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AMD XC3S1600E-4FG484I

Part No.:
XC3S1600E-4FG484I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC3S1600E-4FG484I.pdf
Description:
IC FPGA 376 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,829

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Product details

Overview

XC3S1600E-4FG484I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,584 logic cells, 128 KB of total block RAM, and operates at -4 speed grade (1.13 ns CLB delay). It features 376 user I/Os in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package and targets cost-sensitive embedded control and interface bridging applications.

For engineers reviewing the XC3S1600E-4FG484I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, block RAM depth, global clock routing capability, and support for LVCMOS25/LVCMOS33 I/O standards in industrial temperature range.

Technical Context

The XC3S1600E-4FG484I implements a configurable logic fabric based on 4-input LUTs and flip-flops per CLB, with dedicated carry logic for arithmetic. It integrates eight Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction.

I/O banks are independently configurable for voltage standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable slew rate and drive strength. Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan interface.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells1,584 - defines maximum combinational/sequential logic capacity for custom digital functions
Block RAM128 KB - supports FIFOs, buffers, or small lookup tables without external memory
User I/O Pins376 - enables high-pin-count peripheral interfacing and multi-protocol bridging
DCMs8 - provides on-chip clock synthesis and jitter reduction for multiple synchronous domains
Speed Grade-4 - guarantees 1.13 ns CLB propagation delay under industrial temperature conditions
I/O StandardsLVCMOS25/LVCMOS33/LVTTL/PCI/SSTL - allows direct connection to common microcontrollers and memory interfaces
Operating Temp-40°C to +100°C - qualified for industrial environment deployment without derating

Pinout & Package

XC3S1600E-4FG484I is housed in a 484-ball Fine-Pitch BGA (FG484) package with 31 × 31 ball array, 1.0 mm pitch, and 23 mm × 23 mm body size. Thermal pad is exposed on underside for enhanced heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCINT1.2 V core supply input for logic fabric and CLBs
P2VCCAUX2.5 V auxiliary supply for configuration circuitry and DCMs
A1VCCO_03.3 V I/O bank 0 supply - sets output voltage level for associated pins
T14PROGRAM_BActive-low asynchronous reset that clears configuration memory and initiates reload
R15DONEOpen-drain status signal indicating successful configuration completion
U13CCLKConfiguration clock input - controls serial bitstream loading timing

Key Features

FeatureDesign Value
Eight integrated DCMsEnables independent clock domain management without external PLL ICs or crystal oscillators
Multi-standard I/O banksEliminates level-shifter components when interfacing mixed-voltage peripherals
128 KB block RAMSupports dual-port memory access for real-time data buffering in protocol converters
Master Serial configurationReduces BOM count by enabling single SPI PROM boot without microcontroller involvement
JTAG boundary-scan supportAllows in-system programming and IEEE 1149.1-compliant board-level testability

Applications

Industrial PLC I/O ModuleVideo Interface Bridge

Use Scenario: Real-time digital input/output expansion with deterministic scan cycles.

IC Role / Device Role / Timing Role: Configurable logic controller implementing custom state machines and parallel I/O register mapping.

Use Value: 376 user I/Os and deterministic -4 speed grade ensure sub-microsecond response for safety-critical fieldbus timing.

Use Scenario: Converting parallel RGB video signals to serialized LVDS or FPD-Link format.

IC Role / Device Role / Timing Role: Protocol translation engine with pixel-clock domain crossing and embedded sync detection.

Use Value: Eight DCMs enable precise pixel clock multiplication and phase alignment across source and sink domains.

Medical Sensor HubAutomotive Diagnostic Interface

Use Scenario: Aggregating analog sensor data from multiple ADCs and applying real-time filtering before transmission.

IC Role / Device Role / Timing Role: Data preprocessing unit performing FIR filtering and timestamping using block RAM-based coefficient storage.

Use Value: 128 KB block RAM accommodates 256-tap filter coefficients while maintaining full throughput at 20 MSPS sampling rate.

Use Scenario: Translating UART-based diagnostic commands from service tools into CAN FD frames for ECU communication.

IC Role / Device Role / Timing Role: Protocol gateway implementing ISO 15765-2 framing and bit-rate switching logic.

Use Value: Multi-standard I/O banks allow direct connection to both 3.3 V UART controllers and 5 V CAN transceivers without external level shifters.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S1000-4FG456CFewer logic cells (1,088), same -4 speed grade, 456-pin FG package, commercial temp range (0°C to +70°C)Limited I/O count (324) and RAM (96 KB) reduce suitability for high-channel-count sensor aggregationSelect when lower gate count and commercial temperature operation suffice and PCB layout uses FG456 footprint
XC3S2000-4FG484IHigher logic capacity (1,952 cells), same package and industrial temp rating, increased block RAM (192 KB)Enables more complex soft-core processors or larger protocol stacks but increases power and costSelect when XC3S1600E-4FG484I resource margin is insufficient for final firmware feature set

Compared with XC3S1000-4FG456C, the XC3S1600E-4FG484I delivers 46% more logic cells and 33% more block RAM within the same industrial temperature envelope; compared with XC3S2000-4FG484I, it offers verified cost and power savings where full 2K-cell capacity is unused.

Availability

XC3S1600E-4FG484I is available at Aetrix Electronics and suitable for industrial PLC I/O modules, medical sensor hubs, and automotive diagnostic interfaces requiring stable component supply across extended product lifecycles.

Supply support for XC3S1600E-4FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-optimized, high-volume embedded applications.

The Spartan-3E family was designed specifically for high-gate-count, low-cost digital logic replacement in industrial control, communications infrastructure, and consumer electronics where ASIC NRE costs are prohibitive.

FAQ

What is the maximum operating frequency supported by XC3S1600E-4FG484I?

The XC3S1600E-4FG484I has a -4 speed grade specifying a 1.13 ns CLB propagation delay, enabling reliable operation up to 280 MHz for registered logic paths. Actual system frequency depends on design topology, placement, and routing; timing closure must be verified using Xilinx ISE software with the XC3S1600E-4FG484I device model.

Does XC3S1600E-4FG484I support JTAG programming?

Yes, XC3S1600E-4FG484I fully supports IEEE 1149.1 JTAG boundary-scan for in-system programming, debugging, and board-level testing. The TDI, TDO, TMS, and TCK pins are dedicated and electrically compatible with standard JTAG adapters used with Xilinx ISE and Vivado tools.

What configuration modes are available for XC3S1600E-4FG484I?

XC3S1600E-4FG484I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial mode is most commonly used, loading bitstream from external SPI PROM via dedicated CCLK and DIN pins without host processor intervention.

Is XC3S1600E-4FG484I RoHS compliant?

Yes, XC3S1600E-4FG484I is manufactured in accordance with RoHS Directive 2011/65/EU and carries lead-free (Pb-free) packaging. The FG484 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3 requirements.

Can XC3S1600E-4FG484I operate in industrial temperature environments?

Yes, XC3S1600E-4FG484I is rated for -40°C to +100°C ambient operation and is qualified per industrial temperature specifications. This makes it suitable for deployment in motor drives, factory automation systems, and outdoor equipment where thermal cycling and extended temperature ranges are required.

XC3S1600E-4FG484I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3E
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
376
Number of Gates:
1600000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC3S1600E-4FG484I FAQ

1.How can I place an order for XC3S1600E-4FG484I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S1600E-4FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S1600E-4FG484I reliable?

The price and inventory of XC3S1600E-4FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1600E-4FG484I is usually 5 days.

3.What payment methods are accepted for XC3S1600E-4FG484I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1600E-4FG484I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S1600E-4FG484I?

XC3S1600E-4FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S1600E-4FG484I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S1600E-4FG484I?

For technical support, including XC3S1600E-4FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1600E-4FG484I requirements.

6.How does Aetrix verify that XC3S1600E-4FG484I is sourced from the original manufacturer or authorized distributors?

All XC3S1600E-4FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1600E-4FG484I meets industry standards.

7.What is the process for return or replacement of XC3S1600E-4FG484I?

All XC3S1600E-4FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1600E-4FG484I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S1600E-4FG484I part is unused and in its original packaging.

Return procedure for XC3S1600E-4FG484I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S1600E-4FG484I Tags

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