AMD XC3S1500-4FGG676C

Overview

XC3S1500-4FGG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,474,560 system gates, 116 I/O pins, and 150,000 logic cells, configured in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns) and supports 3.3V/2.5V/1.2V I/O standards for embedded control and digital signal processing applications.

For engineers reviewing the XC3S1500-4FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic cell count, I/O voltage flexibility, distributed RAM depth, global clock routing capability, and configuration interface compatibility with SPI or JTAG.

Technical Context

The XC3S1500-4FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (1,872 kbits total), and dedicated digital clock managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction. It includes 128 multipliers (18×18-bit) and supports SelectIO™ technology for single-ended and differential signaling.

Configuration is performed via master serial mode using external PROM or through JTAG boundary-scan, with support for fallback reconfiguration. The device uses 1.2V core voltage and features four DCMs, each capable of generating up to eight output clocks with jitter < ±150 ps over temperature and voltage.

Key Specifications

Pinout & Package

XC3S1500-4FGG676C is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 array, 1.0 mm ball pitch, and thermal pad on underside for enhanced power dissipation. Pinout follows Xilinx Spartan-3 family standard layout with dedicated configuration, clock, JTAG, and I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Compared with XC3S1000-4FGG676C and XC3S2000-4FGG676C, the XC3S1500-4FGG676C offers balanced logic density and memory for mid-scale embedded systems-enough for dual-axis motion control or HD video pipeline, but avoiding over-provisioning that increases static power and BOM cost.

Availability

XC3S1500-4FGG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, video processing engine, and communications baseband processing requiring stable component supply and long-term design-in support.

Supply support for XC3S1500-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs acquired through the Xilinx merger in 2022.

The Spartan-3 family was designed for cost-sensitive, high-volume embedded applications requiring reliable performance, low power, and flexible I/O-targeting industrial automation, video, and communications infrastructure.

FAQ

What is the core voltage requirement for XC3S1500-4FGG676C?

The XC3S1500-4FGG676C requires a regulated 1.2 V ±3% core supply voltage delivered to the VCCINT pins. This voltage powers the FPGA fabric and CLBs; deviation beyond tolerance risks timing violations or configuration loss. Decoupling capacitors must be placed per Xilinx UG331 guidelines to suppress switching noise.

Does XC3S1500-4FGG676C support JTAG configuration?

Yes, XC3S1500-4FGG676C supports IEEE 1149.1 JTAG configuration via TCK, TMS, TDI, and TDO pins. It enables in-system programming, boundary-scan testing, and debug access without requiring external configuration PROM. JTAG mode is selected by pulling PROGRAM_B high during power-up.

How many Digital Clock Managers (DCMs) does XC3S1500-4FGG676C include?

XC3S1500-4FGG676C integrates four Digital Clock Managers (DCMs). Each DCM provides clock multiplication, division, phase shifting, and duty cycle correction. They operate independently and support input frequencies from 12 MHz to 240 MHz, with output jitter specified at ±150 ps over industrial temperature range.

What I/O standards are supported by XC3S1500-4FGG676C?

XC3S1500-4FGG676C supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS and RSDS-per I/O bank. Each of the four I/O banks can be independently set to 3.3V, 2.5V, or 1.2V, enabling mixed-voltage interfacing without external level shifters.

Is XC3S1500-4FGG676C pin-compatible with other Spartan-3 devices in the FGG676 package?

Yes, XC3S1500-4FGG676C shares the same 676-ball FBGA footprint and pinout with XC3S500E-4FGG676C, XC3S1000-4FGG676C, and XC3S2000-4FGG676C. This allows hardware reuse across density variants, provided I/O banking constraints and voltage assignments match the target device's capabilities.