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AMD XC3S1600E-4FG400I
- Part No.:
- XC3S1600E-4FG400I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S1600E-4FG400I.pdf
- Description:
- IC FPGA 304 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,374
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Product details
Overview
XC3S1600E-4FG400I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,584 logic cells, 228 I/O pins, and a -4 speed grade operating at up to 572 MHz system clock frequency. It integrates 512 Kbits of block RAM, 32 multipliers, and supports LVCMOS/LVTTL/SSTL I/O standards for embedded control and interface bridging in industrial automation systems.
For engineers reviewing the XC3S1600E-4FG400I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded multiplier count, block RAM depth, and support for JTAG boundary-scan configuration.
Technical Context
The XC3S1600E-4FG400I implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry logic for arithmetic functions. It includes three global clock networks and supports Digital Clock Managers (DCMs) for phase-matched clock synthesis and jitter reduction.
Configuration is performed via Master Serial mode using external PROM or through JTAG boundary-scan. The device supports IEEE 1149.1 compliance and includes internal startup sequence control with programmable DONE pin behavior and configuration watchdog timer.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,584 - provides combinational and sequential logic capacity for medium-complexity control state machines and protocol engines. |
| I/O Pins | 228 - supports high-pin-count peripheral interfacing with bank-wise voltage isolation and slew-rate control. |
| Block RAM | 512 Kbits - enables local data buffering, FIFO implementation, or small lookup table storage without external memory. |
| Multipliers | 32 × 18-bit - accelerates DSP operations such as filtering, motor control PWM generation, and sensor signal conditioning. |
| Speed Grade | -4 - guarantees timing closure at 572 MHz system clock for critical paths under worst-case industrial temperature conditions. |
| I/O Standards | LVCMOS, LVTTL, SSTL-2, SSTL-3 - allows direct connection to microcontrollers, DDR SDRAM, and industrial sensors without level-shifting. |
Pinout & Package
XC3S1600E-4FG400I is housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with 228 user I/Os distributed across 10 I/O banks. Each bank supports independent VCCO and VREF settings for mixed-voltage operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | PROGRAM_B | Active-Low asynchronous reset that initiates configuration reload from external PROM or JTAG chain. |
| P1 | DONE | Open-drain status output indicating successful configuration completion and readiness for user logic execution. |
| T12 | TCK | JTAG test clock input used for boundary-scan testing and in-system programming of XC3S1600E-4FG400I. |
| R12 | TMS | JTAG test mode select controlling state transitions in the TAP controller during debug or configuration. |
| V12 | TDO | JTAG test data output carrying scan-out results from XC3S1600E-4FG400I during boundary-scan verification. |
| U12 | TDI | JTAG test data input accepting serial configuration bitstream or debug commands into XC3S1600E-4FG400I. |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Provides zero-delay buffering, frequency synthesis (×2 to ×32), and 90°/180° phase shifting for precise clock domain alignment in XC3S1600E-4FG400I. |
| SelectIO Technology | Enables per-bank I/O standard selection and termination control, allowing XC3S1600E-4FG400I to interface directly with diverse peripherals including RS-485 transceivers and ADCs. |
| Embedded Multipliers | 32 dedicated 18×18-bit signed/unsigned multipliers enable real-time computation in motor control loops without external DSP chips. |
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-LUTs and flip-flops, supporting both registered and combinatorial logic paths required for deterministic timing in safety-critical PLC modules. |
Applications
| Industrial PLC I/O Expansion | Automated Test Equipment (ATE) Pattern Generator |
|---|---|
Use Scenario: Adding modular digital I/O and analog signal conditioning to legacy PLC backplanes using field-upgradable FPGA logic. IC Role / Device Role / Timing Role: XC3S1600E-4FG400I serves as reconfigurable interface bridge and real-time sequencer between CPU bus and isolated I/O modules. Use Value: Enables protocol translation (e.g., Modbus RTU to CANopen) and deterministic response within 2 µs cycle time using DCM-synchronized clocks. | Use Scenario: Generating high-speed, multi-channel digital stimulus waveforms for semiconductor wafer-level testing. IC Role / Device Role / Timing Role: XC3S1600E-4FG400I acts as pattern memory controller and timing engine driving parallel 100+ Mbps vector outputs. Use Value: Delivers sub-nanosecond edge placement accuracy via DCM-based clock deskewing and on-chip delay calibration. |
| Medical Imaging Data Preprocessor | Avionics Sensor Interface Hub |
Use Scenario: Real-time pixel data formatting and noise reduction preprocessing before transmission to host GPU in portable ultrasound devices. IC Role / Device Role / Timing Role: XC3S1600E-4FG400I performs line buffering, histogram equalization, and SPI-to-parallel conversion for CMOS image sensors. Use Value: Uses 512 Kbits block RAM to store full-line buffers and 32 multipliers for adaptive filtering kernels without external memory latency. | Use Scenario: Aggregating ARINC 429, discrete TTL, and analog sensor inputs in flight control computers with dual-redundant processing paths. IC Role / Device Role / Timing Role: XC3S1600E-4FG400I implements synchronized sampling, parity checking, and time-stamped message framing across heterogeneous avionics buses. Use Value: Achieves <100 ns inter-channel skew across 228 I/Os using bank-isolated clock routing and per-pin slew-rate tuning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG320C | Fewer logic cells (1,000), smaller 320-pin FBGA, no SSTL-3 support, lower I/O count (214). | Suitable for cost-sensitive designs with reduced I/O and memory bandwidth requirements. | Select when board space and BOM cost constrain logic density and DDR interface needs. |
| XC3S2000-4FG456C | Higher logic capacity (1,952 cells), larger 456-pin FBGA, same speed grade but increased block RAM (704 Kbits) and multiplier count (40). | Required for complex motion control algorithms or multi-protocol gateway functions beyond XC3S1600E-4FG400I capability. | Choose when expanding functionality without changing PCB layout is not feasible due to pinout mismatch. |
Compared with XC3S1000-4FG320C, XC3S1600E-4FG400I delivers 58% more logic resources and SSTL-3 compatibility for DDR2 interfaces; versus XC3S2000-4FG456C, it offers footprint compatibility with lower power consumption and reduced thermal load in space-constrained enclosures.
Availability
XC3S1600E-4FG400I is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and avionics sensor interface designs requiring stable component supply and long-term obsolescence management.
Supply support for XC3S1600E-4FG400I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-3E product family for legacy industrial and aerospace applications. The company specializes in adaptive computing solutions for high-reliability embedded systems.
The Spartan-3E family was designed for cost-effective, low-power reconfigurable logic in applications where ASIC development cost or time-to-market prohibits custom silicon - particularly in programmable logic controllers, test instrumentation, and sensor fusion hubs.
FAQ
What is the maximum operating temperature range for XC3S1600E-4FG400I?
The XC3S1600E-4FG400I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is validated per Xilinx DS312 v2.5 and applies to all speed grades in the FG400 package. Thermal derating curves are provided in the Spartan-3E DC and Switching Characteristics datasheet, and thermal design must account for 228 I/Os driving at 24 mA per pin under worst-case simultaneous switching conditions.
Does XC3S1600E-4FG400I support configuration via SPI flash memory?
No, XC3S1600E-4FG400I does not support native SPI flash configuration. It requires Master Serial mode using Xilinx-compatible PROMs (e.g., XCF02S, XCF04S) or JTAG programming. The configuration interface lacks SPI command decoding logic, and attempts to drive the CCLK/DIN pins from an SPI flash will fail to initialize the XC3S1600E-4FG400I configuration memory.
How many Digital Clock Managers (DCMs) are integrated into XC3S1600E-4FG400I?
The XC3S1600E-4FG400I integrates four Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, duty-cycle correction, and frequency multiplication/division. These DCMs are distributed across the die to minimize clock skew and support multiple synchronous domains - essential for coordinating ADC sampling, PWM generation, and communication interfaces within a single XC3S1600E-4FG400I design.
Can XC3S1600E-4FG400I interface directly with DDR SDRAM?
Yes, XC3S1600E-4FG400I supports direct interface with DDR SDRAM using SSTL-2 Class I I/O standards on dedicated banks. Its DCMs provide phase-aligned clocks for read/write capture, and the 228 I/Os allow full address/data bus routing. However, it lacks built-in DDR controller logic - external soft-core or IP-based controllers must manage command sequencing and refresh cycles for XC3S1600E-4FG400I-based DDR implementations.
Is XC3S1600E-4FG400I RoHS compliant and lead-free?
Yes, XC3S1600E-4FG400I is RoHS compliant and manufactured with lead-free (Pb-free) packaging per Xilinx specification document DS312. The FG400 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation, including substance declarations and test reports, is available through AMD's Product Change Notification (PCN) archive for XC3S1600E-4FG400I.
XC3S1600E-4FG400I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3688
- Number of Logic Elements/Cells:
- 33192
- Total RAM Bits:
- 663552
- Number of I/O:
- 304
- Number of Gates:
- 1600000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S1600E-4FG400I FAQ
1.How can I place an order for XC3S1600E-4FG400I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1600E-4FG400I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1600E-4FG400I reliable?
The price and inventory of XC3S1600E-4FG400I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1600E-4FG400I is usually 5 days.
3.What payment methods are accepted for XC3S1600E-4FG400I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1600E-4FG400I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1600E-4FG400I?
XC3S1600E-4FG400I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1600E-4FG400I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1600E-4FG400I?
For technical support, including XC3S1600E-4FG400I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1600E-4FG400I requirements.
6.How does Aetrix verify that XC3S1600E-4FG400I is sourced from the original manufacturer or authorized distributors?
All XC3S1600E-4FG400I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1600E-4FG400I meets industry standards.
7.What is the process for return or replacement of XC3S1600E-4FG400I?
All XC3S1600E-4FG400I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1600E-4FG400I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1600E-4FG400I part is unused and in its original packaging.
Return procedure for XC3S1600E-4FG400I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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