AMD XC3S1500-5FGG320C
- Part No.:
- XC3S1500-5FGG320C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1500-5FGG320C.pdf
- Description:
- IC FPGA 221 I/O 320FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC3S1500-5FGG320C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,471,248 system gates, 116 I/O pins, and 1500 logic cells, fabricated on 90 nm CMOS technology and operating at 500 MHz system clock frequency. It integrates distributed RAM, shift registers, and digital clock managers for embedded control and interface bridging in industrial motion controllers.
For engineers reviewing the XC3S1500-5FGG320C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (3.3V/2.5V), TQFP-compatible 320-pin Fine-Pitch BGA package, -5 speed grade timing, and industrial temperature range (0°C to 85°C).
Technical Context
The XC3S1500-5FGG320C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), block RAM (1,728 kbits), and dedicated multipliers (40 × 18-bit). It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL.
Digital Clock Managers (DCMs) provide phase-matched clock synthesis, duty-cycle correction, and frequency synthesis with ±1% jitter tolerance over temperature and voltage. Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1500 - core programmable unit count for combinatorial and sequential logic implementation |
| System Gates | 1,471,248 - gate-equivalent capacity for ASIC-style logic density estimation |
| I/O Pins | 116 - user-configurable bidirectional signal terminals with banked voltage support |
| Block RAM | 1,728 kbits - on-chip memory for FIFOs, buffers, or lookup tables without external memory |
| DCM Units | 4 - independent digital clock managers enabling multiple synchronized clock domains |
| Max System Frequency | 500 MHz - highest guaranteed synchronous operation frequency under industrial conditions |
| Speed Grade | -5 - timing performance bin indicating worst-case propagation delay for critical paths |
Pinout & Package
XC3S1500-5FGG320C is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 20 × 20 array, 1.0 mm ball pitch, and thermally enhanced epoxy molding compound. Package dimensions are 23 mm × 23 mm × 1.8 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input for CLB and interconnect logic |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry and DCMs |
| A1 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| T19 | DONE | Open-drain status output indicating successful configuration completion |
| R18 | CCLK | Configuration clock input for Master Serial mode; driven by FPGA during JTAG mode |
| M16 | TCK | JTAG test clock input for boundary-scan and debug access |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Supports mixed-voltage operation across four independent banks (1.2V, 1.5V, 1.8V, 2.5V, 3.3V) |
| Dedicated Digital Clock Managers (DCMs) | Four fully digital PLL-free clock synthesizers with zero-delay buffering and phase alignment |
| Embedded Multipliers | 40 × 18-bit hardwired multipliers for high-speed arithmetic without LUT resource consumption |
| SelectIO Technology | Programmable I/O standards including LVDS, RSDS, and differential HSTL for high-speed interface bridging |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops for dense logic packing |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machine controllers. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID computation, pulse-width modulation generation, and quadrature decoding. Use Value: XC3S1500-5FGG320C delivers deterministic sub-microsecond latency for position error correction with integrated DCM-synchronized clocks. | Use Scenario: Conversion between HDMI 1.3 source and LVDS display panel interface in medical imaging displays. IC Role / Device Role / Timing Role: Protocol translation engine with pixel clock domain crossing and deep FIFO buffering. Use Value: XC3S1500-5FGG320C provides 1,728 kbits of block RAM for frame buffering and dual DCMs for independent pixel and display clock synthesis. |
| Programmable Logic Controller (PLC) | Test Equipment Signal Generator |
Use Scenario: Modular I/O expansion module supporting analog input scanning, digital output latching, and fieldbus protocol offload. IC Role / Device Role / Timing Role: Reconfigurable logic core executing ladder logic scan cycles and handling isolated CANopen message framing. Use Value: XC3S1500-5FGG320C enables 116-channel I/O mapping with banked voltage support matching sensor/actuator interface requirements. | Use Scenario: Arbitrary waveform generation with real-time amplitude modulation and jitter-controlled edge placement. IC Role / Device Role / Timing Role: High-speed pattern sequencer driving DAC control lines and synchronizing trigger outputs. Use Value: XC3S1500-5FGG320C achieves 500 MHz internal timing for <1 ns resolution in waveform edge positioning using dedicated carry chains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-5FGG320C | 1,000 logic cells, 1,008 kbits block RAM, same package and speed grade | Lower gate count limits complex state machines and larger buffer implementations | Select when design fits within reduced resource budget and cost sensitivity outweighs scalability |
| XC3S2000-5FGG320C | 2,000 logic cells, 2,304 kbits block RAM, identical pinout and thermal profile | Higher density supports additional protocol stacks or parallel processing pipelines | Choose for future-proofing or concurrent multi-interface designs requiring >1500 logic cells |
Compared with XC3S1000-5FGG320C and XC3S2000-5FGG320C, the XC3S1500-5FGG320C offers balanced resource allocation for mid-complexity industrial control logic while maintaining identical thermal and PCB layout compatibility across the FG320 package family.
Availability
XC3S1500-5FGG320C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and programmable logic controller (PLC) applications requiring stable component supply and long-term production continuity.
Supply support for XC3S1500-5FGG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio for data center, industrial, and aerospace markets.
The Spartan-3 family was designed for cost-sensitive, high-volume embedded applications requiring predictable timing, low power, and broad I/O flexibility - particularly in industrial automation and video infrastructure.
FAQ
What is the maximum operating temperature range for XC3S1500-5FGG320C?
The XC3S1500-5FGG320C is rated for industrial temperature operation from 0°C to +85°C ambient. This range is validated per Xilinx DS099 specification and applies to all speed grades in the FG320 package. Thermal derating is not required within this envelope, and junction temperature remains within safe limits under typical I/O loading and 1.2 V core supply conditions.
Does XC3S1500-5FGG320C support JTAG boundary-scan testing?
Yes, XC3S1500-5FGG320C fully supports IEEE 1149.1 JTAG boundary-scan with dedicated TCK, TMS, TDI, TDO, and TRST pins. The JTAG interface enables in-system programming, configuration verification, and real-time debugging without requiring external configuration PROM. All boundary-scan operations comply with Xilinx configuration mode specifications.
Can XC3S1500-5FGG320C be configured using Master Serial mode?
Yes, XC3S1500-5FGG320C supports Master Serial configuration using an external serial PROM connected to CCLK, DIN, and DONE signals. In this mode, the FPGA drives CCLK and reads configuration bitstream sequentially. The process is defined in Xilinx UG071 and requires no external controller, making it ideal for standalone deployment.
What I/O standards are supported by XC3S1500-5FGG320C?
XC3S1500-5FGG320C supports LVCMOS, LVTTL, PCI, SSTL18, SSTL2, HSTL, and differential standards including LVDS and RSDS. Each I/O bank is independently configurable for voltage levels from 1.2 V to 3.3 V. These capabilities are documented in Xilinx DS099 Table 22 and verified across all speed grades in the FG320 package.
Is XC3S1500-5FGG320C pin-compatible with other Spartan-3 devices in the FG320 package?
XC3S1500-5FGG320C shares the same 320-pin FBGA footprint and ball assignment with XC3S500E-5FGG320C, XC3S1000-5FGG320C, and XC3S2000-5FGG320C. Power and configuration pins are identically placed; I/O pin functions are consistent across the family, enabling hardware reuse when migrating between densities within the same speed grade.
XC3S1500-5FGG320C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3328
- Number of Logic Elements/Cells:
- 29952
- Total RAM Bits:
- 589824
- Number of I/O:
- 221
- Number of Gates:
- 1500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1500-5FGG320C FAQ
1.How can I place an order for XC3S1500-5FGG320C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1500-5FGG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1500-5FGG320C reliable?
The price and inventory of XC3S1500-5FGG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1500-5FGG320C is usually 5 days.
3.What payment methods are accepted for XC3S1500-5FGG320C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1500-5FGG320C transactions.
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XC3S1500-5FGG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1500-5FGG320C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1500-5FGG320C?
For technical support, including XC3S1500-5FGG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1500-5FGG320C requirements.
6.How does Aetrix verify that XC3S1500-5FGG320C is sourced from the original manufacturer or authorized distributors?
All XC3S1500-5FGG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1500-5FGG320C meets industry standards.
7.What is the process for return or replacement of XC3S1500-5FGG320C?
All XC3S1500-5FGG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1500-5FGG320C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1500-5FGG320C part is unused and in its original packaging.
Return procedure for XC3S1500-5FGG320C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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