AMD XC3S1500-4FGG676I

Overview

XC3S1500-4FGG676I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,474,560 system gates, 112 I/O pins, and a -4 speed grade operating at up to 333 MHz logic performance. It features 116,480 bits of block RAM, 128 multipliers, and supports SelectIO™ standards including LVCMOS, LVTTL, and SSTL. It is used in industrial control logic and reconfigurable digital signal processing systems.

For engineers reviewing the XC3S1500-4FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade timing closure, embedded RAM depth, multiplier count for arithmetic-intensive tasks, and compatibility with 3.3 V/2.5 V/1.8 V I/O banks.

Technical Context

The XC3S1500-4FGG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It includes twelve 18×18-bit multipliers and supports DDR memory interfaces via dedicated I/O circuitry.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device supports IEEE 1149.1 compliance and in-system programmability through its dedicated configuration pins and internal startup sequence.

Key Specifications

Pinout & Package

XC3S1500-4FGG676I is housed in a 676-ball FCBGA package (1.0 mm pitch, 27×27 array), thermally enhanced with exposed thermal pad. Pinout follows Xilinx Spartan-3 family standard layout with dedicated configuration, JTAG, global clock, and I/O bank assignments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1500-4FGG676I, XC3S1000-4FGG456C offers lower cost and smaller footprint but sacrifices gate count and I/O count, while XC3S2000-4FGG900I extends scalability at the expense of PCB area and thermal management complexity.

Availability

XC3S1500-4FGG676I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.

Supply support for XC3S1500-4FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.

The Spartan-3 family was originally designed by Xilinx for cost-optimized, high-volume applications requiring reconfigurable logic with integrated I/O and DSP capability, targeting industrial, medical, and communications infrastructure.

FAQ

What is the operating temperature range for XC3S1500-4FGG676I?

The XC3S1500-4FGG676I is rated for industrial temperature operation from –40°C to +100°C ambient, verified per Xilinx DS099 specification. This range supports deployment in harsh environments such as factory automation controllers and outdoor telecom equipment where thermal cycling and extended ambient extremes occur. The 'I' suffix explicitly denotes industrial-grade qualification for XC3S1500-4FGG676I.

Does XC3S1500-4FGG676I support configuration via JTAG only?

No, XC3S1500-4FGG676I supports multiple configuration modes including Master Serial (via PROM), Slave Serial, Slave Parallel, and JTAG. JTAG is used for debugging and in-system programming, but production configuration typically uses Master Serial mode with an external SPI PROM. All modes are defined in the Xilinx UG332 configuration guide for Spartan-3 devices.

How many Digital Clock Managers (DCMs) does XC3S1500-4FGG676I include?

XC3S1500-4FGG676I integrates four Digital Clock Managers (DCMs), each capable of frequency synthesis, phase shifting, and duty-cycle correction. These DCMs drive internal clock networks and support up to eight global clock outputs. Their presence eliminates need for external clock ICs in timing-critical applications like video synchronization or high-speed data acquisition where jitter reduction is essential.

Is XC3S1500-4FGG676I RoHS compliant?

Yes, XC3S1500-4FGG676I is RoHS compliant per Xilinx documentation (DS099 v2.5, section 1.4), using lead-free solder-compatible packaging and halogen-free materials. The FGG676 package meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and requires bake conditioning prior to reflow if exposed beyond floor life limits.

Can XC3S1500-4FGG676I be used in new designs today?

XC3S1500-4FGG676I remains available for new designs through authorized channels and Aetrix Electronics' legacy component program. While superseded by newer families (Artix-7, Kintex-7), it is supported with full toolchain compatibility in Vivado HL WebPACK and ISE Design Suite 14.7. Long-term availability is maintained for industrial and defense programs with documented lifecycle commitments.