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AMD XC3S1600E-4FGG320I
- Part No.:
- XC3S1600E-4FGG320I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S1600E-4FGG320I.pdf
- Description:
- IC FPGA 250 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,504
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Product details
Overview
XC3S1600E-4FGG320I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,584 logic cells, 228 I/O pins, and 512 Kbits of block RAM, configured in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade and supports 1.2 V core voltage for cost-sensitive industrial control and embedded vision applications.
For engineers reviewing the XC3S1600E-4FGG320I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, available block RAM, speed grade timing closure, and FBGA thermal/mechanical compatibility with existing PCB layouts.
Technical Context
The XC3S1600E-4FGG320I implements a fully configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry chains for arithmetic. It integrates twelve 18×18 multipliers and supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty-cycle correction across up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,584 - determines maximum combinational/sequential logic capacity for custom digital functions |
| I/O Pins | 228 - usable user-defined bidirectional signal interfaces with programmable drive strength and slew rate |
| Block RAM | 512 Kbits - on-chip memory for FIFOs, buffers, or small lookup tables without external memory access |
| Speed Grade | -4 - guarantees maximum operating frequency of 333 MHz for internal logic paths under worst-case conditions |
| Core Voltage | 1.2 V ± 3% - defines power delivery requirements and impacts dynamic power consumption |
| Package | 320-pin FGG (Fine-Pitch BGA) - 19×19 mm body, 0.8 mm pitch, JEDEC MO-237 compliant |
Pinout & Package
XC3S1600E-4FGG320I is housed in a 320-pin Fine-Pitch Ball Grid Array (FGG) package with 19×19 ball array, 0.8 mm pitch, and exposed thermal pad. Pin functions are defined per bank-based I/O standards and include dedicated configuration, clock, and DCM pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain output signaling successful configuration completion to system controller |
| H2 | INIT_B | Active-low open-drain status indicator for configuration initialization and error detection |
| K1 | CCLK | Configuration clock input driving serial bitstream loading from external PROM |
| M1 | DONE | Active-high output confirming full bitstream load and enabling user logic startup |
| P4 | PROGRAM_B | Active-low asynchronous reset initiating reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated 18×18 multipliers | Twelve hardwired arithmetic blocks enable real-time DSP operations without LUT resource overhead |
| Digital Clock Manager (DCM) | Two DCMs provide jitter-reduced clock synthesis, phase alignment, and frequency multiplication/division |
| SelectIO technology | Supports mixed-voltage I/O banks (1.2 V to 3.3 V) with programmable termination and slew control |
| Embedded block RAM | 32 × 16 Kbit dual-port RAM blocks allow simultaneous read/write access for buffering and data staging |
Applications
| Industrial PLC Logic | Machine Vision Preprocessing |
|---|---|
Use Scenario: Real-time ladder logic execution and I/O scanning in compact programmable logic controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implementing deterministic scan cycles with sub-millisecond latency. Use Value: 228 I/O pins support direct connection to sensors, actuators, and HMI interfaces without glue logic. | Use Scenario: Pixel-level filtering and edge detection on camera sensor streams before host CPU transfer. IC Role / Device Role / Timing Role: Parallel pipeline accelerator using LUTs and block RAM for convolution kernels. Use Value: On-chip 512 Kbits RAM enables line-buffering of VGA-resolution frames without external memory bandwidth bottlenecks. |
| Automotive Diagnostic Interface | Protocol Translation Bridge |
Use Scenario: CAN-to-USB gateway in vehicle service tools handling ISO 15765-2 diagnostics. IC Role / Device Role / Timing Role: Dual-role interface controller managing CAN message framing and USB endpoint management. Use Value: SelectIO support for 3.3 V CAN transceivers and 1.2 V USB PHY reduces level-shifting components. | Use Scenario: Bridging RS-485 Modbus RTU to SPI-connected microcontroller in building automation nodes. IC Role / Device Role / Timing Role: Synchronous protocol state machine with configurable baud rate generation and CRC calculation. Use Value: Twelve 18×18 multipliers accelerate CRC-16/32 computation, reducing host processor interrupt load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG320I | 1,000 logic cells, 173 I/O, same package and speed grade | Lower gate count limits complex state machines and larger buffer implementations | Choose when design fits within reduced resources and lower cost is prioritized |
| XC3S2000-4FGG456C | 2,000 logic cells, 304 I/O, 456-pin FBGA, commercial temperature range | Larger I/O count and extended temperature rating not required for industrial ambient use | Choose only if additional logic density or I/O expansion is confirmed necessary |
Compared with XC3S1000-4FGG320I and XC3S2000-4FGG456C, the XC3S1600E-4FGG320I delivers balanced logic density, I/O count, and industrial temperature support in a widely deployed 320-pin footprint-making it optimal for mid-complexity embedded control where thermal and board-space constraints apply.
Availability
XC3S1600E-4FGG320I is available at Aetrix Electronics and suitable for industrial PLC logic, machine vision preprocessing, and automotive diagnostic interface applications requiring stable component supply and long-term manufacturability.
Supply support for XC3S1600E-4FGG320I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines.
The Spartan-3E family was originally designed by Xilinx for cost-optimized, high-volume embedded applications requiring moderate logic density and flexible I/O.
FAQ
What is the operating temperature range for XC3S1600E-4FGG320I?
The XC3S1600E-4FGG320I is rated for industrial temperature operation from –40 °C to +100 °C junction temperature. This range is validated per Xilinx DS312 specification and supports deployment in factory automation, motor drives, and outdoor embedded systems without forced cooling.
Does XC3S1600E-4FGG320I support JTAG configuration?
Yes, XC3S1600E-4FGG320I supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. The TCK, TMS, TDI, and TDO pins are assigned to dedicated package balls and enable in-system configuration without external PROM.
How many Digital Clock Managers (DCMs) does XC3S1600E-4FGG320I include?
The XC3S1600E-4FGG320I includes two fully functional Digital Clock Managers (DCMs). Each DCM provides input clock doubling, phase shifting, duty-cycle correction, and frequency synthesis-enabling precise clock domain management for multi-rate designs.
Is XC3S1600E-4FGG320I pin-compatible with other Spartan-3E devices in the FGG320 package?
XC3S1600E-4FGG320I shares the same 320-pin FGG package footprint with XC3S500E-4FGG320I and XC3S1000-4FGG320I, but pin functions differ across densities due to varying I/O bank allocations and dedicated resource placement. PCB layout reuse requires verification of each signal's bank assignment and voltage compliance.
What configuration modes are supported by XC3S1600E-4FGG320I?
XC3S1600E-4FGG320I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial is most common, using CCLK and DIN to load bitstream from external SPI PROM; JTAG is used for development and field updates.
XC3S1600E-4FGG320I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3688
- Number of Logic Elements/Cells:
- 33192
- Total RAM Bits:
- 663552
- Number of I/O:
- 250
- Number of Gates:
- 1600000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S1600E-4FGG320I FAQ
1.How can I place an order for XC3S1600E-4FGG320I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1600E-4FGG320I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1600E-4FGG320I reliable?
The price and inventory of XC3S1600E-4FGG320I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1600E-4FGG320I is usually 5 days.
3.What payment methods are accepted for XC3S1600E-4FGG320I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1600E-4FGG320I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1600E-4FGG320I?
XC3S1600E-4FGG320I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1600E-4FGG320I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1600E-4FGG320I?
For technical support, including XC3S1600E-4FGG320I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1600E-4FGG320I requirements.
6.How does Aetrix verify that XC3S1600E-4FGG320I is sourced from the original manufacturer or authorized distributors?
All XC3S1600E-4FGG320I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1600E-4FGG320I meets industry standards.
7.What is the process for return or replacement of XC3S1600E-4FGG320I?
All XC3S1600E-4FGG320I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1600E-4FGG320I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1600E-4FGG320I part is unused and in its original packaging.
Return procedure for XC3S1600E-4FGG320I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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