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AMD XC3S1500-5FGG676C
- Part No.:
- XC3S1500-5FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S1500-5FGG676C.pdf
- Description:
- IC FPGA 487 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,155
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Product details
Overview
XC3S1500-5FGG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 1,474,560 system gates, 116 I/O pins, and 1500 logic cells, fabricated on 90 nm CMOS technology and rated for commercial temperature range (0°C to 85°C). It serves as a reconfigurable digital logic fabric in embedded control, industrial interface bridging, and legacy protocol adaptation systems.
For engineers reviewing the XC3S1500-5FGG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (3.3V/2.5V), distributed RAM capacity (576 kbits), global clock network count (8), and configuration mode compatibility (Master Serial, Slave SelectMAP).
Technical Context
The XC3S1500-5FGG676C implements a hierarchical architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), block RAM (18 kbits total), and digital clock managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction. It supports JTAG boundary-scan testing and in-system configuration via SPI flash or microprocessor.
Configuration occurs through dedicated INIT_B, PROGRAM_B, and DONE pins; startup sequence follows IEEE 1532-compliant bitstream loading. The device uses SelectI/O standards including LVCMOS, LVTTL, PCI, and SSTL-2, with programmable slew rate and drive strength per IOB.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1500 - Base unit of combinational + sequential logic; determines maximum concurrent state-machine or datapath complexity. |
| System Gates | 1,474,560 - Approximate ASIC gate-equivalent capacity for RTL synthesis estimation. |
| I/O Pins | 116 - User-configurable bidirectional pins supporting multiple voltage standards and timing modes. |
| Block RAM | 18 kbits - Dedicated synchronous memory blocks usable as FIFOs, buffers, or lookup tables without consuming logic resources. |
| DCMs | 2 - Digital Clock Managers enabling jitter-tolerant clock multiplication, division, phase alignment, and skew compensation. |
| Config Mode | Master Serial / Slave SelectMAP - Determines boot source (SPI flash or external processor) and data bus width (8-/16-bit parallel). |
| Max I/O Speed | 333 Mbps - Sustained data rate per pin under SSTL-2 or LVCMOS33 conditions with proper PCB layout. |
Pinout & Package
XC3S1500-5FGG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. Thermal pad on underside requires solder paste stencil design per Xilinx UG380.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asynchronous reset of configuration logic; must be held high during normal operation. |
| INIT_B | Configuration Status Indicator | Open-drain output signaling configuration error or incomplete bitstream load. |
| DONE | Configuration Completion Flag | Drives high when configuration completes successfully and device enters user mode. |
| CCLK | Configuration Clock Input | Drives internal shift register during Master Serial mode; sourced externally in Slave modes. |
| DIN | Serial Data Input | Carries configuration bitstream in Master Serial mode; tied to data bus in SelectMAP mode. |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Four independent banks support mixed-voltage operation (3.3V, 2.5V, 1.8V, 1.5V) enabling direct interfacing with diverse peripherals. |
| Dedicated Carry Logic | Fast arithmetic chain across CLBs enables efficient counters, adders, and accumulators without routing delay penalties. |
| SelectI/O Technology | Programmable drive strength (2–24 mA), slew rate control, and on-die termination reduce signal integrity issues in high-speed designs. |
| Embedded DCMs | Two fully autonomous clock managers eliminate need for external PLLs in clock domain crossing and timing closure scenarios. |
| JTAG Boundary Scan | IEEE 1149.1-compliant test access port supports board-level diagnostics and in-circuit programming without dedicated test fixtures. |
Applications
| Industrial Motion Control | Legacy Bus Interface Adapter |
|---|---|
Use Scenario: Real-time interpolation and PWM generation for multi-axis servo drives using custom IP cores. IC Role / Device Role / Timing Role: Reconfigurable logic fabric executing deterministic control loops with sub-microsecond latency. Use Value: Enables field-upgradable motion algorithms without hardware redesign or firmware updates to host MCU. | Use Scenario: Bridging RS-485 Modbus RTU to PCIe-based data acquisition systems in SCADA infrastructure. IC Role / Device Role / Timing Role: Protocol translation engine with dual-clock domain synchronization between asynchronous serial and synchronous high-speed bus domains. Use Value: Preserves legacy sensor investment while enabling modern backhaul connectivity without gateway latency bottlenecks. |
| Medical Imaging Front-End | Test Equipment Pattern Generator |
Use Scenario: Time-aligned digitization and preprocessing of analog signals from ultrasound transducer arrays. IC Role / Device Role / Timing Role: High-precision timing controller synchronizing ADC sampling, FIR filtering, and DMA transfers across multiple channels. Use Value: Achieves <1 ns inter-channel skew required for beamforming coherence in portable diagnostic devices. | Use Scenario: Generating high-fidelity, multi-channel digital stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: Deterministic pattern sequencer with programmable timing resolution down to 2.5 ns per step. Use Value: Supports 400+ MHz vector rates using internal DCM-derived clocks, eliminating external pattern generator hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-5FGG676C | 1,000 logic cells, 1,032,192 system gates, identical package and pinout. | Lower gate count limits complex IP integration; suitable for cost-sensitive, lower-complexity control tasks. | Select when design fits within reduced resource budget and avoids over-provisioning. |
| XC3S2000-5FGG676C | 2,000 logic cells, 2,048,000 system gates, same package and pinout. | Higher density supports larger state machines and embedded soft-core processors (e.g., MicroBlaze). | Choose for future-proofing or when adding real-time OS support or cryptographic acceleration blocks. |
Compared with XC3S1000-5FGG676C and XC3S2000-5FGG676C, the XC3S1500-5FGG676C offers balanced resource allocation-sufficient for dual-CPU subsystems or multi-protocol interfaces without exceeding thermal or power budgets typical of mid-tier industrial controllers.
Availability
XC3S1500-5FGG676C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC3S1500-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Virtex, and Artix FPGA families for adaptive computing solutions.
The Spartan-3 family, including XC3S1500-5FGG676C, was designed for cost-sensitive, high-volume applications demanding predictable timing, low static power, and robust configuration security in industrial and embedded environments.
FAQ
What is the configuration method supported by XC3S1500-5FGG676C?
The XC3S1500-5FGG676C supports Master Serial (via SPI flash), Slave SelectMAP (8-/16-bit parallel), and JTAG modes. Configuration bitstream is loaded into SRAM-based fabric on power-up; no non-volatile storage is integrated. External memory or host processor must provide the bitstream each time.
Does XC3S1500-5FGG676C include embedded block RAM?
Yes, XC3S1500-5FGG676C contains 18 kbits of distributed and block RAM. This includes 32 × 512-bit dual-port block RAM primitives usable as FIFOs, buffers, or small lookup tables without consuming logic cell resources.
What I/O standards are supported by XC3S1500-5FGG676C?
XC3S1500-5FGG676C supports LVCMOS, LVTTL, PCI, SSTL-2, and HSTL-I I/O standards across four independently biased I/O banks. Each bank allows mixed-voltage operation and programmable drive strength up to 24 mA.
Can XC3S1500-5FGG676C operate in extended temperature ranges?
No, XC3S1500-5FGG676C is rated only for commercial temperature range (0°C to 85°C). Industrial or automotive variants (e.g., -40°C to 100°C) were not released for this specific density and package combination.
Is XC3S1500-5FGG676C pin-compatible with other Spartan-3 devices in FGG676 package?
XC3S1500-5FGG676C shares the same 676-ball FBGA footprint and pin assignment with XC3S1000-5FGG676C and XC3S2000-5FGG676C. Power, ground, configuration, and I/O pin locations are identical, enabling board-level scalability within the Spartan-3 family.
XC3S1500-5FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3328
- Number of Logic Elements/Cells:
- 29952
- Total RAM Bits:
- 589824
- Number of I/O:
- 487
- Number of Gates:
- 1500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S1500-5FGG676C FAQ
1.How can I place an order for XC3S1500-5FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1500-5FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1500-5FGG676C reliable?
The price and inventory of XC3S1500-5FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1500-5FGG676C is usually 5 days.
3.What payment methods are accepted for XC3S1500-5FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1500-5FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1500-5FGG676C?
XC3S1500-5FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1500-5FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1500-5FGG676C?
For technical support, including XC3S1500-5FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1500-5FGG676C requirements.
6.How does Aetrix verify that XC3S1500-5FGG676C is sourced from the original manufacturer or authorized distributors?
All XC3S1500-5FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1500-5FGG676C meets industry standards.
7.What is the process for return or replacement of XC3S1500-5FGG676C?
All XC3S1500-5FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1500-5FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1500-5FGG676C part is unused and in its original packaging.
Return procedure for XC3S1500-5FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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