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AMD XC3S1500-5FGG456C

Part No.:
XC3S1500-5FGG456C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
456-BBGA
Datasheet:
AetrixXC3S1500-5FGG456C.pdf
Description:
IC FPGA 333 I/O 456FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,388

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Product details

Overview

XC3S1500-5FGG456C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,471,200 system gates, 116 I/O pins, and 150,000 equivalent logic cells. It features 576 Kbits of block RAM, operates at -5 speed grade (630 MHz DLL clock), and is packaged in a 456-pin Fine-Pitch Ball Grid Array (FBGA). It targets high-volume embedded control and digital signal processing in industrial automation systems.

For engineers reviewing the XC3S1500-5FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, block RAM capacity, speed grade timing compliance, and FBGA thermal/mechanical compatibility with PCB layout constraints.

Technical Context

The XC3S1500-5FGG456C implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry chains for arithmetic. It integrates twelve Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction across multiple clock domains.

Configuration is performed via Master Serial mode using external PROM or microcontroller, with JTAG boundary-scan support for testing. The device supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable drive strength and slew rate per I/O bank.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells150,000 equivalent logic cells - defines maximum combinational/sequential logic capacity for RTL implementation
System Gates1,471,200 - legacy metric estimating gate count for ASIC comparison and resource estimation
Block RAM576 Kbits - supports dual-port memory buffers, FIFOs, and coefficient storage without external memory
I/O Pins116 user-configurable I/Os - enables interface to multiple peripherals with bank-wise voltage assignment
Speed Grade-5 - guarantees timing closure up to 630 MHz DLL output frequency under specified conditions
Package456-pin FGG (Fine-Pitch BGA) - 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant lead-free finish

Pinout & Package

XC3S1500-5FGG456C is housed in a 456-ball Fine-Pitch Ball Grid Array (FGG) package with 23×23 array, 1.0 mm pitch, and thermal pad. Pin functions are organized into 12 I/O banks, each supporting independent VCCO and VREF voltages.

Pin/TerminalCircuit RoleDesign Meaning
G1CONFIG_DONEOpen-drain status signal indicating successful configuration completion
H2INIT_BActive-low bidirectional initialization and reconfiguration control
K1PROGRAM_BActive-low asynchronous reset that clears configuration memory and restarts loading
M1CCLKConfiguration clock input - drives internal shift registers during master serial programming
P2DINSerial data input for master serial configuration mode
R1TCKJTAG test clock input for boundary-scan and debug access

Key Features

FeatureDesign Value
Digital Clock Manager (DCM)Twelve independent DCMs provide jitter-reduced clock synthesis, phase alignment, and frequency multiplication/division
SelectIO TechnologyPer-bank I/O standards support mixed-voltage interfaces (1.2V–3.3V) with programmable drive/slew for signal integrity
Block RAM18-kbit dual-port RAM blocks enable synchronous read/write without external memory latency
Embedded MultipliersFour 18×18-bit signed multipliers accelerate DSP algorithms such as FIR filtering and FFT computation
Boundary-Scan LogicIEEE 1149.1-compliant JTAG TAP controller enables in-system programming and board-level testability

Applications

Industrial Motion ControlMedical Imaging Interface

Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms.

IC Role / Device Role / Timing Role: Configurable logic fabric implements custom PWM generators, position interpolators, and safety monitoring state machines.

Use Value: 116 I/Os and deterministic timing enable tight synchronization between motor drivers, sensors, and host controllers.

Use Scenario: High-speed pixel data aggregation and preprocessing from ultrasound or MRI sensor arrays.

IC Role / Device Role / Timing Role: FPGA acts as a parallel data concentrator and real-time image buffer controller before transmission to host processor.

Use Value: 576 Kbits of block RAM supports line buffering for 1024×768 grayscale frames at 60 fps without external DRAM.

Avionics Data AcquisitionTest & Measurement Equipment

Use Scenario: Sensor fusion and ARINC 429 protocol handling in flight data recorders and health monitoring units.

IC Role / Device Role / Timing Role: Implements protocol engines, time-stamped data logging, and redundancy arbitration logic.

Use Value: Twelve DCMs allow independent clock domains for sensor sampling, bus communication, and flash write operations.

Use Scenario: Flexible waveform generation and acquisition triggering in automated test equipment (ATE) platforms.

IC Role / Device Role / Timing Role: Configurable logic generates precise stimulus patterns and captures response timing with sub-cycle resolution.

Use Value: -5 speed grade ensures setup/hold timing margins for 200+ MHz digital pattern rates in production test environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S1000-5FGG456C1,000,000 system gates, 100,000 logic cells, 432 Kbits block RAM - lower density and memory capacitySuitable for smaller control subsystems with fewer I/Os and simpler timing requirementsSelect when design fits within reduced resources and cost sensitivity outweighs future scalability needs
XC3S2000-5FGG456C2,000,000 system gates, 200,000 logic cells, 720 Kbits block RAM - higher density and memory bandwidthRequired for complex video pipelines or multi-channel communication stacks exceeding XC3S1500 capacityChoose when additional logic or memory is needed for feature expansion without changing package footprint

Compared with XC3S1500-5FGG456C, the XC3S1000-5FGG456C offers cost reduction at the expense of logic and memory headroom, while the XC3S2000-5FGG456C provides scalable capacity within identical thermal and mechanical constraints - enabling drop-in upgrades where routing and power delivery support higher current draw.

Availability

XC3S1500-5FGG456C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging interface, and avionics data acquisition requiring stable component supply across extended product lifecycles.

Supply support for XC3S1500-5FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.

The Spartan-3 family was designed by Xilinx for cost-sensitive, high-volume applications requiring predictable performance, low power, and broad I/O flexibility in industrial and embedded systems.

FAQ

What is the maximum operating frequency supported by XC3S1500-5FGG456C?

The XC3S1500-5FGG456C carries the -5 speed grade, guaranteeing timing closure for internal logic paths up to 630 MHz when using the Digital Clock Manager's output. Actual system clock frequencies depend on design topology, I/O standard selection, and PCB layout; the device's DCMs support input clocks up to 250 MHz and generate outputs across a wide range via multiplication and division.

Does XC3S1500-5FGG456C support JTAG programming and debugging?

Yes, XC3S1500-5FGG456C includes full IEEE 1149.1-compliant JTAG boundary-scan logic. It supports in-system programming, configuration verification, and real-time debugging through the TCK, TMS, TDI, and TDO pins. The JTAG interface also enables partial reconfiguration and hardware-assisted test of PCB interconnects.

What configuration modes are supported by XC3S1500-5FGG456C?

XC3S1500-5FGG456C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial is most common, using an external PROM or microcontroller to drive CCLK and DIN. Configuration bitstreams can be stored in SPI flash, parallel NOR flash, or loaded dynamically via processor interface.

Can XC3S1500-5FGG456C operate with mixed I/O voltage standards on the same device?

Yes, XC3S1500-5FGG456C organizes its 116 I/Os into 12 independently powered banks. Each bank accepts a separate VCCO voltage (1.2V to 3.3V), allowing simultaneous use of LVCMOS, LVTTL, PCI, and SSTL standards. VREF pins per bank enable precise termination for differential or stub-matched signaling.

Is XC3S1500-5FGG456C still in active production and supported by AMD?

XC3S1500-5FGG456C is a mature Spartan-3 device no longer in active production, but AMD continues to support it through legacy program channels. Aetrix Electronics maintains inventory and provides traceable, tested units sourced from authorized channels, with documentation and lifecycle guidance aligned with AMD's long-term support policy for discontinued programmable logic devices.

XC3S1500-5FGG456C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
456-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
333
Number of Gates:
1500000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
456-FBGA (23x23)

XC3S1500-5FGG456C FAQ

1.How can I place an order for XC3S1500-5FGG456C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S1500-5FGG456C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S1500-5FGG456C reliable?

The price and inventory of XC3S1500-5FGG456C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1500-5FGG456C is usually 5 days.

3.What payment methods are accepted for XC3S1500-5FGG456C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1500-5FGG456C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S1500-5FGG456C?

XC3S1500-5FGG456C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S1500-5FGG456C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S1500-5FGG456C?

For technical support, including XC3S1500-5FGG456C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1500-5FGG456C requirements.

6.How does Aetrix verify that XC3S1500-5FGG456C is sourced from the original manufacturer or authorized distributors?

All XC3S1500-5FGG456C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1500-5FGG456C meets industry standards.

7.What is the process for return or replacement of XC3S1500-5FGG456C?

All XC3S1500-5FGG456C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1500-5FGG456C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S1500-5FGG456C part is unused and in its original packaging.

Return procedure for XC3S1500-5FGG456C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S1500-5FGG456C Tags

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