AMD XC3S1600E-4FG484C

Overview

XC3S1600E-4FG484C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,584 logic cells, 128 KB of block RAM, and a maximum system clock frequency of 322 MHz. It features 376 user I/O pins in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package and supports SelectIO standards including LVCMOS, LVTTL, and SSTL. It is used in industrial control logic and embedded vision preprocessing.

For engineers reviewing the XC3S1600E-4FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic cell count, I/O voltage compatibility, block RAM depth, distributed RAM availability, and JTAG configuration support.

Technical Context

The XC3S1600E-4FG484C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18 multipliers and supports digital clock managers (DCMs) for phase alignment and frequency synthesis.

Configuration is performed via Master Serial mode using external PROM or through JTAG boundary-scan interface. The device supports IEEE 1149.1 compliance and includes internal pull-up resistors on configuration pins.

Key Specifications

Pinout & Package

XC3S1600E-4FG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 array pitch of 1.0 mm, RoHS-compliant lead-free finish, and thermal pad for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1600E-4FG484C, XC3S1000-4FG456C reduces logic capacity and removes arithmetic acceleration, while XC3S2000-4FG484C extends gate budget within identical footprint and timing infrastructure - enabling incremental feature expansion without layout change.

Availability

XC3S1600E-4FG484C is available at Aetrix Electronics and suitable for industrial motion control, embedded vision preprocessing, and communications protocol bridging requiring stable component supply across long-lifecycle production programs.

Supply support for XC3S1600E-4FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.

The Spartan-3E product line was designed for non-volatile, reconfigurable logic in space-constrained industrial and automotive subsystems where ASIC NRE cost and lead time are prohibitive.

FAQ

What is the configuration method supported by XC3S1600E-4FG484C?

The XC3S1600E-4FG484C supports Master Serial configuration via external SPI PROM and JTAG boundary-scan programming. It also accepts Slave Parallel and Slave SelectMAP modes when driven by a microcontroller or processor. Configuration bitstream is loaded into SRAM-based logic cells upon power-up or PROGRAM_B assertion.

Does XC3S1600E-4FG484C include on-chip oscillator for startup clocking?

No, XC3S1600E-4FG484C does not integrate an on-chip oscillator. It relies on external clock sources for configuration and user logic operation. The Digital Clock Managers (DCMs) require a stable input clock - typically supplied by a crystal oscillator or clock generator - to perform frequency synthesis and phase alignment.

What is the operating temperature range for XC3S1600E-4FG484C?

The XC3S1600E-4FG484C is rated for commercial temperature range: 0 °C to +85 °C ambient. This specification applies to the -4 speed grade and FG484 package variant. Thermal derating is required above 70 °C ambient if power dissipation exceeds 1.8 W under typical logic utilization.

Can XC3S1600E-4FG484C interface directly with DDR SDRAM?

Yes, XC3S1600E-4FG484C supports SSTL-2 Class I and II signaling standards, enabling direct connection to DDR SDRAM chips operating at 2.5 V. Proper PCB layout, termination, and DCM-controlled clock routing are required to meet setup/hold timing margins for 133 MHz data rates.

Is XC3S1600E-4FG484C RoHS compliant?

Yes, XC3S1600E-4FG484C is RoHS compliant and manufactured with lead-free solder finish on its 484-ball FBGA package. The device meets Directive 2011/65/EU requirements and carries the appropriate marking per JEDEC J-STD-609A standard for lead-free components.