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AMD XC3S1500-4FGG320I
- Part No.:
- XC3S1500-4FGG320I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1500-4FGG320I.pdf
- Description:
- IC FPGA 221 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,478
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Product details
Overview
XC3S1500-4FGG320I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,474,560 system gates, 116 I/O pins, and a -4 speed grade operating at up to 333 MHz logic performance. It features 116 Kbits of block RAM, eight Digital Clock Managers (DCMs), and supports LVCMOS, LVTTL, PCI, and SSTL I/O standards. It is used in industrial control systems requiring reconfigurable logic and deterministic timing.
For engineers reviewing the XC3S1500-4FGG320I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage compatibility, DCM count for clock synthesis, block RAM depth for buffering, and FG320 package thermal profile for convection-cooled enclosures.
Technical Context
The XC3S1500-4FGG320I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It integrates eight DCMs supporting phase shifting, frequency synthesis, and duty cycle correction - each capable of driving up to 16 global clock nets.
Its I/O bank structure supports mixed-voltage operation: banks 0–3 accept 3.3V/2.5V/1.8V inputs, while banks 4–5 support 3.3V-only outputs. Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,440 - total CLB-based lookup tables and flip-flops for combinational and sequential logic implementation |
| System Gates | 1,474,560 - gate-equivalent capacity derived from Xilinx's standard mapping methodology |
| I/O Pins | 116 - user-configurable bidirectional pins distributed across six I/O banks |
| Block RAM | 116 Kbits - organized as 64-bit wide × 18K deep dual-port memory blocks for FIFO or buffer use |
| DCMs | 8 - fully digital clock managers enabling jitter reduction, multiplication/division, and phase alignment |
| Speed Grade | -4 - guarantees timing closure at 333 MHz for internal logic paths under worst-case conditions |
| Package | FGG320 - 320-pin Fine-Pitch Ball Grid Array with 1.0 mm pitch and 23×23 mm body size |
Pinout & Package
XC3S1500-4FGG320I is housed in a 320-pin Fine-Pitch BGA (FGG320) package with 1.0 mm ball pitch, 23×23 mm footprint, and exposed thermal pad for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input for CLB and interconnect logic; requires local decoupling |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry and DCMs |
| T1 | VCCO_0 | 3.3 V output driver supply for Bank 0 I/O; sets high-level output voltage |
| U14 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload |
| R15 | DONE | Open-drain status signal indicating successful configuration completion |
| W19 | TCK | JTAG test clock input for IEEE 1149.1 boundary-scan and programming |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Eight independent DCMs provide jitter-free clock synthesis, phase alignment, and frequency multiplication without external PLL components |
| Multi-Voltage I/O Banks | Six isolated I/O banks support simultaneous 3.3 V, 2.5 V, and 1.8 V signaling - enabling direct interfacing with legacy and low-voltage peripherals |
| Configurable Logic Blocks (CLBs) | 29,440 CLBs deliver deterministic timing and predictable routing delay for real-time control loops |
| Embedded Block RAM | 116 Kbits of true dual-port RAM enables concurrent read/write operations for data buffering and protocol translation |
| Boundary-Scan Support | IEEE 1149.1-compliant JTAG TAP controller allows in-system programming and board-level diagnostics without physical probe access |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop execution with sub-microsecond latency requirements in CNC machine controllers. IC Role / Device Role / Timing Role: FPGA fabric implements PID computation, encoder interface, and PWM generation; DCMs synchronize feedback sampling and actuator update clocks. Use Value: Deterministic timing from -4 speed grade and on-chip DCMs ensures <1 µs jitter in position update cycles. | Use Scenario: High-speed digital pattern generation and response capture in semiconductor wafer testers. IC Role / Device Role / Timing Role: XC3S1500-4FGG320I serves as the pattern engine and timing controller, managing parallel vector streams and per-pin timing calibration. Use Value: 116 I/O pins and multi-bank voltage support allow direct connection to DUT interfaces at 3.3 V and 1.8 V simultaneously. |
| Medical Imaging Interface | Communications Baseband Processing |
Use Scenario: Pixel data aggregation and preprocessing from CMOS image sensors in portable ultrasound systems. IC Role / Device Role / Timing Role: XC3S1500-4FGG320I performs pixel alignment, noise filtering, and LVDS-to-parallel conversion before sending frames to ARM host. Use Value: Embedded block RAM buffers full-line sensor data while FPGA logic applies real-time median filtering. | Use Scenario: Channel bonding and framing logic in point-to-point wireless backhaul modems. IC Role / Device Role / Timing Role: XC3S1500-4FGG320I implements HDLC framing, CRC insertion, and time-division multiplexing for E1/T1 line aggregation. Use Value: Eight DCMs enable independent clock domains for receive, transmit, and management interfaces with zero-crossing synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG320I | 1,000,000 system gates, 21,120 logic cells, same FG320 package and -4 speed grade | Lower gate count limits complex algorithm offload and multi-channel processing capability | Select when design fits within 21K CLBs and requires identical thermal/mechanical footprint |
| XC3S2000-4FGG456C | 2,000,000 system gates, 33,280 logic cells, 456-pin FGG package, commercial temperature range | Larger package and commercial rating preclude use in extended-temperature industrial deployments | Choose only if higher logic density is required and ambient operating temperature stays below 70°C |
Compared with XC3S1000-4FGG320I and XC3S2000-4FGG456C, the XC3S1500-4FGG320I delivers optimal balance of logic capacity, I/O count, and industrial temperature rating in the 320-pin BGA form factor - making it suitable for mid-complexity embedded control where thermal margin and pin compatibility are critical.
Availability
XC3S1500-4FGG320I is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface designs requiring stable component supply and long-term lifecycle assurance.
Supply support for XC3S1500-4FGG320I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated workloads.
The Spartan-3 family was designed for cost-sensitive, high-volume embedded applications requiring deterministic logic performance, low-power operation, and robust I/O flexibility - especially in industrial automation and communications infrastructure.
FAQ
What is the maximum operating junction temperature for XC3S1500-4FGG320I?
The XC3S1500-4FGG320I has an industrial temperature grade (I) with a specified junction temperature range of –40°C to +100°C. This rating is validated per Xilinx DS099 and applies under continuous operation with proper PCB thermal design and airflow per the FGG320 package thermal guidelines. The XC3S1500-4FGG320I must be derated above 85°C ambient depending on power dissipation and heatsinking.
Does XC3S1500-4FGG320I support JTAG boundary-scan testing?
Yes, XC3S1500-4FGG320I includes full IEEE 1149.1-compliant JTAG TAP logic for boundary-scan testing, in-system programming, and debug access. The TCK, TMS, TDI, and TDO pins are dedicated and mapped to specific balls in the FGG320 package. This capability is integral to the XC3S1500-4FGG320I silicon and does not require external configuration.
Can XC3S1500-4FGG320I be configured via SPI serial PROM?
No, XC3S1500-4FGG320I does not support native SPI PROM configuration. It supports Master Serial (using Xilinx Platform Flash PROMs with x8 or x16 interface), Slave Serial, SelectMAP, and JTAG modes. SPI interface requires external bridge logic or microcontroller-based configuration controllers - the XC3S1500-4FGG320I itself lacks on-die SPI master or slave functionality.
How many global clock networks does XC3S1500-4FGG320I provide?
XC3S1500-4FGG320I provides 16 global clock networks driven by its eight integrated Digital Clock Managers (DCMs). Each DCM can drive up to two independent global clock nets, enabling synchronous operation across multiple functional blocks. These networks are low-skew and routed through dedicated metal layers - a fixed architectural feature of the XC3S1500-4FGG320I device.
Is XC3S1500-4FGG320I RoHS compliant?
Yes, XC3S1500-4FGG320I is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) per Xilinx specification document DS099 and manufacturer's certificate of compliance. The FGG320 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).
XC3S1500-4FGG320I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3328
- Number of Logic Elements/Cells:
- 29952
- Total RAM Bits:
- 589824
- Number of I/O:
- 221
- Number of Gates:
- 1500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1500-4FGG320I FAQ
1.How can I place an order for XC3S1500-4FGG320I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1500-4FGG320I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1500-4FGG320I reliable?
The price and inventory of XC3S1500-4FGG320I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1500-4FGG320I is usually 5 days.
3.What payment methods are accepted for XC3S1500-4FGG320I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1500-4FGG320I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1500-4FGG320I?
XC3S1500-4FGG320I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1500-4FGG320I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1500-4FGG320I?
For technical support, including XC3S1500-4FGG320I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1500-4FGG320I requirements.
6.How does Aetrix verify that XC3S1500-4FGG320I is sourced from the original manufacturer or authorized distributors?
All XC3S1500-4FGG320I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1500-4FGG320I meets industry standards.
7.What is the process for return or replacement of XC3S1500-4FGG320I?
All XC3S1500-4FGG320I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1500-4FGG320I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1500-4FGG320I part is unused and in its original packaging.
Return procedure for XC3S1500-4FGG320I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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