My Inquiry
My Account
AMD XC3S1600E-4FGG400C
- Part No.:
- XC3S1600E-4FGG400C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S1600E-4FGG400C.pdf
- Description:
- IC FPGA 304 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,959
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S1600E-4FGG400C from AMD (formerly Xilinx) is a Spartan-3E family FPGA with 1,584 logic cells, 512 Kbits of block RAM, and 128 user I/Os in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade and supports 3.3V/2.5V/1.2V mixed-voltage I/O banks for industrial control and embedded vision interface applications.
For engineers reviewing the XC3S1600E-4FGG400C datasheet, pinout, applications, or equivalent options, key selection criteria include logic cell count, I/O voltage flexibility, block RAM depth, and supported configuration modes (Master Serial, Slave SelectMAP).
Technical Context
The XC3S1600E-4FGG400C implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18 multipliers and supports DDR SDRAM interfaces up to 333 Mbps.
Configuration is performed via external SPI PROM or JTAG boundary-scan; internal startup sequence includes power-on reset and mode pin sampling. The device supports IEEE 1149.1 JTAG for programming and debugging.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,584 - defines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 512 Kbits - supports FIFOs, buffers, or small lookup tables without external memory |
| User I/O Pins | 128 - configurable across 8 I/O banks with independent voltage support (1.2V–3.3V) |
| Max System Clock | 375 MHz - enables high-speed synchronous logic implementation |
| Multipliers | 12 × 18×18 - accelerates DSP operations including filtering and motor control algorithms |
| Configuration Mode | Master Serial, Slave SelectMAP, JTAG - determines boot source and programming interface flexibility |
Pinout & Package
XC3S1600E-4FGG400C is housed in a 400-ball Fine-Pitch BGA (FBGA) package with 1.0 mm ball pitch, RoHS-compliant, and thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2V core supply input - must be filtered and decoupled near the ball |
| A2, A3 | PROGRAM_B / INIT_B | Active-low configuration control signals - PROGRAM_B resets config memory; INIT_B indicates config status |
| D1, D2 | TCK / TMS | JTAG test clock and mode select - required for boundary-scan and ISP programming |
| H1, H2 | CCLK / DONE | Configuration clock output and completion indicator - DONE goes high when config is valid |
| P1–P10 | IO_LxxN/IO_LxxP | Differential I/O pairs - support LVDS, RSDS, and TMDS signaling with internal termination |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Digital Clock Managers (DCMs) | Four DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication/division |
| SelectIO Technology | Supports 18 I/O standards including LVCMOS, LVTTL, PCI, and differential LVDS with programmable drive strength |
| Embedded Multipliers | Twelve 18×18 signed multipliers enable real-time DSP without external coprocessors |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops - optimized for pipelined data paths |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo positioning using encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric implements PID controller, pulse-width modulator, and quadrature decoder logic. Use Value: Deterministic latency under 200 ns and 128 I/Os allow direct connection to motor drivers and encoders. | Use Scenario: Converting HDMI 1.3a video streams to parallel RGB+HV sync for LCD panel driving. IC Role / Device Role / Timing Role: Timing-critical pixel re-timing, color space conversion, and format adaptation logic. Use Value: Embedded DCMs stabilize pixel clocks; SelectIO supports TMDS input and LVCMOS output simultaneously. |
| Medical Imaging Front-End | Programmable Logic Test Equipment |
Use Scenario: Digitizing and preprocessing ultrasound echo data before transmission to host processor. IC Role / Device Role / Timing Role: High-speed ADC interface, FIR filter pipeline, and DMA controller for burst data transfer. Use Value: 512 Kbits block RAM stores filter coefficients and intermediate samples; 375 MHz clock enables real-time processing. | Use Scenario: Emulating ASIC behavior during board-level functional test of legacy systems. IC Role / Device Role / Timing Role: Reconfigurable stimulus generator and response analyzer with precise timing alignment. Use Value: 1,584 logic cells support multi-cycle test patterns; JTAG access enables in-system verification without fixture changes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG400C | 1,000 logic cells, 360 Kbits block RAM - smaller resource footprint | Suitable for lower-gate-count designs with identical I/O and package compatibility | Select when design fits within reduced logic and memory resources to lower cost and power |
| XC3S2000-4FGG400C | 2,000 logic cells, 720 Kbits block RAM - higher density with same pinout | Enables more complex control algorithms or additional peripheral interfaces in same PCB layout | Choose for future-proofing or when incremental logic growth is anticipated |
Compared with XC3S1000-4FGG400C and XC3S2000-4FGG400C, the XC3S1600E-4FGG400C offers balanced logic density and memory for mid-complexity embedded control, with identical FBGA-400 packaging enabling shared PCB footprint and thermal design.
Availability
XC3S1600E-4FGG400C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging front-end, and programmable test equipment requiring stable component supply and long-term design-in support.
Supply support for XC3S1600E-4FGG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-3E product line for legacy industrial and embedded FPGA applications.
The Spartan-3E family was designed for cost-sensitive, high-volume applications requiring moderate logic density, low static power, and flexible I/O interfacing - especially where ASIC development cost or time is prohibitive.
FAQ
What is the maximum operating temperature range for XC3S1600E-4FGG400C?
The XC3S1600E-4FGG400C is rated for commercial temperature range (0°C to +85°C). This specification applies to the C-grade version indicated by the final 'C' in the part number. Thermal derating is required above 70°C ambient if power dissipation exceeds 1.2 W under typical logic utilization.
Does XC3S1600E-4FGG400C support JTAG boundary-scan testing?
Yes, XC3S1600E-4FGG400C fully supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and interconnect testing. Pins TCK, TMS, TDI, and TDO are dedicated to this function and operate independently of configuration mode selection.
Can XC3S1600E-4FGG400C configure from serial NOR flash?
Yes, XC3S1600E-4FGG400C supports Master Serial configuration mode, which allows automatic loading of bitstream from standard 4-wire SPI NOR flash devices such as Spansion S25FL series or Micron N25Qxxx parts upon power-up.
What I/O standards are supported by XC3S1600E-4FGG400C?
XC3S1600E-4FGG400C supports 18 I/O standards including LVCMOS 3.3/2.5/1.8/1.5/1.2 V, LVTTL, PCI, HSTL Class I/II, SSTL2 Class I/II, and differential standards like LVDS, RSDS, and BLVDS - all configurable per bank.
Is XC3S1600E-4FGG400C pin-compatible with other Spartan-3E devices in FG400 package?
Yes, XC3S1600E-4FGG400C shares identical FBGA-400 pinout with XC3S500E-4FGG400C, XC3S1000-4FGG400C, and XC3S2000-4FGG400C. Power and configuration pins are fixed; I/O assignments differ only in unused banks, enabling scalable design reuse.
XC3S1600E-4FGG400C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3688
- Number of Logic Elements/Cells:
- 33192
- Total RAM Bits:
- 663552
- Number of I/O:
- 304
- Number of Gates:
- 1600000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S1600E-4FGG400C FAQ
1.How can I place an order for XC3S1600E-4FGG400C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1600E-4FGG400C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1600E-4FGG400C reliable?
The price and inventory of XC3S1600E-4FGG400C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1600E-4FGG400C is usually 5 days.
3.What payment methods are accepted for XC3S1600E-4FGG400C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1600E-4FGG400C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1600E-4FGG400C?
XC3S1600E-4FGG400C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1600E-4FGG400C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1600E-4FGG400C?
For technical support, including XC3S1600E-4FGG400C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1600E-4FGG400C requirements.
6.How does Aetrix verify that XC3S1600E-4FGG400C is sourced from the original manufacturer or authorized distributors?
All XC3S1600E-4FGG400C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1600E-4FGG400C meets industry standards.
7.What is the process for return or replacement of XC3S1600E-4FGG400C?
All XC3S1600E-4FGG400C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1600E-4FGG400C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1600E-4FGG400C part is unused and in its original packaging.
Return procedure for XC3S1600E-4FGG400C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S1600E-4FGG400C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
