AMD XC3S1500-5FG456C

Overview

XC3S1500-5FG456C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,474,560 system gates, 116 I/O pins, and a -5 speed grade operating at up to 333 MHz logic performance in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It integrates 128 embedded 18×18 multipliers and supports SelectIO™ standards including LVCMOS, LVTTL, and SSTL.

For engineers reviewing the XC3S1500-5FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded multiplier count, and support for DDR memory interfaces in cost-sensitive industrial control and communication infrastructure designs.

Technical Context

The XC3S1500-5FG456C implements a configurable logic block (CLB) architecture with four 3-input LUTs and eight flip-flops per CLB, enabling efficient implementation of synchronous digital logic. It includes dedicated carry logic for high-speed arithmetic and distributed RAM for small lookup tables or shift registers.

Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan interface. The device supports IEEE 1149.1 compliance and features internal configuration monitoring with CRC error detection.

Key Specifications

Pinout & Package

XC3S1500-5FG456C is housed in a 456-ball fine-pitch BGA (FG456) package with thermal and mechanical characteristics optimized for industrial temperature operation (0°C to 85°C). Pin assignment follows Xilinx's standard FG456 footprint for Spartan-3 devices.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1500-5FG456C, the XC3S1000-4FG456C offers lower cost and power at reduced performance, while the XC3S2000-5FG456C extends gate count and multiplier count without changing PCB layout-enabling scalable design reuse across product tiers.

Availability

XC3S1500-5FG456C is available at Aetrix Electronics and suitable for industrial motor control, protocol bridging, and medical imaging interface applications requiring stable component supply and long-term manufacturing continuity.

Supply support for XC3S1500-5FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.

The Spartan-3 family-including XC3S1500-5FG456C-was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and embedded DSP capability without premium pricing.

FAQ

What is the operating temperature range for XC3S1500-5FG456C?

The XC3S1500-5FG456C is rated for commercial and industrial temperature operation from 0°C to +85°C ambient. Its FG456 package uses lead-free solder and meets JEDEC J-STD-020 moisture sensitivity level 3 requirements. Thermal performance is validated under continuous 100% logic utilization at maximum junction temperature.

Does XC3S1500-5FG456C support configuration via SPI flash memory?

No, XC3S1500-5FG456C does not support native SPI flash configuration. It requires Master Serial mode using Xilinx Platform Flash PROMs (e.g., XCF02S) or JTAG programming. SPI interface support was introduced in later Spartan-6 and 7-series devices, not in the Spartan-3 architecture.

How many Digital Clock Managers (DCMs) are integrated into XC3S1500-5FG456C?

The XC3S1500-5FG456C integrates four Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, frequency multiplication/division, and duty-cycle correction-enabling simultaneous generation of multiple synchronized clock domains for complex timing-critical subsystems.

Can XC3S1500-5FG456C interface directly with DDR SDRAM?

Yes, XC3S1500-5FG456C supports DDR SDRAM interfaces through its SelectIO™ I/O banks configured for SSTL-2 Class I or II standards. It requires external termination resistors and careful PCB layout for signal integrity, but no external logic is needed for basic read/write command sequencing.

Is XC3S1500-5FG456C RoHS compliant?

Yes, XC3S1500-5FG456C is RoHS compliant and lead-free per EU Directive 2011/65/EU. The FG456 package uses matte tin finish on solder balls and conforms to IPC/JEDEC J-STD-609A Class 3 marking for lead-free identification.