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AMD XC3S1600E-4FGG320C
- Part No.:
- XC3S1600E-4FGG320C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1600E-4FGG320C.pdf
- Description:
- IC FPGA 250 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:364
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Product details
Overview
XC3S1600E-4FGG320C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,584 logic cells, 320-pin Fine-Pitch Ball Grid Array (FBGA) package, -4 speed grade, and commercial temperature range (0°C to 85°C). It integrates SelectIO™ technology, block RAM, and DLLs for embedded control, industrial interface bridging, and low-cost reconfigurable logic applications.
For engineers reviewing the XC3S1600E-4FGG320C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (232 user I/Os), distributed RAM capacity (192 kbits), DLL support for clock deskew, and compatibility with Xilinx ISE Design Suite v14.7 or earlier.
Technical Context
The XC3S1600E-4FGG320C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards across its 232 user-configurable pins.
On-chip clock management uses Digital Clock Managers (DCMs) - not PLLs - providing phase shifting, frequency synthesis (×2 to ×16), and duty cycle correction. Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,584 - total configurable logic resources for combinational/sequential logic implementation |
| User I/O Pins | 232 - supports multi-standard interfaces without external level shifters |
| Block RAM | 576 kbits - organized as 24 × 18-kbit blocks for FIFO, buffer, or lookup table use |
| DCM Units | 4 - each provides input jitter filtering, 0–250 MHz input range, and ±150 ps phase shift resolution |
| Max System Clock | 375 MHz - achievable with DCM feedback and proper PCB layout |
| Supply Voltage | 1.2 V core / 3.3 V I/O - requires dual-rail power delivery with sequencing |
Pinout & Package
XC3S1600E-4FGG320C is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 232 user I/Os, 8 dedicated configuration pins (e.g., INIT_B, PROGRAM_B, DONE), 4 DCM clock inputs, and separate VCCINT/VCCAUX/VCCO supply balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-low configuration initiator | Asserting low resets internal configuration logic and initiates reload from PROM or JTAG |
| INIT_B | Open-drain status indicator | Drives low during configuration and releases high upon successful bitstream load |
| DONE | Configuration completion flag | Driven high by FPGA after configuration completes and I/Os enter three-state before release |
| CLK0–CLK3 | DCM clock inputs | Accept single-ended or differential clocks up to 250 MHz for DCM-based timing control |
| VCCINT | Core voltage supply | Must be regulated to 1.2 V ±3% with low-noise decoupling near package corners |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Enables mixed-voltage I/O banks (1.2 V to 3.3 V) with programmable drive strength and slew rate per pin group |
| Digital Clock Manager (DCM) | Provides deterministic clock deskew, frequency multiplication/division, and 0°–360° phase shift without external components |
| Embedded Multiplier Blocks | Four 18 × 18-bit two's-complement multipliers support DSP-lite functions like FIR filter taps |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops, enabling efficient register-rich designs |
Applications
| Industrial PLC Interface Module | Automated Test Equipment (ATE) Pattern Generator |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation between legacy fieldbus and Ethernet-based controllers. IC Role / Device Role / Timing Role: Configurable logic fabric handles parallel-to-serial conversion, timing-critical handshaking, and error detection logic. Use Value: 232 user I/Os allow direct connection to multiple sensor/actuator channels; DCM ensures synchronized sampling across 16+ digital inputs. | Use Scenario: Generating precise stimulus waveforms and capturing response data at sub-microsecond resolution. IC Role / Device Role / Timing Role: FPGA acts as pattern sequencer and timing engine, driving DACs and sampling ADCs under DCM-controlled clocks. Use Value: 375 MHz system clock capability enables 200+ MHz digital pattern rates; block RAM stores 64k test vectors on-chip. |
| Medical Imaging Data Preprocessor | Avionics Display Interface Bridge |
Use Scenario: Real-time pixel-level filtering and frame buffering prior to GPU-based rendering in portable ultrasound systems. IC Role / Device Role / Timing Role: Implements line buffers using block RAM and applies median filters via LUT-based convolution kernels. Use Value: 576 kbits of block RAM supports full HD (1920×1080@60Hz) line buffering; SelectIO™ interfaces directly with CMOS image sensors. | Use Scenario: Converting ARINC 429 serial avionics data to parallel RGB/TTL video signals for cockpit displays. IC Role / Device Role / Timing Role: Performs protocol decoding, data reformatting, and pixel-clock generation using DCM-synchronized outputs. Use Value: LVCMOS/LVTTL I/O compatibility eliminates level-shifter ICs; 4 DCM units manage independent display and bus clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG320C | 1,000 logic cells, 176 user I/Os, same package and speed grade | Limited resource count reduces maximum concurrent peripheral interfaces | Choose when design fits within smaller logic budget and lower I/O count suffices |
| XC3S2000-4FGG456C | 2,000 logic cells, 456-pin FBGA, higher pin count and density | Requires PCB redesign due to different package and thermal profile | Choose for scalability path requiring >1,584 logic cells and additional I/O banks |
Compared with XC3S1000-4FGG320C and XC3S2000-4FGG456C, the XC3S1600E-4FGG320C offers balanced logic density, I/O count, and package footprint - making it optimal for mid-complexity embedded control where board space and BOM cost are constrained but 1,584 logic cells are fully utilized.
Availability
XC3S1600E-4FGG320C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and avionics subsystems requiring stable component supply and long-term obsolescence planning.
Supply support for XC3S1600E-4FGG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan family as part of its adaptive computing portfolio.
The Spartan-3E FPGA product line was designed for cost-sensitive, high-volume embedded applications requiring reconfigurable logic with integrated I/O and clock management - especially in industrial control and test equipment.
FAQ
What is the maximum operating frequency supported by XC3S1600E-4FGG320C?
The XC3S1600E-4FGG320C supports a maximum system clock frequency of 375 MHz when using Digital Clock Manager (DCM) feedback and optimized placement/routing. This value assumes proper PCB layout, stable 1.2 V core supply, and timing closure achieved in Xilinx ISE Design Suite v14.7. Actual performance depends on design complexity and routing congestion.
Does XC3S1600E-4FGG320C support JTAG programming?
Yes, XC3S1600E-4FGG320C supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. The device uses TCK, TMS, TDI, and TDO pins in the 320-pin FBGA package. JTAG mode enables in-system configuration without external PROM and supports partial reconfiguration in compatible designs.
What I/O standards are supported by XC3S1600E-4FGG320C?
XC3S1600E-4FGG320C supports LVCMOS, LVTTL, PCI, HSTL Class I, and SSTL2 Class I/II I/O standards across its 232 user-configurable pins. Each I/O bank is independently powered (VCCO), allowing mixed-voltage operation. I/O voltage ranges span 1.2 V to 3.3 V, with programmable drive strength and slew rate per pin group.
How many block RAMs does XC3S1600E-4FGG320C contain?
XC3S1600E-4FGG320C contains 24 block RAMs, each 18 kbits in size, totaling 432 kbits of dedicated memory. These are synchronous, true dual-port RAMs usable for FIFOs, buffers, or lookup tables. Distributed RAM from LUTs provides an additional 192 kbits, bringing total on-chip RAM to 624 kbits.
Is XC3S1600E-4FGG320C RoHS compliant?
Yes, XC3S1600E-4FGG320C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The 320-pin FBGA package uses matte tin finish on solder balls. Full compliance documentation, including substance declarations and test reports, is available through AMD's Product Change Notifications (PCNs) and material declarations portal.
XC3S1600E-4FGG320C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3688
- Number of Logic Elements/Cells:
- 33192
- Total RAM Bits:
- 663552
- Number of I/O:
- 250
- Number of Gates:
- 1600000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1600E-4FGG320C FAQ
1.How can I place an order for XC3S1600E-4FGG320C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1600E-4FGG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1600E-4FGG320C reliable?
The price and inventory of XC3S1600E-4FGG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1600E-4FGG320C is usually 5 days.
3.What payment methods are accepted for XC3S1600E-4FGG320C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1600E-4FGG320C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1600E-4FGG320C?
XC3S1600E-4FGG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1600E-4FGG320C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1600E-4FGG320C?
For technical support, including XC3S1600E-4FGG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1600E-4FGG320C requirements.
6.How does Aetrix verify that XC3S1600E-4FGG320C is sourced from the original manufacturer or authorized distributors?
All XC3S1600E-4FGG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1600E-4FGG320C meets industry standards.
7.What is the process for return or replacement of XC3S1600E-4FGG320C?
All XC3S1600E-4FGG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1600E-4FGG320C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1600E-4FGG320C part is unused and in its original packaging.
Return procedure for XC3S1600E-4FGG320C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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