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AMD XC3S1600E-4FG320I
- Part No.:
- XC3S1600E-4FG320I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1600E-4FG320I.pdf
- Description:
- IC FPGA 250 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,945
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Product details
Overview
XC3S1600E-4FG320I from AMD (formerly Xilinx) is a Spartan-3E FPGA featuring 1,584 logic cells, 512 Kbits of block RAM, and a maximum system clock frequency of 325 MHz. It implements configurable digital logic in embedded control, industrial interface, and communication protocol bridging applications using its 320-pin Fine-Pitch Ball Grid Array (FBGA) package.
For engineers reviewing the XC3S1600E-4FG320I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count (232 user I/Os), voltage compatibility (3.3V/2.5V/1.2V support), configuration mode (Master Serial, Slave SelectMAP), and thermal performance (industrial temperature range −40°C to +100°C).
Technical Context
The XC3S1600E-4FG320I integrates 1,584 configurable logic blocks (CLBs), each containing two 4-input LUTs and two flip-flops, supporting synchronous sequential logic and combinatorial functions. It includes twelve 18×18 multipliers for DSP-intensive tasks and supports DDR SDRAM interfaces up to 333 Mbps.
Configuration is performed via external SPI PROM or JTAG boundary-scan, with internal startup sequence controlling I/O bank voltage sequencing and global reset assertion. The device uses 90 nm CMOS process technology and supports IEEE 1149.1 JTAG for programming and debugging.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,584 - defines maximum combinational and registered logic capacity for custom state machines or protocol engines |
| Block RAM | 512 Kbits - enables on-chip buffering for video frame storage, FIFOs, or lookup tables without external memory |
| User I/O Pins | 232 - supports high-density peripheral interfacing including parallel buses and multi-lane serial links |
| Max System Clock | 325 MHz - determines highest synchronous operation rate for real-time control loops or data sampling |
| Operating Temperature | −40°C to +100°C - qualifies for industrial-grade deployment in factory automation or outdoor equipment |
| I/O Standards | LVCMOS, LVTTL, PCI, HSTL, SSTL - allows direct connection to diverse host processors, memories, and sensors |
| Configuration Mode | Master Serial, Slave SelectMAP, JTAG - provides flexible boot options for field-upgradable or secure systems |
Pinout & Package
XC3S1600E-4FG320I is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size and 1.0 mm ball pitch. The package supports automated reflow assembly and meets JEDEC MO-225 standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2V core supply input - must be filtered and decoupled within 1 cm of the pin |
| P2 | VCCAUX | 2.5V auxiliary supply for configuration and JTAG circuitry |
| A1 | VCCO_0 | 3.3V I/O bank supply for Bank 0 - sets output voltage level and input threshold |
| T14 | PROGRAM_B | Active-low asynchronous reset - initiates configuration reload when asserted |
| R15 | DONE | Open-drain status indicator - goes high-Z after successful configuration completion |
| U13 | CCLK | Configuration clock input - driven by PROM or external source during Master Serial mode |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | Twelve 18×18-bit signed/unsigned multipliers enable real-time FIR filtering or motor control algorithms |
| SelectIO Technology | Per-bank I/O voltage support allows mixed-voltage interfacing (e.g., 3.3V CPU + 1.8V sensor) without level shifters |
| Embedded Memory | 512 Kbits distributed across 32 block RAMs - configurable as dual-port RAM, ROM, or shift register |
| JTAG Boundary Scan | IEEE 1149.1-compliant test access port enables in-system programming and board-level diagnostics |
| Power-Down Mode | Global shutdown reduces static current to <100 µA - extends battery life in portable instrumentation |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between fieldbus (PROFIBUS) and Ethernet-based SCADA systems. IC Role / Device Role / Timing Role: Configurable logic fabric implements custom state machines and timing-critical bus arbitration logic. Use Value: 232 user I/Os allow simultaneous connection to multiple sensor inputs and actuator outputs without glue logic. | Use Scenario: Converting parallel RGB video from legacy display controllers to serialized LVDS or FPD-Link for modern panels. IC Role / Device Role / Timing Role: FPGA acts as pixel-clock domain synchronizer and parallel-to-serial serializer with precise skew control. Use Value: On-chip block RAM buffers full video lines, enabling pixel-rate resampling and format conversion without external memory. |
| Communications Backplane Controller | Test Equipment Pattern Generator |
Use Scenario: Managing time-division multiplexing and error-checking across multiple T1/E1 line cards in telecom chassis. IC Role / Device Role / Timing Role: Implements HDLC framing, CRC-32 calculation, and channelized clock recovery logic. Use Value: 325 MHz system clock supports full-duplex processing of four E1 streams at 2.048 Mbps each. | Use Scenario: Generating programmable digital stimulus waveforms for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: Serves as deterministic pattern sequencer with sub-cycle timing resolution via internal PLL feedback. Use Value: Twelve embedded multipliers accelerate pseudo-random binary sequence (PRBS) generation for jitter tolerance testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG320I | Fewer logic cells (1,092), same package and I/O count - lower gate density but identical footprint and pinout | Suitable for less complex control logic where full 1,584-cell capacity is unused | Select when design fits within reduced resource budget and cost optimization is prioritized |
| XC3S2000-4FG320I | Higher logic capacity (2,128 cells), same package - requires no PCB change but increases power consumption | Needed for designs requiring additional DSP slices or larger on-chip memory buffers | Choose when future scalability or added functionality justifies higher static/dynamic power |
Compared with XC3S1600E-4FG320I, the XC3S1000-4FG320I offers identical mechanical and electrical compatibility at lower logic density, while the XC3S2000-4FG320I provides headroom for feature expansion without layout revision - both preserve the same industrial temperature rating and configuration architecture.
Availability
XC3S1600E-4FG320I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and communications infrastructure requiring stable component supply over extended production lifecycles.
Supply support for XC3S1600E-4FG320I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan FPGA family as part of its adaptive computing portfolio.
The Spartan-3E family was designed for cost-sensitive, high-volume applications demanding reliable programmable logic with integrated memory and I/O flexibility - especially in industrial control and communications edge devices.
FAQ
What is the maximum operating frequency of the XC3S1600E-4FG320I?
The XC3S1600E-4FG320I supports a maximum system clock frequency of 325 MHz under industrial temperature conditions. This value reflects worst-case timing closure for fully utilized logic paths with standard routing and default speed grade (-4). Actual achievable frequency depends on design complexity, placement, and routing constraints - verified through Xilinx ISE timing analysis reports for XC3S1600E-4FG320I implementations.
Does the XC3S1600E-4FG320I support JTAG programming?
Yes, the XC3S1600E-4FG320I includes full IEEE 1149.1 JTAG boundary-scan support for in-system programming, debugging, and board-level testing. The JTAG interface uses dedicated pins TCK, TMS, TDI, TDO, and TREF, and is enabled by default at power-on before configuration completes. Configuration via JTAG is supported alongside Master Serial and Slave SelectMAP modes in the XC3S1600E-4FG320I.
What I/O standards are supported by the XC3S1600E-4FG320I?
The XC3S1600E-4FG320I supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards across its 232 user I/Os. Each I/O bank operates independently with configurable VCCO voltage (1.2V to 3.3V), allowing mixed-voltage operation. These standards are implemented in hardware per pin group and require correct VCCO and termination settings - confirmed in the XC3S1600E-4FG320I DC and switching characteristics datasheet.
Is the XC3S1600E-4FG320I qualified for industrial temperature operation?
Yes, the XC3S1600E-4FG320I is rated for industrial temperature operation from −40°C to +100°C. This specification applies to the "I" speed grade variant and is validated per JEDEC JESD22-A104 thermal cycling and JESD22-A108 high-temperature operating life tests. Thermal derating guidelines and junction temperature limits are documented in the XC3S1600E-4FG320I thermal characteristics section.
How much block RAM does the XC3S1600E-4FG320I contain?
The XC3S1600E-4FG320I contains 512 Kbits of total block RAM, distributed across thirty-two 18-Kbit RAMB16 blocks. Each block can be configured as 16K × 1, 8K × 2, 4K × 4, 2K × 9, or 1K × 18, supporting dual-port read/write operations. This memory is used for on-chip buffering, FIFOs, and lookup tables - all verified in the XC3S1600E-4FG320I configuration and clocking resources documentation.
XC3S1600E-4FG320I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3688
- Number of Logic Elements/Cells:
- 33192
- Total RAM Bits:
- 663552
- Number of I/O:
- 250
- Number of Gates:
- 1600000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1600E-4FG320I FAQ
1.How can I place an order for XC3S1600E-4FG320I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1600E-4FG320I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1600E-4FG320I reliable?
The price and inventory of XC3S1600E-4FG320I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1600E-4FG320I is usually 5 days.
3.What payment methods are accepted for XC3S1600E-4FG320I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1600E-4FG320I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1600E-4FG320I?
XC3S1600E-4FG320I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1600E-4FG320I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1600E-4FG320I?
For technical support, including XC3S1600E-4FG320I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1600E-4FG320I requirements.
6.How does Aetrix verify that XC3S1600E-4FG320I is sourced from the original manufacturer or authorized distributors?
All XC3S1600E-4FG320I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1600E-4FG320I meets industry standards.
7.What is the process for return or replacement of XC3S1600E-4FG320I?
All XC3S1600E-4FG320I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1600E-4FG320I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1600E-4FG320I part is unused and in its original packaging.
Return procedure for XC3S1600E-4FG320I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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