| Speed Grade | -4 - guarantees 4 ns propagation delay for critical path timing closure at max frequency |
| Operating Temp | -40°C to +85°C - qualifies for deployment in uncontrolled industrial enclosures |
Pinout & Package
XC3S1500-4FGG320C is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 23×23 array footprint. Thermal pad on underside requires solder paste stencil design per Xilinx UG331.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration clock input | Drives internal configuration shift register during startup or reprogramming |
| DIN | Serial configuration data input | Accepts bitstream from PROM or processor during Master Serial mode |
| PROG_B | Program initiation | Active-low signal that clears configuration memory and resets internal state |
| INIT_B | Configuration status output | Open-drain indicator signaling successful bitstream loading or error detection |
| GCLK0–GCLK3 | Global clock inputs | Dedicated low-skew routing paths to all CLBs and I/O banks |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two integrated DCMs provide jitter-tolerant clock synthesis, phase alignment, and frequency scaling without external PLLs |
| SelectIO Technology | Supports LVCMOS25/LVCMOS33, LVTTL, PCI, and SSTL2 I/O standards - enables direct interfacing with legacy and modern peripherals |
| Configurable I/O Standards | Per-bank voltage assignment allows mixed 2.5 V and 3.3 V interfaces on same device - reduces level-shifter count |
| Embedded Block RAM | 64 × 18 Kbit blocks support true dual-port operation - enables simultaneous read/write for pipeline buffers |
| Multiplier Blocks | 128 dedicated 18×18 signed/unsigned multipliers - offload arithmetic from soft-core processors in motor control firmware |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time closed-loop servo positioning in CNC machine tools with synchronized axis coordination. IC Role / Device Role / Timing Role: FPGA fabric executes position loop computation, PWM generation, and encoder feedback decoding with sub-microsecond latency. Use Value: 128 embedded multipliers accelerate PID+FF calculations; DCMs lock PWM carrier to encoder index pulse for jitter-free commutation. | Use Scenario: High-speed digital pattern generation and response capture in semiconductor wafer probe stations. IC Role / Device Role / Timing Role: Configurable I/O banks drive DUT signals while capturing responses with precise setup/hold timing control. Use Value: 116 I/O pins enable parallel 64-bit vector I/O; -4 speed grade ensures <4 ns path delay for 250 MHz test clock domains. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Interfacing ultrasound transducer arrays to ADC/DAC subsystems with time-aligned channel sampling. IC Role / Device Role / Timing Role: Synchronizes multi-channel analog front-end clocks and manages DMA transfers to DDR2 memory controller. Use Value: Dual DCMs generate phase-aligned 40 MHz sampling clocks and 100 MHz memory bus clocks from single crystal reference. | Use Scenario: Aggregating ARINC 429, discrete I/O, and MIL-STD-1553B data streams in flight control computers. IC Role / Device Role / Timing Role: Implements protocol engines, message filtering, and time-stamped buffering using distributed RAM and hard-wired logic. Use Value: 64 block RAMs store 16K words of timestamped telemetry; SelectIO supports 1553B differential signaling via external transformers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1600E-4FGG456C | Higher gate count (1.6M), 456-pin FBGA, same -4 speed grade but larger package footprint | Supports more complex control algorithms and additional peripheral interfaces | Choose when design requires >1.47M gates or extra I/O beyond 116 pins |
| XC3S200-4PQ208C | Lower density (200K gates), 208-pin PQFP, same -4 speed grade but reduced I/O (124 pins) and no embedded multipliers | Suitable for simpler logic functions without DSP-intensive tasks | Choose for cost-sensitive, space-constrained designs where multiplier count and block RAM are not required |
Compared with XC3S1500-4FGG320C, XC3S1600E-4FGG456C offers higher logic capacity and I/O count at the cost of board area and power, while XC3S200-4PQ208C trades density and DSP resources for lower cost and smaller footprint - neither is pin-compatible, requiring PCB redesign.
Availability
XC3S1500-4FGG320C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.
Supply support for XC3S1500-4FGG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for high-performance embedded and datacenter applications.
The Spartan-3 family was originally designed by Xilinx for cost-sensitive, high-volume applications requiring predictable performance, low power, and fast time-to-market - especially in industrial automation and communications infrastructure.
FAQ
What is the configuration method supported by XC3S1500-4FGG320C?
XC3S1500-4FGG320C supports Master Serial, Slave Serial, and SelectMAP configuration modes. It uses dedicated pins - CCLK, DIN, DOUT, and PROG_B - to load bitstreams from external PROMs or microprocessors. The device does not support JTAG-only configuration; JTAG is limited to boundary-scan testing and debug access after configuration.
Does XC3S1500-4FGG320C include on-chip memory for program storage?
No, XC3S1500-4FGG320C does not include non-volatile program memory. It is SRAM-based and requires external configuration PROM or processor-driven initialization at power-up. The configuration bitstream must be reloaded each time the device powers on or resets via PROG_B assertion.
What I/O standards are supported by XC3S1500-4FGG320C?
XC3S1500-4FGG320C supports LVCMOS25, LVCMOS33, LVTTL, PCI, and SSTL2 I/O standards. Each I/O bank can be independently assigned a VCCO voltage (2.5 V or 3.3 V), enabling mixed-voltage operation across different peripheral interfaces without external level shifters.
How many Digital Clock Managers (DCMs) does XC3S1500-4FGG320C contain?
XC3S1500-4FGG320C contains two fully independent Digital Clock Managers (DCMs). Each DCM provides input clock multiplication, division, phase shifting, and duty-cycle correction - supporting up to four output clocks per DCM with guaranteed skew control across the device.
Is XC3S1500-4FGG320C qualified for automotive applications?
No, XC3S1500-4FGG320C is rated for industrial temperature range (–40°C to +85°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, enhanced ESD protection, and extended lifetime validation required for under-hood or safety-critical vehicle systems.
XC3S1500-4FGG320C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3328
- Number of Logic Elements/Cells:
- 29952
- Total RAM Bits:
- 589824
- Number of I/O:
- 221
- Number of Gates:
- 1500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1500-4FGG320C FAQ
1.How can I place an order for XC3S1500-4FGG320C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1500-4FGG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1500-4FGG320C reliable?
The price and inventory of XC3S1500-4FGG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1500-4FGG320C is usually 5 days.
3.What payment methods are accepted for XC3S1500-4FGG320C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1500-4FGG320C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1500-4FGG320C?
XC3S1500-4FGG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1500-4FGG320C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1500-4FGG320C?
For technical support, including XC3S1500-4FGG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1500-4FGG320C requirements.
6.How does Aetrix verify that XC3S1500-4FGG320C is sourced from the original manufacturer or authorized distributors?
All XC3S1500-4FGG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1500-4FGG320C meets industry standards.
7.What is the process for return or replacement of XC3S1500-4FGG320C?
All XC3S1500-4FGG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1500-4FGG320C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1500-4FGG320C part is unused and in its original packaging.
Return procedure for XC3S1500-4FGG320C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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