AMD XC3S1500-4FGG456C
- Part No.:
- XC3S1500-4FGG456C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC3S1500-4FGG456C.pdf
- Description:
- IC FPGA 333 I/O 456FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,119
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Product details
Overview
XC3S1500-4FGG456C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,474,560 system gates, 112 I/O pins, and configured in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 622 Mbps, and targets high-volume embedded control and interface bridging applications.
For engineers reviewing the XC3S1500-4FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, speed grade timing closure, and compatibility with Xilinx ISE design tools and Spartan-3 migration paths.
Technical Context
The XC3S1500-4FGG456C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (48 × 18 Kb), and dedicated multipliers. It supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards with programmable drive strength and slew rate control.
Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction - supporting input frequencies from 12 MHz to 240 MHz and output jitter < ±150 ps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 29,440 - total configurable logic resources for combinatorial and sequential logic implementation |
| Block RAM | 48 × 18 Kb - 864 Kb total on-chip memory for FIFOs, buffers, or lookup tables |
| I/O Pins | 112 - user-configurable bidirectional pins with per-pin standard selection and termination control |
| Speed Grade | -4 - guarantees maximum tPD of 4.5 ns for CLB-to-CLB paths under worst-case conditions |
| DCM Units | 8 - independent digital clock managers enabling frequency synthesis and phase alignment |
| Operating Voltage | 1.2 V core / 3.3 V I/O - dual-voltage operation requiring separate power domains and decoupling |
Pinout & Package
XC3S1500-4FGG456C is housed in a 456-ball Fine-Pitch BGA (FBGA) package with 1.0 mm ball pitch, 23 × 23 array, and thermal pad exposed on underside for enhanced heat dissipation. Pin assignment follows Xilinx Spartan-3 pinout conventions with dedicated configuration, clock, and JTAG signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Input clock for Master Serial configuration mode; drives internal PROM read timing |
| DIN | Configuration Data In | Serial data input during Master Serial configuration; synchronous to CCLK |
| PROG_B | Program Initiate | Active-low input that resets configuration logic and clears internal SRAM contents |
| INIT_B | Configuration Status | Open-drain output indicating configuration status; low during initialization or error |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan | IEEE 1149.1-compliant test access port for programming and debugging |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | 48 × 18-bit hardwired multipliers enable efficient DSP arithmetic without consuming CLBs |
| SelectIO™ Technology | Per-pin I/O standard selection supports mixed-voltage interfaces and signal integrity optimization |
| Digital Clock Manager (DCM) | 8 DCMs provide jitter-reduced clock outputs, 0°–360° phase shift, and 2×/4× frequency multiplication |
| Configurable I/O Drive | Programmable drive strength (2–24 mA) and slew rate reduce EMI and improve signal integrity |
Applications
| Industrial Motion Control | Video Interface Bridging |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in PLC-based motion controllers. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic logic for position interpolation, PWM generation, and safety monitoring. Use Value: 112 I/O pins support parallel encoder inputs and multiple PWM outputs; DCMs synchronize axis timing to sub-microsecond precision. | Use Scenario: Converting between HDMI source and LVDS display interface in medical imaging displays. IC Role / Device Role / Timing Role: Protocol translation engine with pixel clock domain crossing and video data buffering. Use Value: Block RAM provides frame buffer depth; SelectIO™ supports both 3.3 V LVDS and 1.8 V HDMI receiver signaling levels. |
| Communications Backplane Interface | Test Equipment Pattern Generation |
Use Scenario: Implementing custom SerDes framing logic and packet routing in modular telecom chassis. IC Role / Device Role / Timing Role: High-speed parallel bus interface with CRC generation and header parsing logic. Use Value: -4 speed grade ensures setup/hold timing closure on 100 MHz backplane buses; 48 × 18 Kb block RAM stores protocol state tables. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for ATE systems. IC Role / Device Role / Timing Role: Deterministic pattern sequencer with precise edge placement and trigger synchronization. Use Value: DCMs generate phase-aligned clocks for independent channel timing; CLBs implement deep pattern memory addressing logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | Lower logic density (17,280 CLBs), same package and speed grade | Suitable for smaller control logic footprints with identical I/O and clocking constraints | Select when design fits within 17K CLBs to reduce cost and power |
| XC3S2000-4FGG456C | Higher logic density (33,280 CLBs), same package and speed grade | Required for larger state machines, deeper FIFOs, or additional protocol stacks | Choose when XC3S1500-4FGG456C resource utilization exceeds 90% in ISE |
Compared with XC3S1000-4FGG456C and XC3S2000-4FGG456C, the XC3S1500-4FGG456C offers balanced logic capacity and I/O count for mid-scale embedded control - avoiding overdesign while retaining margin for future feature expansion.
Availability
XC3S1500-4FGG456C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and communications backplane interface applications requiring stable component supply and long-term design-in support.
Supply support for XC3S1500-4FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan family as part of its adaptive computing portfolio for cost-sensitive, high-volume embedded systems.
The Spartan-3 family was designed for mainstream applications demanding predictable performance, low power, and fast time-to-market - especially where ASIC economics are prohibitive and CPLD density insufficient.
FAQ
What is the maximum operating frequency supported by the DCMs in XC3S1500-4FGG456C?
The XC3S1500-4FGG456C integrates eight Digital Clock Managers (DCMs) supporting input frequencies from 12 MHz to 240 MHz. Each DCM can generate output frequencies up to 320 MHz with jitter less than ±150 ps, enabling precise clock domain crossing and high-speed interface timing in designs using XC3S1500-4FGG456C.
Does XC3S1500-4FGG456C support JTAG boundary-scan for in-circuit testing?
Yes, XC3S1500-4FGG456C fully complies with IEEE 1149.1 and includes dedicated TCK, TMS, TDI, and TDO pins. These enable full boundary-scan testing, configuration via JTAG, and real-time debugging of logic implemented in XC3S1500-4FGG456C without requiring external test fixtures.
What I/O standards are supported by XC3S1500-4FGG456C?
XC3S1500-4FGG456C supports LVCMOS, LVTTL, PCI, HSTL Class I/II, and SSTL Class II standards across its 112 user I/O pins. Each pin is individually configurable for voltage level, drive strength, and slew rate - allowing mixed-standard interfaces within a single XC3S1500-4FGG456C design.
Is XC3S1500-4FGG456C compatible with Xilinx ISE Design Suite?
Yes, XC3S1500-4FGG456C is fully supported in Xilinx ISE 14.7 and earlier versions. Synthesis, place-and-route, bitstream generation, and timing analysis for XC3S1500-4FGG456C are validated in ISE - no third-party toolchain is required for production deployment.
What is the configuration method for XC3S1500-4FGG456C?
XC3S1500-4FGG456C supports Master Serial (via PROM), Slave Serial, JTAG, and Boundary Scan configuration modes. The default method uses CCLK and DIN pins with an external XCFxx PROM; JTAG is used for development and field updates. All methods load configuration into XC3S1500-4FGG456C's volatile SRAM fabric.
XC3S1500-4FGG456C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3328
- Number of Logic Elements/Cells:
- 29952
- Total RAM Bits:
- 589824
- Number of I/O:
- 333
- Number of Gates:
- 1500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC3S1500-4FGG456C FAQ
1.How can I place an order for XC3S1500-4FGG456C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1500-4FGG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1500-4FGG456C reliable?
The price and inventory of XC3S1500-4FGG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1500-4FGG456C is usually 5 days.
3.What payment methods are accepted for XC3S1500-4FGG456C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1500-4FGG456C transactions.
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XC3S1500-4FGG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1500-4FGG456C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1500-4FGG456C?
For technical support, including XC3S1500-4FGG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1500-4FGG456C requirements.
6.How does Aetrix verify that XC3S1500-4FGG456C is sourced from the original manufacturer or authorized distributors?
All XC3S1500-4FGG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1500-4FGG456C meets industry standards.
7.What is the process for return or replacement of XC3S1500-4FGG456C?
All XC3S1500-4FGG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1500-4FGG456C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1500-4FGG456C part is unused and in its original packaging.
Return procedure for XC3S1500-4FGG456C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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