AMD XC3S1600E-4FG400C

Overview

XC3S1600E-4FG400C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,584 logic cells, 128 KB of total block RAM, and 192 user I/Os in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (4.8 ns CLB delay) and supports 3.3V/2.5V/1.2V mixed-voltage I/O banks for industrial control and embedded vision interface applications.

For engineers reviewing the XC3S1600E-4FG400C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded RAM depth per block, global clock routing capability, and supported configuration modes (Master Serial, Slave Parallel, JTAG).

Technical Context

The XC3S1600E-4FG400C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It includes eight global clock networks and supports Digital Clock Managers (DCMs) for input clock multiplication, division, phase shifting, and duty cycle correction.

Configuration is performed via external PROM, processor, or JTAG boundary-scan interface. The device supports IEEE 1149.1 JTAG for programming and debugging, and uses SelectMAP or serial mode for high-speed parallel or serial configuration loading.

Key Specifications

Pinout & Package

XC3S1600E-4FG400C is housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and standard RoHS-compliant lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1000-4FG320C and XC3S2000-4FG456C, the XC3S1600E-4FG400C delivers balanced logic capacity, I/O count, and embedded resources for mid-range reconfigurable systems-avoiding overdesign while maintaining headroom for feature upgrades.

Availability

XC3S1600E-4FG400C is available at Aetrix Electronics and suitable for industrial automation, medical imaging interface, and embedded vision applications requiring stable component supply and long-term manufacturability.

Supply support for XC3S1600E-4FG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.

The Spartan-3E family was designed for non-volatile, low-power, high-I/O-count programmable logic in industrial control, test equipment, and consumer electronics where ASIC economics are prohibitive.

FAQ

What configuration modes does the XC3S1600E-4FG400C support?

The XC3S1600E-4FG400C supports Master Serial, Slave Parallel, and JTAG configuration modes. Master Serial uses an external SPI PROM; Slave Parallel allows a microcontroller to load configuration data; JTAG enables in-system programming and boundary-scan testing. All three modes are implemented in hardware and require no FPGA logic resources. The XC3S1600E-4FG400C datasheet specifies pin assignments and timing for each mode.

Does the XC3S1600E-4FG400C include built-in analog-to-digital conversion capability?

No, the XC3S1600E-4FG400C does not include ADC functionality. It is a digital-only FPGA with configurable logic, block RAM, and clock management resources. Analog signal acquisition must be handled by external ADCs interfaced through its 192 user I/Os. The XC3S1600E-4FG400C supports LVDS and other high-speed I/O standards suitable for connecting to precision ADCs.

What is the maximum operating temperature range for the XC3S1600E-4FG400C?

The XC3S1600E-4FG400C is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating applies to the 'C' speed grade variant and is verified per JEDEC JESD22-A104 thermal cycling and JESD22-A108 high-temperature operating life tests. The XC3S1600E-4FG400C maintains full timing compliance across this range when used with appropriate thermal management.

Can the XC3S1600E-4FG400C be used in automotive applications?

The XC3S1600E-4FG400C is not qualified to AEC-Q100 or ISO 26262 standards and lacks automotive-grade screening, burn-in, or failure rate reporting. While it may function in non-safety-critical automotive environments, AMD does not guarantee performance or longevity under automotive qualification stress profiles. For automotive use, the XC3S1600E-4FG400C is not recommended; consider Xilinx Automotive (XA) variants instead.

How many Digital Clock Managers (DCMs) are integrated into the XC3S1600E-4FG400C?

The XC3S1600E-4FG400C integrates four Digital Clock Managers (DCMs). Each DCM provides clock frequency synthesis, phase shifting, duty cycle correction, and clock doubling or halving. These DCMs operate independently and can drive separate clock domains within the XC3S1600E-4FG400C fabric without external components.