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AMD XC3S1500-4FGG456C

Part No.:
XC3S1500-4FGG456C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
456-BBGA
Datasheet:
AetrixXC3S1500-4FGG456C.pdf
Description:
IC FPGA 333 I/O 456FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,119

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Product details

Overview

XC3S1500-4FGG456C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,474,560 system gates, 112 I/O pins, and configured in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 622 Mbps, and targets high-volume embedded control and interface bridging applications.

For engineers reviewing the XC3S1500-4FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, speed grade timing closure, and compatibility with Xilinx ISE design tools and Spartan-3 migration paths.

Technical Context

The XC3S1500-4FGG456C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (48 × 18 Kb), and dedicated multipliers. It supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards with programmable drive strength and slew rate control.

Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction - supporting input frequencies from 12 MHz to 240 MHz and output jitter < ±150 ps.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells29,440 - total configurable logic resources for combinatorial and sequential logic implementation
Block RAM48 × 18 Kb - 864 Kb total on-chip memory for FIFOs, buffers, or lookup tables
I/O Pins112 - user-configurable bidirectional pins with per-pin standard selection and termination control
Speed Grade-4 - guarantees maximum tPD of 4.5 ns for CLB-to-CLB paths under worst-case conditions
DCM Units8 - independent digital clock managers enabling frequency synthesis and phase alignment
Operating Voltage1.2 V core / 3.3 V I/O - dual-voltage operation requiring separate power domains and decoupling

Pinout & Package

XC3S1500-4FGG456C is housed in a 456-ball Fine-Pitch BGA (FBGA) package with 1.0 mm ball pitch, 23 × 23 array, and thermal pad exposed on underside for enhanced heat dissipation. Pin assignment follows Xilinx Spartan-3 pinout conventions with dedicated configuration, clock, and JTAG signals.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockInput clock for Master Serial configuration mode; drives internal PROM read timing
DINConfiguration Data InSerial data input during Master Serial configuration; synchronous to CCLK
PROG_BProgram InitiateActive-low input that resets configuration logic and clears internal SRAM contents
INIT_BConfiguration StatusOpen-drain output indicating configuration status; low during initialization or error
TCK/TMS/TDI/TDOJTAG Boundary-ScanIEEE 1149.1-compliant test access port for programming and debugging

Key Features

FeatureDesign Value
Dedicated Multipliers48 × 18-bit hardwired multipliers enable efficient DSP arithmetic without consuming CLBs
SelectIO™ TechnologyPer-pin I/O standard selection supports mixed-voltage interfaces and signal integrity optimization
Digital Clock Manager (DCM)8 DCMs provide jitter-reduced clock outputs, 0°–360° phase shift, and 2×/4× frequency multiplication
Configurable I/O DriveProgrammable drive strength (2–24 mA) and slew rate reduce EMI and improve signal integrity

Applications

Industrial Motion ControlVideo Interface Bridging

Use Scenario: Real-time servo loop execution and encoder feedback processing in PLC-based motion controllers.

IC Role / Device Role / Timing Role: FPGA fabric implements deterministic logic for position interpolation, PWM generation, and safety monitoring.

Use Value: 112 I/O pins support parallel encoder inputs and multiple PWM outputs; DCMs synchronize axis timing to sub-microsecond precision.

Use Scenario: Converting between HDMI source and LVDS display interface in medical imaging displays.

IC Role / Device Role / Timing Role: Protocol translation engine with pixel clock domain crossing and video data buffering.

Use Value: Block RAM provides frame buffer depth; SelectIO™ supports both 3.3 V LVDS and 1.8 V HDMI receiver signaling levels.

Communications Backplane InterfaceTest Equipment Pattern Generation

Use Scenario: Implementing custom SerDes framing logic and packet routing in modular telecom chassis.

IC Role / Device Role / Timing Role: High-speed parallel bus interface with CRC generation and header parsing logic.

Use Value: -4 speed grade ensures setup/hold timing closure on 100 MHz backplane buses; 48 × 18 Kb block RAM stores protocol state tables.

Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for ATE systems.

IC Role / Device Role / Timing Role: Deterministic pattern sequencer with precise edge placement and trigger synchronization.

Use Value: DCMs generate phase-aligned clocks for independent channel timing; CLBs implement deep pattern memory addressing logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S1000-4FGG456CLower logic density (17,280 CLBs), same package and speed gradeSuitable for smaller control logic footprints with identical I/O and clocking constraintsSelect when design fits within 17K CLBs to reduce cost and power
XC3S2000-4FGG456CHigher logic density (33,280 CLBs), same package and speed gradeRequired for larger state machines, deeper FIFOs, or additional protocol stacksChoose when XC3S1500-4FGG456C resource utilization exceeds 90% in ISE

Compared with XC3S1000-4FGG456C and XC3S2000-4FGG456C, the XC3S1500-4FGG456C offers balanced logic capacity and I/O count for mid-scale embedded control - avoiding overdesign while retaining margin for future feature expansion.

Availability

XC3S1500-4FGG456C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and communications backplane interface applications requiring stable component supply and long-term design-in support.

Supply support for XC3S1500-4FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Spartan family as part of its adaptive computing portfolio for cost-sensitive, high-volume embedded systems.

The Spartan-3 family was designed for mainstream applications demanding predictable performance, low power, and fast time-to-market - especially where ASIC economics are prohibitive and CPLD density insufficient.

FAQ

What is the maximum operating frequency supported by the DCMs in XC3S1500-4FGG456C?

The XC3S1500-4FGG456C integrates eight Digital Clock Managers (DCMs) supporting input frequencies from 12 MHz to 240 MHz. Each DCM can generate output frequencies up to 320 MHz with jitter less than ±150 ps, enabling precise clock domain crossing and high-speed interface timing in designs using XC3S1500-4FGG456C.

Does XC3S1500-4FGG456C support JTAG boundary-scan for in-circuit testing?

Yes, XC3S1500-4FGG456C fully complies with IEEE 1149.1 and includes dedicated TCK, TMS, TDI, and TDO pins. These enable full boundary-scan testing, configuration via JTAG, and real-time debugging of logic implemented in XC3S1500-4FGG456C without requiring external test fixtures.

What I/O standards are supported by XC3S1500-4FGG456C?

XC3S1500-4FGG456C supports LVCMOS, LVTTL, PCI, HSTL Class I/II, and SSTL Class II standards across its 112 user I/O pins. Each pin is individually configurable for voltage level, drive strength, and slew rate - allowing mixed-standard interfaces within a single XC3S1500-4FGG456C design.

Is XC3S1500-4FGG456C compatible with Xilinx ISE Design Suite?

Yes, XC3S1500-4FGG456C is fully supported in Xilinx ISE 14.7 and earlier versions. Synthesis, place-and-route, bitstream generation, and timing analysis for XC3S1500-4FGG456C are validated in ISE - no third-party toolchain is required for production deployment.

What is the configuration method for XC3S1500-4FGG456C?

XC3S1500-4FGG456C supports Master Serial (via PROM), Slave Serial, JTAG, and Boundary Scan configuration modes. The default method uses CCLK and DIN pins with an external XCFxx PROM; JTAG is used for development and field updates. All methods load configuration into XC3S1500-4FGG456C's volatile SRAM fabric.

XC3S1500-4FGG456C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
456-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
333
Number of Gates:
1500000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
456-FBGA (23x23)

XC3S1500-4FGG456C FAQ

1.How can I place an order for XC3S1500-4FGG456C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S1500-4FGG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S1500-4FGG456C reliable?

The price and inventory of XC3S1500-4FGG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1500-4FGG456C is usually 5 days.

3.What payment methods are accepted for XC3S1500-4FGG456C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1500-4FGG456C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S1500-4FGG456C?

XC3S1500-4FGG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S1500-4FGG456C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S1500-4FGG456C?

For technical support, including XC3S1500-4FGG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1500-4FGG456C requirements.

6.How does Aetrix verify that XC3S1500-4FGG456C is sourced from the original manufacturer or authorized distributors?

All XC3S1500-4FGG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1500-4FGG456C meets industry standards.

7.What is the process for return or replacement of XC3S1500-4FGG456C?

All XC3S1500-4FGG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1500-4FGG456C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S1500-4FGG456C part is unused and in its original packaging.

Return procedure for XC3S1500-4FGG456C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S1500-4FGG456C Tags

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