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AMD XC3S1600E-4FG320C
- Part No.:
- XC3S1600E-4FG320C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1600E-4FG320C.pdf
- Description:
- IC FPGA 250 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,843
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Product details
Overview
XC3S1600E-4FG320C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,584 logic cells, 512 Kbits of block RAM, and a maximum system clock frequency of 325 MHz. It features 232 user I/O pins in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package and supports LVCMOS/LVTTL I/O standards. This device is used in industrial control logic, digital video processing, and embedded interface bridging.
For engineers reviewing the XC3S1600E-4FG320C datasheet, pinout, applications, or equivalent options, key selection criteria include logic cell count, I/O voltage compatibility, block RAM depth, clock routing flexibility, and thermal performance in compact PCB layouts.
Technical Context
The XC3S1600E-4FG320C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It includes eight global clock networks and supports Digital Clock Managers (DCMs) for phase-matched clock synthesis and jitter reduction.
This device targets cost-sensitive, high-volume applications requiring deterministic timing closure and low static power consumption. It supports IEEE 1149.1 JTAG boundary-scan testing and configuration via Master Serial, Slave Serial, or SelectMAP modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,584 - defines maximum combinational/sequential logic capacity for custom state machines or data path logic |
| Block RAM | 512 Kbits - supports dual-port FIFOs, lookup tables, or small frame buffers without external memory |
| Max System Clock | 325 MHz - enables high-speed synchronous design with tight setup/hold timing margins |
| User I/O Pins | 232 - provides scalable connectivity for parallel buses, sensor interfaces, or display controllers |
| I/O Standards | LVCMOS 3.3V/2.5V, LVTTL - ensures interoperability with common microcontrollers and peripheral ICs |
| Package | 320-pin FBGA (Fine-Pitch BGA, 19×19 mm, 1.0 mm pitch) - requires standard reflow profile and 6 mil trace/space routing |
Pinout & Package
The XC3S1600E-4FG320C is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 19×19 ball array, 1.0 mm pitch, and 19 mm × 19 mm body size. Thermal pad is not present; thermal dissipation relies on PCB copper area and airflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply - must be filtered with ≥10 µF ceramic + 1 µF ceramic per bank |
| P2 | VCCAUX | 2.5 V auxiliary supply - powers configuration circuitry and DCMs |
| A1 | PROGRAM_B | Active-low asynchronous reset - initiates configuration reload on falling edge |
| B2 | INIT_B | Open-drain status output - signals configuration completion or error during startup |
| C1 | DONE | Open-drain output - goes high when configuration is successfully completed and device is operational |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Provides zero-delay buffering, frequency synthesis (×2 to ×32), and phase shifting (±180°) without external PLL components |
| SelectIO Technology | Supports single-ended I/O standards including LVCMOS, LVTTL, PCI, and SSTL with programmable drive strength and slew rate |
| Embedded Multipliers | Four 18×18-bit signed multipliers enable real-time FIR filtering or motor control loop computation |
| JTAG Boundary Scan | IEEE 1149.1-compliant test access port enables in-circuit verification and board-level diagnostics |
Applications
| Industrial Motion Control | Digital Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo positioning using encoder feedback and PWM output generation. IC Role / Device Role / Timing Role: FPGA fabric implements PID controller, quadrature decoder, and 16-channel PWM generator with synchronized timing. Use Value: Deterministic sub-microsecond latency between input capture and output update enables stable velocity regulation at 20 kHz loop rates. | Use Scenario: Converting HDMI 1.3a pixel data to parallel RGB+HSYNC/VSYNC for LCD panel driving. IC Role / Device Role / Timing Role: Acts as protocol translator and timing aligner with pixel-clock domain crossing and embedded sync detection. Use Value: On-chip block RAM buffers one full line of 1080p video (1920 pixels × 24 bits), eliminating external FIFO ICs. |
| Automated Test Equipment (ATE) | Communications Backplane Interface |
Use Scenario: Generating precise stimulus patterns and capturing response waveforms across 64 digital channels. IC Role / Device Role / Timing Role: Configurable I/O banks operate at 100 MHz DDR with independent input/output delay tuning per pin group. Use Value: Programmable I/O delays allow per-pin timing calibration to compensate for PCB skew, achieving ±50 ps alignment accuracy. | Use Scenario: Interfacing a PowerPC processor to a 32-bit, 66 MHz PCI bus while managing arbitration and address decoding. IC Role / Device Role / Timing Role: Implements PCI target interface logic with compliant timing, parity generation, and retry handling. Use Value: Built-in PCI compliance macros reduce RTL verification effort and ensure signal integrity across 15 cm backplane traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG320C | 1,000 logic cells, 360 Kbits block RAM, same package and I/O structure | Lower gate count limits complex state machines or larger video buffers | Choose when design fits within reduced resource budget and cost sensitivity outweighs future scalability |
| XC3S2000-4FG320C | 2,000 logic cells, 768 Kbits block RAM, identical pinout and voltage requirements | Higher density supports additional peripherals or dual-domain clocking without external glue logic | Choose when expanding functionality beyond XC3S1600E-4FG320C capacity while retaining PCB layout |
Compared with XC3S1000-4FG320C, the XC3S1600E-4FG320C delivers 58% more logic and 43% more RAM for incremental feature integration; compared with XC3S2000-4FG320C, it offers tighter power efficiency at moderate complexity, reducing thermal load in fanless enclosures.
Availability
XC3S1600E-4FG320C is available at Aetrix Electronics and suitable for industrial motion control, digital video interface bridging, and automated test equipment requiring stable component supply and long-term production support.
Supply support for XC3S1600E-4FG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-optimized, high-volume embedded logic applications.
The Spartan-3E family was designed for mainstream industrial and consumer electronics requiring predictable timing, low static power, and seamless integration with legacy microprocessor buses and video interfaces.
FAQ
What is the maximum operating junction temperature for the XC3S1600E-4FG320C?
The XC3S1600E-4FG320C has a maximum junction temperature of 85°C under continuous operation. This rating assumes proper PCB thermal design with ≥2 oz copper planes and adequate airflow. Exceeding this limit may cause timing violations or configuration loss. The device includes thermal shutdown protection that halts operation if internal sensors detect sustained temperatures above 100°C.
Does the XC3S1600E-4FG320C support configuration via SPI flash memory?
No, the XC3S1600E-4FG320C does not support native SPI flash configuration. It requires either Master Serial (using XCFxxP PROM), Slave Serial, or SelectMAP mode. External SPI-to-parallel bridge ICs can be used, but Xilinx recommends XCF02S or XCF04S PROMs for reliable, single-chip configuration with automatic CRC checking and fallback capability.
Can the XC3S1600E-4FG320C implement a PCI 2.2-compliant interface?
Yes, the XC3S1600E-4FG320C can implement a PCI 2.2-compliant interface using Xilinx-provided PCI LogiCORE IP. The device's 232 user I/O pins, deterministic timing model, and built-in I/O delay tuning support required setup/hold margins at 33 MHz. However, full compliance requires external 3.3 V termination resistors and adherence to PCI mechanical slot specifications.
What is the minimum configuration time for the XC3S1600E-4FG320C using Master Serial mode?
The minimum configuration time for the XC3S1600E-4FG320C in Master Serial mode is 21.5 ms when using an XCF04S PROM at C-grade speed. This value assumes optimal clock stability and no CRC errors. Configuration time scales linearly with bitstream size and PROM access speed; slower PROMs or higher temperature operation may increase time by up to 15%.
Is the XC3S1600E-4FG320C RoHS compliant and lead-free?
Yes, the XC3S1600E-4FG320C is RoHS compliant and manufactured with lead-free (Pb-free) solder finish on all I/O balls. The FBGA package uses matte tin plating over copper pillars and meets JEDEC J-STD-020D moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's Product Change Notification PCN-2018-012.
XC3S1600E-4FG320C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 320-BGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3688
- Number of Logic Elements/Cells:
- 33192
- Total RAM Bits:
- 663552
- Number of I/O:
- 250
- Number of Gates:
- 1600000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1600E-4FG320C FAQ
1.How can I place an order for XC3S1600E-4FG320C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1600E-4FG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1600E-4FG320C reliable?
The price and inventory of XC3S1600E-4FG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1600E-4FG320C is usually 5 days.
3.What payment methods are accepted for XC3S1600E-4FG320C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1600E-4FG320C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1600E-4FG320C?
XC3S1600E-4FG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1600E-4FG320C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1600E-4FG320C?
For technical support, including XC3S1600E-4FG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1600E-4FG320C requirements.
6.How does Aetrix verify that XC3S1600E-4FG320C is sourced from the original manufacturer or authorized distributors?
All XC3S1600E-4FG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1600E-4FG320C meets industry standards.
7.What is the process for return or replacement of XC3S1600E-4FG320C?
All XC3S1600E-4FG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1600E-4FG320C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1600E-4FG320C part is unused and in its original packaging.
Return procedure for XC3S1600E-4FG320C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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